IP Library › Granted Patent US 9,852,974
Granted Patent B2
US 9,852,974 · App. 15/198,637 · Granted Dec 26, 2017

Substrate, light-emitting device with substrate, method of manufacturing substrate assembly and method of manufacturing light-emitting device with substrate

Inventor: Yuichi Miura (Yamanashi-ken, JP)
Assignees: CITIZEN ELECTRONICS CO., LTD.; CITIZENS WATCH CO., LTD.
H01L23/49838H01L21/4857H01L23/49822H01L33/62H01L2224/48091H01L2933/0066
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,852,974
App. No.
15/198,637
Granted
Dec 26, 2017
Kind
B2
Abstract

A substrate includes a first electrode layer including a first electrode and a second electrode; a second electrode layer including a first electrode and a second electrode; a third electrode layer including a first electrode and a second electrode; and a resin layer. The first electrode layer is arranged on a first side of the resin layer, the third electrode layer is arranged on a second side of the resin layer opposed to the first side, the second electrode layer is positioned in the resin layer, and the first electrode layer is thicker than the second electrode layer. The first and second electrodes of the first electrode layer are positioned inside a peripheral edge of the first side of the resin layer, and the first and second electrodes of the third electrode layer are positioned inside a peripheral edge of the second side of the resin layer.

Claims (110)

1. A substrate comprising:

a first electrode layer comprising a first electrode and a second electrode;

a second electrode layer comprising a first electrode and a second electrode;

a third electrode layer comprising a first electrode and a second electrode; and

a resin layer, wherein

the first electrode layer is arranged on a first side of the resin layer, and the third electrode layer is arranged on a second side that is an opposite side of the first side of the resin layer,

the second electrode layer is positioned in the resin layer,

the first electrode layer is greater in thickness than the second electrode layer,

the first electrode and the second electrode of the first electrode layer are positioned inside a peripheral edge of the first side of the resin layer,

the first electrode and the second electrode of the third electrode layer are positioned inside a peripheral edge of the second side of the resin layer, and

a surface area of the first electrode of the first electrode layer is at least three times as large as a surface area of the second electrode of the first electrode layer.

2. The substrate according to claim 1 ,

wherein the third electrode layer is greater in thickness than the second electrode layer.

3. The substrate according to claim 1 ,

wherein the first electrode layer is one and half times as thick as the second electrode layer or greater in thickness.

4. The substrate according to claim 1 ,

wherein the third electrode layer is one and half times as thick as the second electrode layer or greater in thickness.

5. The substrate according to claim 1 ,

wherein the first electrode of the second electrode layer in the resin layer comprises a first connecting portion that extends from the first electrode of the second electrode layer toward a peripheral side of the resin layer, and the second electrode of the second electrode layer in the resin layer comprises a second connecting portion that extends from the second electrode of the second electrode layer toward the peripheral side of the resin layer.

6. A substrate comprising:

a first electrode layer comprising a first electrode and a second electrode;

a second electrode layer comprising a first electrode and a second electrode;

a third electrode layer comprising a first electrode and a second electrode; and

a resin layer, wherein

the first electrode layer is arranged on a first side of the resin layer, and the third electrode layer is arranged on a second side that is an opposite side of the first side of the resin layer,

the second electrode layer is positioned in the resin layer,

the first electrode layer is greater in thickness than the second electrode layer,

the first electrode and the second electrode of the first electrode layer are positioned inside a peripheral edge of the first side of the resin layer,

the first electrode and the second electrode of the third electrode layer are positioned inside a peripheral edge of the second side of the resin layer,

the first electrode of the first electrode layer, the first electrode of the second electrode layer, and the first electrode of the third electrode layer are electrically connected to one another through filled vias, and

a number of the filled vias that electrically connect the first electrode of the first electrode layer and the first electrode of the second electrode layer is greater than a number of filled vias that electrically connect the second electrode of the first electrode layer and the second electrode of the second electrode layer.

7. The substrate according to claim 6 ,

wherein the second electrode of the first electrode layer, the second electrode of the second electrode layer, and the second electrode of the third electrode layer are electrically connected to one another through filled vias.

