Method and apparatus for depositing phosphor on semiconductor-light emitting device

1. A method of depositing a phosphor using transfer molding, the method comprising:

forming a plurality of light-emitting devices on a wafer and arranging the light-emitting devices on a carrier substrate according to luminance characteristics of the plurality of light-emitting devices by examining the luminance characteristics of the plurality of light-emitting devices;

separating the light-emitting devices from each other after forming the plurality of light-emitting devices on the wafer and prior to arranging the light-emitting devices on the carrier substrate;

installing the carrier substrate for the arranged light emitting devices to be disposed inside a cavity of a transfer molding apparatus, the transfer molding apparatus comprising an upper die and a lower die forming the cavity;

attaching a release film on the lower die of the transfer molding apparatus;

depositing the phosphor on the arranged light-emitting devices using transfer molding; and

separating the light-emitting devices from the carrier substrate,

wherein in the examining of the luminance characteristics of the plurality of light-emitting devices, the luminance characteristics of each light-emitting device are examined after the plurality of light-emitting devices formed on the wafer are separated from each other.

2. The method of claim 1 , wherein in the examining of the luminance characteristics, luminance wavelength, brightness, or reaction rate of each light-emitting device is examined.

3. The method of claim 1 , wherein in the arranging of the light-emitting devices on the carrier substrate, an adhesive layer is formed on the carrier substrate and LED chips having the same luminance characteristics are arranged on the adhesive layer.

4. The method of claim 3 , wherein the adhesive layer comprises a photo-sensitive adhesive (PSA).

5. The method of claim 1 , wherein in the depositing of the phosphor, the carrier substrate, on which the light-emitting devices are arranged, is installed on the upper die and the phosphor is supplied to the light-emitting devices on the carrier substrate so as to deposit the phosphor on the light-emitting devices.

6. The method of claim 5 , wherein the phosphor is deposited on the light-emitting devices except for electrode pads of the light-emitting devices.

7. The method of claim 1 , further comprising: sorting the plurality of light emitting devices according to characteristics of the light emitting devices; and

transferring phosphor on the arranged light emitting devices in the cavity of the transfer molding apparatus.

8. The method of claim 7 , wherein installing the carrier substrate comprises installing the carrier substrate on the upper die of the cavity, and

wherein attaching the release film on the lower die is performed before the installing the carrier substrate on the upper die.

9. The method of claim 1 , wherein the transfer molding apparatus further comprising:

a plunger applying pressure to provide phosphor to the cavity; and

a hole discharging air from the cavity.

10. A method of depositing a phosphor using transfer molding, the method comprising:

forming a plurality of light-emitting devices on a wafer and arranging the light-emitting devices on a carrier substrate according to luminance characteristics of the plurality of light-emitting devices by examining the luminance characteristics of the plurality of light-emitting devices;

installing the carrier substrate for the arranged light emitting devices to be disposed inside a cavity of a transfer molding apparatus, the transfer molding apparatus comprising an upper die and a lower die forming the cavity;

attaching a release film on the lower die of the transfer molding apparatus;

depositing the phosphor on the arranged light-emitting devices using transfer molding;

separating the light-emitting devices from the carrier substrate; and

separating the plurality of light-emitting devices from the wafer prior to the arranging the light emitting devices on the carrier substrate,

wherein the examining luminance characteristics of each of the plurality of light-emitting devices is performed after the separating of the plurality of light-emitting devices from the wafer.

11. The method of claim 10 , wherein the depositing of the phosphor is performed in a cavity of a transfer molding apparatus.

12. The method of claim 11 , wherein the transfer molding apparatus further comprises:

a pot block formed at one side of the upper die and the lower die configured for supplying a phosphor material between the upper die and the lower die,

wherein the pot block comprises a hole and a plunger formed at a bottom part of the hole, the plunger being configured to move upward and downward in the hole to apply pressure for transporting the phosphor material between the upper die and the lower die,

wherein a carrier substrate on which light-emitting devices are arranged is installed on the upper die,

wherein the lower die is formed correspond to the upper die.

13. The method of claim 11 , wherein the transfer molding apparatus further comprises:

a pot block formed at one side of the upper die and the lower die for supplying a phosphor material between the upper die and the lower die; and

a release film contacting the lower die and a lower part of the pot block,

wherein the carrier substrate on which light-emitting devices are arranged is installed on the upper die,

wherein the lower die is formed to correspond to the upper die.

14. A method of depositing a phosphor using transfer molding, the method comprising:

forming a plurality of light-emitting devices on a wafer and arranging the light-emitting devices on a carrier substrate according to luminance characteristics of the plurality of light-emitting devices by examining the luminance characteristics of the plurality of light-emitting devices;

installing the carrier substrate for the arranged light emitting devices to be disposed inside a cavity of a transfer molding apparatus, the transfer molding apparatus comprising an upper die and a lower die forming the cavity;

attaching a release film on the lower die of the transfer molding apparatus;

depositing the phosphor on the arranged light-emitting devices using transfer molding; and

separating the light-emitting devices from the carrier substrate; and

separating the plurality of light-emitting devices formed on the wafer from each other,

wherein the examining the luminance characteristics of the plurality of light-emitting devices is performed after separating the plurality of light-emitting devices from each other,

wherein the installing the carrier substrate inside the cavity of the transfer molding apparatus comprises disposing the carrier substrate above the release film,

wherein the disposing the phosphor on the arranged light-emitting devices comprises providing the phosphor between the arranged light-emitting devices and the release film, and

wherein the release film contacts electrode pads of the light-emitting devices while disposing the phosphor on the arranged light-emitting devices.

15. The method of claim 14 , wherein the release film comprises polyvinyl chloride (PVC) or polyethylene terephthalate (PET).