Laser induced extra-planar elicitation
In a method of controlled laser deformation, a substrate is provided that is transparent to the laser energy. At least a portion of the substrate is coated with a release layer that absorbs the laser energy. A component to be deformed is attached to the release layer opposed to the substrate. A source of laser energy is directed through the substrate and into a portion of the release layer, which vaporizes the portion of the release layer by absorption of the laser energy, and releases a portion of the component from the substrate. This deforms the portion of the component away from the substrate by the vaporization of the release layer such that at least one edge of the component is no longer in contact with the release layer or substrate, and leaving a second portion of the component still attached to non-vaporized release layer.
1. A method comprising:
providing a source of laser energy;
providing a substrate;
wherein the substrate is transparent to the laser energy;
wherein at least a portion of the substrate is coated with a release layer that absorbs the laser energy;
wherein a component to be deformed is attached to the release layer opposed to the substrate; and
wherein the component has at least one edge in contact with the release layer or substrate;
directing the laser energy through the substrate and into a portion of the release layer;
vaporizing the portion of the release layer by absorption of the laser energy, releasing a portion of the component from the substrate; and
deforming the portion of the component away from the substrate by the vaporization of the release layer such that the at least one edge of the component is no longer in contact with the release layer or substrate, and leaving a second portion of the component still attached to non-vaporized release layer.
2. The method of claim 1 , wherein the source of laser energy generates laser pulses with widths of 100 femtoseconds to 100 nanoseconds long.
3. The method of claim 1 , wherein the source of laser energy generates laser pulses with wavelengths ranging from 200 nm to 3.5 microns.
4. The method of claim 1 , wherein the substrate is a quartz substrate.
5. The method of claim 1 , wherein the release layer comprises indium tin oxide.
6. The method of claim 1 , wherein the component comprises a layer of copper, a pure metal, a metal alloy, or a polymer.
7. The method of claim 6 , wherein the layer is 50 nm to 1 μm thick.
8. The method of claim 1 , further comprising:
forming the component on the release layer by a lithographic process.
9. The method of claim 1 , further comprising:
forming the component on the release layer by a non-lithographic process.
10. The method of claim 1 , wherein directing, vaporizing, and bending are performed sequentially more than one time in different locations to bend a single component more than one time.
11. The method of claim 1 , wherein the substrate comprises a plurality of components, and further comprising:
performing the directing, vaporizing, and bending more than one time to bend more than one of the components.
12. The method of claim 1 ;
wherein the substrate comprises a plurality of components; and
wherein the laser energy is directed through a mask before the substrate such that more than one component is simultaneously deformed.