8. A substrate comprising:

a first electrode layer comprising a first electrode and a second electrode;

a second electrode layer comprising a first electrode and a second electrode;

a third electrode layer comprising a first electrode and a second electrode;

a resin layer; and

an electroplated coating, wherein

the first electrode layer is arranged on a first side of the resin layer, and the third electrode layer is arranged on a second side that is an opposite side of the first side of the resin layer,

the second electrode layer is positioned in the resin layer,

the first electrode layer is greater in thickness than the second electrode layer,

the first electrode and the second electrode of the first electrode layer are positioned inside a peripheral edge of the first side of the resin layer,

the first electrode and the second electrode of the third electrode layer are positioned inside a peripheral edge of the second side of the resin layer, and

the electroplated coating separately covers the first electrode and the second electrode of the first electrode layer.

9. The substrate according to claim 8 , further comprising:

an electroplated coating separately covering the first electrode and the second electrode of the third electrode layer.

10. A substrate comprising:

a first electrode layer comprising a first electrode and a second electrode;

a second electrode layer comprising a first electrode and a second electrode;

a third electrode layer comprising a first electrode and a second electrode;

a resin layer;

a first electroplated coating; and

a second electroplated coating, wherein

the first electrode layer is arranged on a first side of the resin layer, and the third electrode layer is arranged on a second side that is an opposite side of the first side of the resin layer,

the second electrode layer is positioned in the resin layer,

the first electrode layer is greater in thickness than the second electrode layer,

the first electrode and the second electrode of the first electrode layer are positioned inside a peripheral edge of the first side of the resin layer,

the first electrode and the second electrode of the third electrode layer are positioned inside a peripheral edge of the second side of the resin layer,

the first electroplated coating is positioned at the first side of the resin layer and covers the first electrode of the first electrode layer and filled vias that are configured to electrically connect the first electrode of the first electrode layer and the first electrode of the second electrode layer, and

the second electroplated coating is positioned at the first side of the resin layer and covers the second electrode of the first electrode layer and filled vias that are configured to electrically connect the second electrode of the first electrode layer and the second electrode of the second electrode layer.

11. The substrate according to claim 10 , further comprising:

an electroplated coating being positioned at the second side of the resin layer and covering the first electrode of the third electrode layer and filled vias that are configured to electrically connect the first electrode of the third electrode layer and the first electrode of the second electrode layer; and

an electroplated coating being positioned at the second side of the resin layer and covering the second electrode of the third electrode layer and filled vias that are configured to electrically connect the second electrode of the third electrode layer and the second electrode of the second electrode layer.

12. A light-emitting device comprising:

a light-emitting element; and

a substrate comprising:

a first electrode layer comprising a first electrode and a second electrode;

a second electrode layer comprising a first electrode and a second electrode;

a third electrode layer comprising a first electrode and a second electrode;

a resin layer; and

an electroplated coating covering the first electrode of the first electrode layer, wherein

the first electrode layer is arranged on a first side of the resin layer, and the third electrode layer is arranged on a second side that is an opposite side of the first side of the resin layer,

the second electrode layer is positioned in the resin layer,

the first electrode layer is greater in thickness than the second electrode layer,

the first electrode and the second electrode of the first electrode layer are positioned inside a peripheral edge of the first side of the resin layer, and

the first electrode and the second electrode of the third electrode layer are positioned inside a peripheral edge of the second side of the resin layer,

wherein the light-emitting element is arranged on the electroplated coating of the first electrode of the first electrode layer.

13. The light-emitting device according to claim 12 , wherein

the light-emitting element has a peak wavelength in a range of 800 nm to 1000 nm.

