Reducing dusting of epoxy laminates
View Patent ↗Epoxy laminates, e.g. CEM-1 laminates, include polymeric particles, particularly core-shell particles having an average diameter of about 0.05 to 30 μm, which reduce the dust produced during manufacture of printed circuit boards.
1. A laminate comprising a substrate impregnated with at least one epoxy resin including more than zero and up to 25 wt. % of polymeric particles having an average diameter of about 0.05 to 30 μm.
2. The laminate of claim 1 wherein said polymeric particles have an average diameter of about 0.05 to 5 μm.
3. The laminate of claim 1 wherein said polymeric particles are core-shell particles.
4. The laminate of claim 3 wherein the epoxy resin includes inorganic filler particles.
5. The laminate of claim 3 wherein said core-shell particles comprise a core of butadiene polymer and a shell of methacrylate polymer.
6. The laminate of claim 5 including from about 3 to about 20 wt. % of the polymeric particles.
7. The laminate of claim 1 wherein the substrate is a paper reinforcing material.
8. The laminate of claim 1 wherein the substrate is glass fiber.
9. The laminate of claim 1 wherein a layer of copper foil is applied to at least one laminate surface.
10. The laminate of claim 1 wherein the epoxy resin is CEM-1.
11. The laminate or claim 1 wherein the laminate is B-staged.