Light emitting package
A light emitting device may include a substrate; a body which is disposed on the substrate and has a first hole having a predetermined size and a light emitting chip which is disposed within a cavity formed by the substrate and the first hole of the body. A cap may be disposed on the body and may have a second hole having a predetermined size. A transparent window may be disposed in the second hole. A lower portion of the cap is divided into a first surface and a second surface more projecting downwardly than the first surface, and at least a portion of the first surface is attached and fixed to the body.
1. A light emitting device comprising:
a ceramic substrate;
a body disposed on the substrate and having a first hole of a predetermined size;
a light emitting chip to emit an Ultraviolet (UV) light, and the light emitting chip disposed within a cavity formed by the substrate and the first hole of the body;
a cap disposed on the body and having a second hole of a predetermined size, wherein the cap is attached and fixed to the body by an Au—Sn eutectic bonding;
a transparent window disposed in the second hole,
wherein an upper diameter of the second hole is different from a lower diameter of the second hole, such that a level difference is formed between the upper diameter of the second hole and the lower diameter of the second hole, and the transparent window is disposed in a lower portion of the second hole,
wherein the ceramic substrate includes a ceramic body having a third hole, and the ceramic substrate includes a heat radiation block inserted in the third hole;
a first projection prevention layer directly contacting the ceramic substrate and directly contacting the heat radiation block; and
a second projection prevention layer directly contacting the ceramic substrate and directly contacting the heat radiation block such that the heat radiation block is between the first projection prevention layer and the second projection prevention layer,
wherein a width of the light emitting chip is smaller than a width of the heat radiation block, and
wherein a width of the ceramic substrate, a width of the first projection prevention layer, and a width of the second projection prevention layer are the same as each other.
2. The light emitting device of claim 1 , wherein the lower diameter of the second hole is less than the upper diameter of the second hole, and wherein a side of the transparent window that contacts the second hole has a level difference corresponding to a shape of the level difference of the cap.
3. The light emitting device of claim 2 , wherein the light emitting chip comprises a sub-mount which is attached and fixed to a lower portion of the light emitting chip, and wherein the sub-mount is disposed on the first projection prevention layer.
4. The light emitting device of claim 1 , wherein a lower portion of the cap is divided into a first surface and a second surface more projecting downwardly than the first surface, wherein at least a portion of the first surface of the cap is attached and fixed to the body.
5. The light emitting device of claim 1 , wherein a lower portion of the cap is divided into a first surface and a second surface more projecting downwardly than the first surface, wherein at least a portion of the first surface of the cap is attached and fixed to the body, and wherein the body and the first surface of the cap are attached and fixed to each other by the Au—Sn eutectic boding in vacuum or nitrogen N 2 gas.
6. The light emitting device of claim 1 , wherein the light emitting chip is fixed to the first projection prevention layer through Au paste bonding or Au—Sn eutectic bonding.
7. The light emitting device of claim 1 , further comprising a molding part provided within the cavity in such a manner as to surround the light emitting chip.
8. The light emitting device of claim 1 , wherein the light emitting chip comprises a sub-mount which is attached and fixed to a lower portion of the light emitting chip, and wherein the sub-mount is disposed on the first projection prevention layer.
9. The light emitting device of claim 1 , wherein the light emitting chip is directly mounted to the first projection prevention layer.
10. The light emitting device of claim 1 , wherein a width of the cap is smaller than a width of the body.
11. The light emitting device of claim 1 , wherein the heat radiation block has a step difference where a width of an upper portion thereof is smaller than a width of a lower portion thereof, and the third hole has a shape corresponding to the heat radiation block.
12. The light emitting device of claim 1 , wherein the upper diameter of the second hole is less than the lower diameter of the second hole.
13. The light emitting device of claim 12 , wherein a lower portion of the cap is divided into a first surface and a second surface more projecting downwardly than the first surface, wherein at least a portion of the first surface is attached and fixed to the body, and wherein the body and the first surface are attached and fixed to each other by Au—Sn eutectic bonding in vacuum or nitrogen N 2 gas.
14. The light emitting device of claim 12 , wherein the light emitting chip is fixed to the first projection prevention layer through Au paste bonding or Au—Sn eutectic bonding.
15. The light emitting device of claim 12 , wherein a gap between the light emitting chip and the transparent window is from 0.2 mm to 0.3 mm.
16. The light emitting device of claim 12 , wherein the light emitting chip is directly mounted to the first projection prevention layer.
17. A light emitting device comprising:
a ceramic substrate;
a body disposed on the substrate and having a first hole of a predetermined size;
a light emitting chip to emit an Ultraviolet (UV) light, and the light emitting chip disposed within a cavity formed by the substrate and the first hole of the body;
a cap disposed on the body and having a second hole of a predetermined size, wherein the cap is attached and fixed to the body by an Au—Sn eutectic bonding;
a transparent window disposed in the second hole,
wherein an upper diameter of the second hole is different from a lower diameter of the second hole, such that a level difference is formed between the upper diameter of the second hole and the lower diameter of the second hole, and the transparent window is disposed in a lower portion of the second hole,
wherein the ceramic substrate includes a ceramic body having a third hole, and the ceramic substrate includes a heat radiation block inserted in the third hole;
a first projection prevention layer disposed on the ceramic substrate and the heat radiation block; and
a second projection prevention layer disposed under the ceramic substrate and under the heat radiation block such that the heat radiation block is between the first projection prevention layer and the second projection prevention layer,
wherein an upper surface of the ceramic substrate and an upper surface of the heat radiation block are covered by the first projection prevention layer, and wherein a lower surface of the ceramic substrate and a lower surface of the heat radiation block are covered by the second projection prevention layer, and
wherein a first contact surface between the light emitting chip and the first projection prevention layer is smaller than a second contact surface between the first projection prevention layer and the heat radiation block.
18. The light emitting device of claim 17 , wherein the heat radiation block has a step difference where a width of an upper portion thereof is smaller than a width of a lower portion thereof, and the third hole has a shape corresponding to the heat radiation block.