14. A light-emitting device comprising:

a substrate; and

a light-emitting element mounted on the substrate, wherein

the substrate comprises a first electrode layer comprising a first electrode and a second electrode, a second electrode layer comprising a first electrode and a second electrode, a third electrode layer comprising a first electrode and a second electrode, and a resin layer,

the first electrode layer is arranged on a first side of the resin layer, and the third electrode layer is arranged on a second side that is an opposite side of the first side of the resin layer,

the second electrode layer is positioned in the resin layer,

the first electrode layer is greater in thickness than the second electrode layer,

the light-emitting element is mounted on the first electrode of the first electrode layer, and the light-emitting element is electrically connected to the first electrode and the second electrode of the first electrode layer,

the first electrode and the second electrode of the first electrode layer are positioned inside a peripheral edge of the first side of the resin layer,

the first electrode and the second electrode of the third electrode layer are positioned inside a peripheral edge of the second side of the resin layer,

the first electrode of the second electrode layer in the resin layer comprises a first connecting portion that extends from the first electrode of the second electrode layer toward a peripheral side of the resin layer, and the second electrode of the second electrode layer in the resin layer comprises a second connecting portion that extends from the second electrode of the second electrode layer toward the peripheral side of the resin layer,

the first electrode of the first electrode layer, the first electrode of the second electrode layer, and the first electrode of the third electrode layer are electrically connected to one another through filled vias, and

the second electrode of the first electrode layer, the second electrode of the second electrode layer, and the second electrode of the third electrode layer are electrically connected to one another through filled vias.

15. A method of manufacturing a substrate assembly comprising:

preparing a first electrode layer assembly that comprises pairs of electrodes, each pair of which comprises a first electrode and a second electrode that is smaller in area than the first electrode on a first side of a resin layer;

preparing a second electrode layer assembly that is thinner than the first electrode layer assembly, the second electrode layer assembly comprises pairs of electrodes, each pair of which comprises a first electrode and a second electrode that is smaller in area than the first electrode and a first connecting portion that electrically connects first electrodes of the pairs of the second electrode layer assembly and a second connecting portion that electrically connects second electrodes of the second electrode layer assembly on a second side of the resin layer;

arranging an additional resin in a state of liquid to form the resin layer covering the second electrode layer assembly such that the pairs of the electrodes of the second electrode layer assembly are buried in the resin layer; and

arranging a metallic layer on a second side of the resin layer in which the pairs of the electrodes of the second electrode layer assembly is buried, the second side being an opposite side of the first side of the resin layer to form a third electrode layer assembly of the substrate assembly;

forming filled vias to be arranged through the first electrode layer assembly in the resin layer to electrically connect the first electrode layer assembly and the second electrode layer assembly;

forming filled vias to be arranged through the third electrode layer assembly in the resin layer to electrically connect the third electrode layer assembly and the second electrode layer assembly;

forming an electroplated coating on the first electrode layer assembly and the filled vias that are arranged through the first electrode assembly layer; and

forming an electroplated coating on the third electrode layer assembly and the filled vias that are arranged through the third electrode assembly layer.

16. A method of manufacturing a light-emitting device with a substrate comprising:

the method manufacturing the substrate assembly of claim 15 ;

electrically mounting light-emitting elements on the first electrode layer assembly comprising the pairs of the first electrode and the second electrode of the substrate assembly;

sealing the light-emitting elements by a light-transmitting resin layer on the substrate assembly; and

dicing the substrate assembly with the light-emitting elements mounted and sealed by the light-transmitting resin layer on the substrate assembly into light-emitting devices each with a substrate that includes the first electrode and the second electrode of the first electrode layer, the first electrode and the second electrode of the second electrode layer, and the first electrode and the second electrode of the third electrode layer and the light-transmitting resin layer.

17. The method of manufacturing a substrate assembly according to claim 15 , wherein

the electroplated coating is formed on the first electrode layer assembly and the filled vias that electrically connect the first electrode layer assembly and the second electrode layer assembly by applying current to the second electrode layer assembly, and

the electroplated coating is formed on the third electrode layer assembly and the filled vias that electrically connect the third electrode layer assembly and the second electrode layer assembly by applying current to the second electrode layer assembly.

Assignments (2)
CHANGE OF NAME Recorded Dec 8, 2016
From: CITIZEN HOLDINGS CO., LTD.
To: CITIZEN WATCH CO., LTD.
Reel/Frame 040603/0932 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 30, 2016
From: MIURA, YUICHI
To: CITIZEN ELECTRONICS CO., LTD.; CITIZEN HOLDINGS CO., LTD.
Reel/Frame 039057/0917 →
Continuity (2)
Provisional Application 62188547 · Jul 3, 2015
Related Publication 20170005033A1 · Jan 5, 2017