Reducing dusting of epoxy laminates
View Patent ↗Epoxy laminates, e.g. CEM-1 laminates, include polymeric particles, particularly core-shell particles having an average diameter of about 0.05 to 30 μm, which reduce the dust produced during manufacture of printed circuit boards.
1. A method of reducing dust formation during manufacture of printed circuit boards from metal foil clad epoxy resin containing insulating substrates incorporating in an insulating substrate more than zero and up to 25 wt. % of polymeric particles having an average diameter of about 0.05 to 30 μm.
2. The method of claim 1 wherein said particles have an average diameter of about 0.05 to 5 μm.
3. The method of claim 1 wherein said polymeric particles are core-shell particles.
4. The method of claim 3 wherein said metal foil clad epoxy resin containing insulating substrates further comprise inorganic filler particles.
5. The method of claim 3 wherein said core-shell particles comprise a core of butadiene polymer and a shell of methacrylate polymer.
6. The method of claim 5 wherein about 3 to about 20 wt. % of said particles are added to epoxy resin and cured to form an insulating substrate.
7. The method of claim 6 wherein said epoxy resin containing said particles is applied to paper reinforcing material, cured, and used in manufacture of said printed circuit boards.
8. The method of claim 7 wherein said cured paper reinforcing material containing said epoxy resin is covered with glass fiber reinforced epoxy resin outer layers.
9. The method of claim 8 wherein said cured paper reinforcing material containing epoxy resin and covered with said outer layers of glass fiber reinforced epoxy resin is CEM-1.
10. A laminate for use in printed circuit boards comprising an insulating substrate comprising paper coated with cured epoxy resin containing more than zero and up to 25 wt. % of polymeric particles having an average diameter of about 0.05 to 30 μm and covered with glass fiber reinforced epoxy resin.
11. The laminate of claim 10 wherein said particles have an average diameter of about 0.05 to 5 μm.
12. The laminate of claim 10 wherein said polymeric particles are core-shell particles.
13. The laminate of claim 12 wherein said core-shell particles comprise a core of butadiene polymer and a shell of methacrylate polymer.
14. The laminate of claim 12 further comprising inorganic filler particles.
15. The laminate of claim 10 wherein said cured epoxy resin contains about 3 to about 20 wt. % of said polymeric particles.
16. The laminate of claim 10 further comprising a copper foil and designated CEM-1.