Polyamic acid resin composition, polyimide film using same, and method for producing said polyimide film
An object is to provide a polyamic acid resin composition that can form a varnish with a low viscosity and serves to produce, through curing, coat film with good mechanical characteristics. Another object is to provide a polyamic acid resin composition in which the acid anhydride terminal group is low in reactivity with diamine and which can give a varnish that does not suffer significant precipitation of diamine. These objects can be met by a polyamic acid resin composition that contains: (a) polyamic acid and (b) a compound as represented by chemical formula (1). (In Chemical formula (1), Z is a di- or higher-valent organic group containing 2 or more carbon atoms, V is a structure as represented by chemical formula (2), and k is an integer of 2 or more.) (In In Chemical formula (2), δ represents oxygen or sulfur atom and W represents an electron-withdrawing group, and R 11 and R 12 represent independently a hydrogen atom or a hydrocarbon group containing 1 to 10 carbon atoms.
1. A polyamic acid resin composition comprising (a) polyamic acid and (b) a compound as represented by chemical formula (1):
Z V) k (1)
wherein Z is a divalent or higher valent organic group containing 2 or more carbon atoms, V is a structure as represented by chemical formula (2) below, and k is an integer of 2 or more,
wherein δ represents oxygen or sulfur atom, W represents an electron-withdrawing group, and R 11 and R 12 represent independently a hydrogen atom or a hydrocarbon group containing 1 to 10 carbon atoms.
2. The polyamic acid resin composition as described in claim 1 , wherein W in chemical formula (2) is represented by any one of chemical formulae (3) to (10):
wherein R 21 to R 28 are independently a hydrocarbon group containing 1 to 10 carbon atoms or an organic group containing 1 to 10 carbon atoms and comprising hydrogen and carbon as essential elements and 1 to 10 other atoms of elements selected from the group of boron, oxygen, sulfur, nitrogen, phosphorus, silicon, and halogens.
3. The polyamic acid resin composition as described in claim 1 , wherein V in chemical formula (1) is represented by any one of chemical formulae (11) to (13):
4. The polyamic acid resin composition as described in claim 1 , wherein k in chemical formula (1) is an integer of 2 or 3.
5. The polyamic acid resin composition as described in claim 1 , wherein polyamic acid (a) contains a structure as represented by chemical formula (14) or (15):
wherein X in Chemical formula (14) denotes a trivalent or higher valent organic group containing 2 or more carbon atoms; Y in chemical formula (15) denotes a trivalent or higher valent organic group containing 2 or more carbon atoms; and R 1 denotes a hydrogen atom, a hydrocarbon group containing 1 to 10 carbon atoms, or an alkylsilyl group containing 1 to 10 carbon atoms.
6. A polyimide film comprising polyimide as produced by imidizing the polyamic acid resin composition as described in claim 1 .
7. A production method for polyimide film comprising a step for imidizing the polyamic acid resin composition as described in claim 1 .
8. A coated glass substrate produced by coating a glass substrate with a varnish containing the polyamic acid resin composition as described in claim 1 and removing the solvent by drying.
9. A glass substrate coated with polyimide film produced by heating the coated glass substrate as described in claim 8 at a temperature of 180° C. to 600° C.
10. A production method for a glass substrate coated with polyimide film comprising a step for imidizing, by heating, the coated glass substrate as described in claim 8 .
11. The polyamic acid resin composition as described in claim 2 , wherein V in chemical formula (1) is represented by any one of chemical formulae (11) to (13):
12. The polyamic acid resin composition as described in claim 2 , wherein k in chemical formula (1) is an integer of 2 or 3.
13. The polyamic acid resin composition as described in claim 3 , wherein k in chemical formula (1) is an integer of 2 or 3.
14. The polyamic acid resin composition as described in claim 2 , wherein polyamic acid (a) contains a structure as represented by chemical formula (14) or (15):
wherein X in Chemical formula (14) denotes a trivalent or higher valent organic group containing 2 or more carbon atoms; Y in chemical formula (15) denotes a trivalent or higher valent organic group containing 2 or more carbon atoms; and R 1 denotes a hydrogen atom, a hydrocarbon group containing 1 to 10 carbon atoms, or an alkylsilyl group containing 1 to 10 carbon atoms.
15. The polyamic acid resin composition as described in claim 3 , wherein polyamic acid (a) contains a structure as represented by chemical formula (14) or (15):
wherein X in Chemical formula (14) denotes a trivalent or higher valent organic group containing 2 or more carbon atoms; Y in chemical formula (15) denotes a trivalent or higher valent organic group containing 2 or more carbon atoms; and R 1 denotes a hydrogen atom, a hydrocarbon group containing 1 to 10 carbon atoms, or an alkylsilyl group containing 1 to 10 carbon atoms.
16. The polyamic acid resin composition as described in claim 4 , wherein polyamic acid (a) contains a structure as represented by chemical formula (14) or (15):
wherein X in Chemical formula (14) denotes a trivalent or higher valent organic group containing 2 or more carbon atoms; Y in chemical formula (15) denotes a trivalent or higher valent organic group containing 2 or more carbon atoms; and R 1 denotes a hydrogen atom, a hydrocarbon group containing 1 to 10 carbon atoms, or an alkylsilyl group containing 1 to 10 carbon atoms.
17. A polyimide film comprising polyimide as produced by imidizing the polyamic acid resin composition as described in claim 2 .
18. A polyimide film comprising polyimide as produced by imidizing the polyamic acid resin composition as described in claim 3 .
19. A polyimide film comprising polyimide as produced by imidizing the polyamic acid resin composition as described in claim 4 .
20. A polyimide film comprising polyimide as produced by imidizing the polyamic acid resin composition as described in claim 5 .