IP Library Granted Patent US 9,824,759
Granted Patent B2
US 9,824,759 · App. 14/609,072 · Granted Nov 21, 2017

Non-volatile memory devices, memory systems, and methods of operating the same

Inventors: Dae-woong Kwon (Seoul, KR); Jai-hyuk Song (Seongnam-si, KR); Chang-sub Lee (Osan-si, KR)
Assignee: Samsung Electronics Co., Ltd.
G11C16/10G11C16/0483
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Quick Facts
Patent No.
US 9,824,759
App. No.
14/609,072
Granted
Nov 21, 2017
Kind
B2
Abstract

In a method of programming a non-volatile memory device, a first voltage is applied to a selected memory cell for programming, and a second voltage is applied to a non-selected memory cell. Before the second voltage rises to a predetermined voltage level, which is less than a program voltage level, the first voltage is greater than the second voltage or the second voltage is maintained at greater than a ground voltage level. Related non-volatile memory devices and memory systems are also discussed.

Claims (36)

1. An operating method of a non-volatile memory device, the operating method comprising:

applying a first voltage to a first word line connected with a first cell to be programmed;

applying a second voltage to a second word line connected with a second cell not to be programmed;

applying a third voltage to a third word line connected with a third cell not to be programmed;

increasing a level of the first voltage and a level of the third voltage to a first level;

increasing and maintaining a level of the second voltage from a level different than the first level to a second level corresponding to a pass voltage after the level of the first voltage and the level of the third voltage rise to the first level; and then

increasing the level of the first voltage from the first level to a program voltage level after the level of the second voltage rises to the second level,

wherein the second cell is between the first cell and a ground selection transistor, wherein the third cell is between the first cell and a string selection transistor, and

wherein a transition of the level of the second voltage is controlled independently from a transition of the level of the third voltage.

2. The operating method of claim 1 , wherein the non-volatile memory device comprises a memory cell array having three-dimensional (3D) NAND (VNAND) memory cells.

3. The operating method of claim 1 , wherein, after the level of the second voltage rises to the first level, the level of the first voltage rises to the program voltage level.

4. The operating method of claim 1 , wherein the first cell and the second cell are connected between the bit line and the ground selection line, wherein the first cell is adjacent to the bit line, and wherein the second cell is adjacent to the ground selection line.

5. The operating method of claim 1 , further comprising, before increasing the level of the first voltage to the first level, maintaining the level of the first voltage at a third level having a value between a ground voltage and the first level.

6. The operating method of claim 5 , further comprising:

transitioning the level of the first voltage from the third level to the ground voltage level,

wherein the level of the first voltage rises from the ground voltage level to the first level.

7. The operating method of claim 1 , further comprising:

maintaining the level of the second voltage at a third level having a value between a ground voltage level and the first level, and

wherein, after the level of the first voltage rises to the first level, the level of the second voltage rises from the third level to the first level.

8. The operating method of claim 1 , wherein the level of the second voltage rises after the first cell is turned on such that a variation of a threshold voltage of the first cell due to hot carrier injection (HCI) is decreased.

9. The method of claim 1 , wherein a time of the transition of the level of the second voltage is different from a time of the transition of the level of the third voltage.

10. A method of operating a non-volatile memory device, the method comprising:

in a programming operation, applying a first voltage and a second voltage to a selected memory cell for programming and a first non-selected memory cell, respectively, and in the programming operation, applying a third voltage to a second non-selected memory cell,

wherein, before a level of the second voltage and a level of the third voltage rise to a predetermined voltage level that is less than a program voltage level but is sufficient to turn on the first and the second non-selected memory cells, a level of the second voltage is maintained at an intermediate voltage level greater than a ground level while the level of the first voltage and the level of the third voltage are maintained at the ground level,

wherein, after the first, second, and third voltages are maintained for a predetermined time, the levels of the first and third voltages simultaneously rise to the predetermined voltage level,

wherein the level of the first voltage is increased from the predetermined voltage level to a program voltage level after the level of the first, second, and third voltages rise to the predetermined voltage level, and

wherein the first non-selected memory cell is between the selected memory cell and a ground selection transistor, wherein the second non-selected memory cell is between the selected memory cell and a string selection transistor.

11. The method of claim 10 , wherein the level of the first voltage rises to the predetermined voltage level before the level of the second voltage rises to the predetermined voltage level.

12. The method of claim 10 , wherein the level of the first voltage is maintained at an intermediate voltage level less than the predetermined voltage level but sufficient to turn on the selected memory cell before the level of the second voltage rises to the predetermined voltage level.

13. The method of claim 10 , wherein, before the level of the second voltage rises to the predetermined voltage level, the level of the second voltage is maintained at the intermediate voltage level that is less than the predetermined voltage level such that a rise time for the second voltage defines a step function.

14. The method of claim 13 , wherein the intermediate voltage level is greater than the ground level but is insufficient to turn on the first non-selected memory cell.

15. The method of claim 10 ,

wherein the level of the third voltage rises to the predetermined voltage level before or after the level of the second voltage rises to the predetermined voltage level.

16. The method of claim 10 , wherein, during the programming operation for the selected memory cell, the level of the first voltage rises to the predetermined voltage level after the level of the second voltage rises to the predetermined voltage level and before the first voltage rises to the program voltage level.

17. The method of claim 16 , wherein, after the level of the second voltage rises to the predetermined voltage level and before the level of the first voltage rises to the predetermined voltage level, the level of the first voltage is decreased to the ground voltage level.

18. The method of claim 10 , wherein a time of a transition of the level of the second voltage is different from a time of a transition of the level of the third voltage.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 29, 2015
From: KWON, DAE-WOONG; SONG, JAI-HYUK; LEE, CHANG-SUB
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 034847/0240 →
Priority Claims (1)
KR 10-2014-0016287 · Feb 12, 2014 · national
Continuity (1)
Related Publication 20150228345A1 · Aug 13, 2015