Hybrid-integrated multi-chip module
A multi-chip module (MCM) is described. This MCM includes a driver integrated circuit that includes electrical circuits, a photonic chip, an interposer, and an optical gain chip. The photonic chip may be implemented using a silicon-on-insulator technology, and may include an optical waveguide that conveys an optical signal and traces that are electrically coupled to the driver integrated circuit. Moreover, the interposer may be electrically coupled to the traces. Furthermore, the optical gain chip may include a III/V compound semiconductor (and, more generally, a semiconductor other than silicon), and may include a second optical waveguide that conveys the optical signal and that is vertically aligned with the optical waveguide relative to a top surface of the interposer. Additionally, the optical gain chip may be electrically coupled to the interposer.
1. A multi-chip module (MCM), comprising:
a driver integrated circuit having a top surface, wherein the driver integrated circuit includes electrical circuits;
a photonic chip, wherein the photonic chip includes:
a substrate;
a buried-oxide (BOX) layer disposed on the substrate; and
a semiconductor layer, wherein an optical waveguide is defined in the BOX layer and the semiconductor layer, and
wherein traces disposed on the semiconductor layer face and are electrically coupled to the top surface of the driver integrated circuit;
an interposer having a top surface, wherein the top surface of the interposer faces and is electrically coupled to the traces; and
an optical gain chip, wherein the optical gain chip includes a second substrate,
wherein a second optical waveguide is defined in the second substrate,
wherein the second optical waveguide is vertically aligned with the optical waveguide relative to the top surface of the interposer, and
wherein the second substrate faces and is electrically coupled to the top surface of the interposer.
2. The MCM of claim 1 , wherein the MCM includes a spacer disposed on the top surface of the interposer so that the second optical waveguide is vertically aligned with the optical waveguide.
3. The MCM of claim 2 , wherein the spacer includes one of: a metal, a polymer and a resin.
4. The MCM of claim 1 , wherein the optical gain chip includes an optical spot-size converter that, during operation, transitions a spot size of an optical mode in the optical waveguide to a second spot size of a second optical mode in the second optical waveguide.
5. The MCM of claim 1 , wherein the photonic chip includes an optical spot-size converter that, during operation, transitions a spot size of an optical mode in the optical waveguide to a second spot size of a second optical mode in the second optical waveguide.
6. The MCM of claim 1 , wherein the second substrate is a semiconductor other than silicon.
7. The MCM of claim 1 , wherein the second substrate includes a III/V compound semiconductor.
8. The MCM of claim 1 , wherein the optical gain chip is one of: a semiconductor optical amplifier; and a laser.
9. The MCM of claim 1 , wherein the substrate, the BOX layer and the semiconductor layer constitute a silicon-on-insulator technology.
10. The MCM of claim 1 , wherein the photonic chip includes an optical fiber coupler, which can optically couple to an optical fiber.
11. The MCM of claim 10 , wherein the MCM includes the optical fiber optically coupled to the optical fiber coupler.
12. A system, comprising:
a processor;
a memory, coupled to the processor, which stores a program module, and which, during operation, is executed by the processor; and
an MCM, wherein the MCM includes:
a driver integrated circuit having a top surface, wherein the driver integrated circuit includes electrical circuits;
a photonic chip, wherein the photonic chip includes:
a substrate;
a buried-oxide (BOX) layer disposed on the substrate; and
a semiconductor layer, wherein an optical waveguide is defined in the BOX layer and the semiconductor layer, and
wherein traces disposed on the semiconductor layer face and are electrically coupled to the top surface of the driver integrated circuit;
an interposer having a top surface, wherein the top surface of the interposer faces and is electrically coupled to the traces; and
an optical gain chip, wherein the optical gain chip includes a second substrate,
wherein a second optical waveguide is defined in the second substrate,
wherein the second optical waveguide is vertically aligned with the optical waveguide relative to the top surface of the interposer, and
wherein the second substrate faces and is electrically coupled to the top surface of the interposer.
13. The system of claim 12 , wherein the MCM includes a spacer disposed on the top surface of the interposer so that the second optical waveguide is vertically aligned with the optical waveguide.
14. The system of claim 12 , wherein the optical gain chip includes an optical spot-size converter that, during operation, transitions a spot size of an optical mode in the optical waveguide to a second spot size of a second optical mode in the second optical waveguide.
15. The system of claim 12 , wherein the photonic chip includes an optical spot-size converter that, during operation, transitions a spot size of an optical mode in the optical waveguide to a second spot size of a second optical mode in the second optical waveguide.
16. The system of claim 12 , wherein the second substrate is a semiconductor other than silicon.
17. The system of claim 12 , wherein the optical gain chip is one of: a semiconductor optical amplifier; and a laser.
18. The system of claim 12 , wherein the substrate, the BOX layer and the semiconductor layer constitute a silicon-on-insulator technology.
19. The system of claim 12 , wherein the photonic chip includes an optical fiber coupler; and
wherein the MCM includes the optical fiber optically coupled to the optical fiber coupler.
20. A method for outputting an optical signal, comprising:
providing an electrical signal from a driver integrated circuit to a photonic chip, wherein a top surface of the driver integrated circuit faces and is electrically coupled to a trace disposed on a semiconductor layer in the photonic chip,
wherein the photonic chip includes a substrate, a buried-oxide (BOX) layer disposed on the substrate, and the semiconductor layer disposed on the BOX layer, and
wherein an optical waveguide is defined in the BOX layer and the semiconductor layer;
conveying the electrical signal in the trace in the photonic chip;
providing the electrical signal from the photonic chip to an interposer, wherein a top surface of the interposer faces and is electrically coupled to the trace;
conveying the electrical signal in the interposer;
providing the electrical signal from the interposer to an optical gain chip, wherein the optical gain chip includes a second substrate that faces and is electrically coupled to the top surface of the interposer;
generating the optical signal in the optical gain chip based on the electrical signal;
conveying the optical signal in a second optical waveguide defined in the second substrate;
optically coupling the optical signal from the second optical waveguide to the optical waveguide, which is vertically aligned with the second optical waveguide relative to the top surface of the interposer; and
outputting the optical signal in an optical fiber that is optically coupled to the optical waveguide.