Light emitting device package, backlight unit, illumination apparatus, and method of manufacturing light emitting device package
Disclosed herein are a light emitting device package, a backlight unit, an illumination apparatus, and a method of manufacturing a light emitting device package capable of being used for a display application or an illumination application. The light emitting device package includes: a flip-chip type light emitting device having a first terminal and a second terminal installed therebeneath; a substrate having a first electrode formed at one side of an electrode separating space and a second electrode formed at the other side thereof; a first conductive bonding member installed on the first electrode of the substrate so as to be electrically connected to the first terminal of the light emitting device; a second conductive bonding member installed on the second electrode of the substrate so as to be electrically connected to the second terminal of the light emitting device; a reflection encapsulant molded and installed on the substrate so as to form a reflection cup part reflecting light generated in the light emitting device and filled in the electrode separating space to form an electrode separating part; and a filler filled between the reflection cup part and the first and second conductive bonding members.
1. A light emitting device package comprising:
a light emitting device including a first terminal and a second terminal;
a substrate including a first electrode formed at one side of an electrode separating space and a second electrode formed at the other side of the electrode separating space;
a first conductive bonding member installed on the first electrode of the substrate so as to be electrically connected to the first terminal of the light emitting device;
a second conductive bonding member installed on the second electrode of the substrate so as to be electrically connected to the second terminal of the light emitting device;
a reflection encapsulant installed on the substrate so as to form a reflection cup part configured to reflect light generated in the light emitting device and filled in the electrode separating space to form an electrode separating part; and
a filler filled between the reflection cup part and the first and second conductive bonding members,
wherein the first terminal of the light emitting device includes:
a reinforcing metal layer installed to be close to the light emitting device and formed of a conductive material having a first elongation percentage; and
a buffering metal layer installed beneath the reinforcing metal layer and formed of a conductive material having a second elongation percentage higher than the first elongation percentage.
2. The light emitting device package of claim 1 , wherein the reflection encapsulant is formed of a white epoxy molding compound (EMC) or a silicon molding compound (SMC) corresponding to a thermosetting resin having a coefficient of thermal expansion that is in 80% of a coefficient of thermal expansion of the substrate.
3. The light emitting device package of claim 1 , wherein the first conductive bonding member is a first solder cream installed on the first electrode of the substrate so as to be electrically connected to the first terminal of the light emitting device and mixed with a liquid-phase solvent to have a dotting viscosity so as to be dotted by a dotting pin, and
the second conductive bonding member is a second solder cream installed on the second electrode of the substrate so as to be electrically connected to the second terminal of the light emitting device and mixed with a liquid-phase solvent to have a dotting viscosity so as to be dotted by a dotting pin.
4. The light emitting device package of claim 1 , wherein the electrode separating part has a height higher than that of the substrate.
5. The light emitting device package of claim 1 , wherein the filler is formed of one or more selected from the group consisting of at least silicon, transparent epoxy, a phosphor, and a combination thereof.
6. The light emitting device package of claim 1 , wherein the filler is filled between the first conductive bonding member and the second conductive bonding member by centrifugal force.
7. A backlight unit comprising:
a light emitting device including a first terminal and a second terminal installed therebeneath;
a substrate including a first electrode formed at one side of an electrode separating space and a second electrode formed at the other side of the electrode separating space;
a first conductive bonding member installed on the first electrode of the substrate so as to be electrically connected to the first terminal of the light emitting device;
a second conductive bonding member installed on the second electrode of the substrate so as to be electrically connected to the second terminal of the light emitting device;
a reflection encapsulant installed on the substrate so as to form a reflection cup part reflecting light generated in the light emitting device and filled in the electrode separating space to form an electrode separating part;
a filler filled between the reflection cup part and the first and second conductive bonding members; and
a light guide plate installed in a light path of the light emitting device,
wherein the first terminal of the light emitting device includes:
a reinforcing metal layer installed to be close to the light emitting device and formed of a conductive material having a first elongation percentage; and
a buffering metal layer installed beneath the reinforcing metal layer and formed of a conductive material having a second elongation percentage higher than the first elongation percentage.
8. An illumination apparatus comprising:
a light emitting device including a first terminal and a second terminal installed therebeneath;
a substrate including a first electrode formed at one side of an electrode separating space and a second electrode formed at the other side of the electrode separation space;
a first conductive bonding member installed on the first electrode of the substrate so as to be electrically connected to the first terminal of the light emitting device;
a second conductive bonding member installed on the second electrode of the substrate so as to be electrically connected to the second terminal of the light emitting device;
a reflection encapsulant installed on the substrate so as to form a reflection cup part reflecting light generated in the light emitting device and filled in the electrode separating space to form an electrode separating part; and
a filler filled between the reflection cup part and the first and second conductive bonding members,
wherein the first terminal of the light emitting device includes:
a reinforcing metal layer installed to be close to the light emitting device and formed of a conductive material having a first elongation percentage; and
a buffering metal layer installed beneath the reinforcing metal layer and formed of a conductive material having a second elongation percentage higher than the first elongation percentage.
9. The light emitting device package of claim 1 , wherein the reinforcing metal layer is formed of one or more selected from the group consisting of at least silver (Ag), tin (Sn), aluminum (Al), and a combination thereof.
10. The light emitting device package of claim 1 , wherein the buffering metal layer contains includes pure gold (Au) having a thickness of 5000 Å or more.
11. The light emitting device package of claim 1 , wherein the buffering metal layer includes a thermal stress alleviating protrusion formed thereon or a thermal stress alleviating groove part installed therein.
12. The light emitting device package of claim 1 , wherein the buffering metal layer includes a thermal stress alleviating rugged surface formed thereon.
13. The light emitting device package of claim 3 , wherein a plurality of first solder creams are simultaneously dotted on a surface of the first electrode of the substrate.
14. The light emitting device package of claim 3 , wherein the first solder cream is installed in a solder cream accommodating groove part or a solder cream height limiting protrusion of the first electrode of the substrate.
15. The light emitting device package of claim 3 , wherein the first solder cream is installed on a solder cream accommodating rugged surface of the first electrode of the substrate.