IP Library › Granted Patent US 9,883,129
Granted Patent B2
US 9,883,129 · App. 15/274,312 · Granted Jan 30, 2018

Semiconductor device

Inventor: Yoshiyuki Kurokawa (Kanagawa, JP)
Assignee: Semiconductor Energy Laboratory Co., LTD.
H04N5/3745H01L27/14616H01L27/14627H01L27/14634H04N5/378H04N9/8042
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Quick Facts
Patent No.
US 9,883,129
App. No.
15/274,312
Granted
Jan 30, 2018
Kind
B2
Abstract

The present invention provides a semiconductor device which enables data compression with a small amount of data. The present invention is a semiconductor device which includes a pixel portion, a memory, a first circuit, and a second circuit. The pixel portion has a function of obtaining imaging data. The first circuit has a function of performing discrete cosine transform on the imaging data, and generating first data. The first data is analog data, and the memory has a function of retaining the first data. The second circuit has a function of performing discrete cosine transform on the first data, and generating second data. The memory includes a first transistor, which includes an oxide semiconductor in a channel formation region, and a second transistor, in which a channel formation region is provided in a Si wafer.

Claims (38)

1. A semiconductor device comprising:

a pixel portion configured to obtain an imaging data;

a first circuit configured to perform discrete cosine transform on the imaging data and generate a first data which is an analog data;

a memory configured to store the first data; and

a second circuit configured to perform discrete cosine transform on the first data and generate a second data.

2. The semiconductor device according to claim 1 ,

wherein the pixel portion comprises a photodiode and a transistor, and

wherein a channel formation region of the transistor comprises an oxide semiconductor.

3. The semiconductor device according to claim 1 , wherein each of the first circuit and the second circuit is an analog processing circuit.

4. The semiconductor device according to claim 1 ,

wherein the first circuit is configured to perform discrete cosine transform in one of the x-axis direction and the y-axis direction on the imaging data, and

wherein the second circuit is configured to perform discrete cosine transform in the other of the x-axis direction and the y-axis direction on the first data.

5. The semiconductor device according to claim 1 ,

wherein the memory comprises a first transistor, a second transistor, and a capacitor,

wherein a channel formation region of the first transistor comprises an oxide semiconductor, and

wherein a channel formation region of the second transistor comprises silicon.

6. A camera module comprising:

the semiconductor device according to claim 1 ; and

a lens.

7. A semiconductor device comprising:

a pixel portion configured to obtain a first imaging data, a second imaging data, and a third imaging data which is a difference between the first imaging data and the second imaging data;

a first circuit configured to perform discrete cosine transform on the third imaging data and generate a first data which is an analog data;

a memory configured to store the first data; and

a second circuit configured to perform discrete cosine transform on the first data and generate a second data.

8. The semiconductor device according to claim 7 ,

wherein the pixel portion comprises a photodiode and a transistor, and

wherein a channel formation region of the transistor comprises an oxide semiconductor.

9. The semiconductor device according to claim 7 , wherein each of the first circuit and the second circuit is an analog processing circuit.

10. The semiconductor device according to claim 7 ,

wherein the first circuit is configured to perform discrete cosine transform in one of the x-axis direction and the y-axis direction on the third imaging data, and

wherein the second circuit is configured to perform discrete cosine transform in the other of the x-axis direction and the y-axis direction on the first data.

11. The semiconductor device according to claim 7 ,

wherein the memory comprises a first transistor, a second transistor, and a capacitor,

wherein a channel formation region of the first transistor comprises an oxide semiconductor, and

wherein a channel formation region of the second transistor comprises silicon.

12. A camera module comprising:

the semiconductor device according to claim 7 ; and

a lens.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 8, 2016
From: KUROKAWA, YOSHIYUKI
To: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Reel/Frame 040256/0139 →
Priority Claims (1)
JP 2015-188047 · Sep 25, 2015 · national
Continuity (1)
Related Publication 20170094220A1 · Mar 30, 2017