IP Library › Granted Patent US 9,837,581
Granted Patent B2
US 9,837,581 · App. 15/402,491 · Granted Dec 5, 2017

Light emitting device and light emitting device package

Inventors: Hwan Hee Jeong (Seoul, KR); Sang Youl Lee (Seoul, KR); June O. Song (Seoul, KR); Ji Hyung Moon (Seoul, KR); Kwang Ki Choi (Seoul, KR)
Assignee: LG INNOTEK CO., LTD.
H01L33/44H01L33/06H01L33/32H01L33/36H01L33/38H01L33/387H01L33/40H01L33/42F21K9/23F21Y2105/10F21Y2113/13F21Y2115/10H01L33/0079H01L33/10H01L33/22H01L2224/48091H01L2224/48247H01L2224/48257H01L2924/0002H01L2924/12032
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Quick Facts
Patent No.
US 9,837,581
App. No.
15/402,491
Granted
Dec 5, 2017
Kind
B2
Abstract

Disclosed are a light emitting device and a light emitting device package. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, an active layer on the first conductive semiconductor layer, and a second conductive semiconductor layer on the active layer, an adhesive layer contacting a top surface of the first conductive semiconductor layer, a first electrode contacting a top surface of the first conductive semiconductor and a top surface of the adhesive layer, and a second electrode contacting the second conductive semiconductor layer, wherein the adhesive layer contacting the first electrode is spaced apart from the second electrode.

Claims (25)

1. A light emitting device, comprising:

a light emitting structure including a first conductive type semiconductor layer, an active layer on the first conductive type semiconductor layer, and a second conductive type semiconductor layer on the active layer;

an electrode layer including a metal oxide layer on the second conductive type semiconductor layer;

an insulating layer on the second conductive type semiconductor layer;

a first electrode on the first conductive type semiconductor layer; and

a second electrode on the second conductive type semiconductor layer, wherein the insulating layer includes a first surface, a side surface, and a second surface, wherein the first surface, relative to the second surface, is proximate to the second conductive type semiconductor layer, wherein the second surface is opposite to the first surface, wherein the electrode layer has a hole, and the second electrode contacts the second conductive type semiconductor layer through the hole of the electrode layer, wherein the second electrode comprises an upper portion and a lower portion under the upper portion, wherein the lower portion is surrounded by the hole of the electrode layer, wherein the first surface of the insulating layer contacts a top surface of the second conductive type semiconductor layer, and wherein the second surface of the insulating layer contacts the electrode layer.

2. The light emitting device of claim 1 , wherein the side surface of the insulating layer is contact with the electrode layer.

3. The light emitting device of claim 1 , wherein a width of the first surface of the insulating layer is less than that of the electrode layer.

4. The light emitting device of claim 1 , wherein a width of the second surface of the insulating layer is less than that of the electrode layer.

5. The light emitting device of claim 1 , wherein the insulating layer comprises at least one of SiO 2 , SiO x , SiO x N y , Si 3 N 4 , TiO 2 , or Al 2 O 3 .

6. The light emitting device of claim 1 , wherein the electrode layer comprises a stepped portion.

7. The light emitting device of claim 6 , wherein the stepped portion of the electrode layer is vertically overlapped with at least one portion of the insulating layer.

8. The light emitting device of claim 7 , wherein the stepped portion of the electrode layer is disposed above the least one portion of the insulating layer.

9. The light emitting device of claim 1 , wherein the metal oxide layer comprises a transmissive electrode layer.

10. The light emitting device of claim 9 , wherein the transmissive electrode layer comprises a single layer structure or a multiple layer structure including at least one selected from the group consisting of ITO (indium tin oxide), IZO (indium zinc oxide), IZTO (indium zinc tin oxide), IAZO (indium aluminum zinc oxide), IGZO (indium gallium zinc oxide), IGTO (indium gallium tin oxide), AZO (aluminum zinc oxide), ATO (antimony tin oxide), GZO (gallium zinc oxide), IrOx, RuOx.

11. The light emitting device of claim 1 , wherein at least one portion of a top surface of the second conductive type semiconductor layer is exposed by the hole through the electrode layer.

12. The light emitting device of claim 1 , wherein a width of the upper portion of the second electrode is wider than a width of the lower portion of the second electrode.

13. The light emitting device of claim 1 , wherein both of the lower portion and the upper portion of the second electrode are electrically in contact with the electrode layer.

14. The light emitting device of claim 1 , wherein a width of the second electrode is narrower than a width of the electrode layer.

15. The light emitting device of claim 1 , wherein the upper portion of the second electrode is disposed higher than the insulating layer.

16. The light emitting device of claim 1 , wherein a portion of a top surface of the electrode layer is exposed.

17. The light emitting device of claim 1 , wherein at least one portion of the first surface of the insulating layer is covered by the electrode layer.

18. The light emitting device of claim 1 , wherein at least one portion of the second surface of the insulating layer is covered by the electrode layer.

19. The light emitting device of claim 1 , wherein the side surface of the insulating layer is in contact with the electrode layer, wherein a width of the first surface of the insulating layer is less than a width of the electrode layer, and wherein a width of the second surface of the insulating layer is less than the width of the electrode layer.

20. A light emitting device package including the light emitting device of claim 1 .

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 23, 2023
From: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
To: WANGS ALLIANCE CORPORATION
Reel/Frame 063075/0919 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2021
From: LG INNOTEK CO., LTD.
To: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
Reel/Frame 056366/0335 →
Priority Claims (1)
KR 10-2010-0022754 · Mar 15, 2010 · national
Continuity (5)
Continuation 15044627 · Feb 16, 2016
Continuation 14717464 · May 20, 2015
Continuation 14457384 · Aug 12, 2014
Continuation 13014390 · Jan 26, 2011
Related Publication 20170125639A1 · May 4, 2017