System for cooling hybrid vehicle electronics, method for cooling hybrid vehicle electronics
The invention provides a single radiator cooling system for use in hybrid electric vehicles, the system comprising a surface in thermal communication with electronics, and subcooled boiling fluid contacting the surface. The invention also provides a single radiator method for simultaneously cooling electronics and an internal combustion engine in a hybrid electric vehicle, the method comprising separating a coolant fluid into a first portion and a second portion; directing the first portion to the electronics and the second portion to the internal combustion engine for a time sufficient to maintain the temperature of the electronics at or below 175° C.; combining the first and second portion to reestablish the coolant fluid; and treating the reestablished coolant fluid to the single radiator for a time sufficient to decrease the temperature of the reestablished coolant fluid to the temperature it had before separation.
1. A single radiator method for simultaneously cooling electronics and an internal combustion engine in hybrid electric vehicles, the method comprising:
a) separating a coolant fluid into a first portion and a second portion;
b) directing the first portion to the electronics and the second portion to the internal combustion engine for a time sufficient to maintain the temperature of the electronics at or below 175° C.;
c) combining the first and second portion to reestablish the coolant fluid; and
d) treating the reestablished coolant fluid to the single radiator for a time sufficient to decrease the temperature of the reestablished coolant fluid to approximately the same temperature it was at when first separated into a first portion and a second portion, wherein the fluid is a subcooled boiling fluid.
2. The method as recited in claim 1 wherein the fluid is a liquid selected from the group consisting of ethylene glycol, propylene glycol, water, polyalphaolefin, and combinations thereof.
3. A single radiator method for simultaneously cooling electronics and an internal combustion engine in hybrid electric vehicles, the method comprising:
a) separating a coolant fluid into a first portion and a second portion;
b) directing the first portion to the electronics and the second portion to the internal combustion engine for a time sufficient to maintain the temperature of the electronics at or below 175° C.;
c) combining the first and second portion to reestablish the coolant fluid; and
d) treating the reestablished coolant fluid to the single radiator for a time sufficient to decrease the temperature of the reestablished coolant fluid to approximately the same temperature it was at when first separated into a first portion and a second portion, wherein the electronics are maintained at a current power density of between approximately 100 W/cm 2 and approximately 250 W/cm 2 .
4. The method as recited in claim 1 wherein the step of directing the first portion to the electronics comprises flowing the first portion through a single fluid passage defining a heat exchange surface of the electronics.
5. The method as recited in claim 3 wherein the electronics are in thermal communication with a plurality of heat exchange surfaces and the first portion simultaneously contacts said plurality of surfaces.
6. The method as recited in claim 3 wherein the fluid is a liquid selected from the group consisting of ethylene glycol, propylene glycol, water, polyalphaolefin, and combinations thereof.
7. The method as recited in claim 3 wherein the coolant fluid is maintained at a pressure of between approximately 0 psig and approximately 45 psig.
8. The method as recited in claim 3 wherein the coolant fluid remains in liquid phase when not in contact with heat sinks defining surfaces of the electronics.
9. The method as recited in claim 1 wherein the coolant fluid is maintained at a pressure of between approximately 0 psig and approximately 45 psig.
10. The method as recited in claim 1 wherein coolant fluid remains in liquid phase when not in contact with heat sinks defining surfaces of the electronics.