Piezoelectric device package and method of fabricating the same
A piezoelectric device package may include: a case having a plurality of terminals formed on a lower surface thereof; a piezoelectric device formed in the case; a temperature measuring device formed on the lower surface of the case and having a thin film form; and a cover member enclosing an upper portion of the case.
1. A piezoelectric device package comprising:
a case having a plurality of terminals disposed on a lower external surface thereof;
a piezoelectric device disposed in the case;
a temperature measuring device having thin film form and disposed on the lower external surface of the case; and
a cover member enclosing an upper portion of the case, wherein
the plurality of terminals include a temperature measuring device input terminal, a temperature measuring device output terminal, a piezoelectric device input terminal, and a piezoelectric device output terminal, each disposed in corners of the lower external surface of the case,
the temperature measuring device includes first piezoelectric device connecting electrodes connected to the piezoelectric device input terminal, and the piezoelectric device output terminal,
the temperature measuring device includes a temperature measuring device input electrode and a temperature measuring device output electrode connected to the temperature measuring device input terminal and the temperature measuring device output terminal, respectively, and
the first piezoelectric device connecting electrodes, the temperature measuring device input electrode, and the temperature measuring device output electrode are disposed in corners of the temperature measuring device.
2. The piezoelectric device package of claim 1 , wherein the piezoelectric device has a first excitation electrode formed on an upper surface thereof and has a second excitation electrode formed on a lower surface thereof,
the first and second excitation electrodes being formed on corners of the lower surface of the piezoelectric device, respectively.
3. The piezoelectric device package of claim 2 , wherein the case has second piezoelectric device connecting electrodes formed in corners of a bottom surface of an inner portion thereof so as to correspond to the corners of the piezoelectric device on which the first and second excitation electrodes are formed.
4. The piezoelectric device package of claim 1 , wherein the piezoelectric device has dummy electrodes formed on a lower surface thereof.
5. The piezoelectric device package of claim 1 , wherein the cover member is formed of a metal.
6. The piezoelectric device package of claim 5 , wherein at least one of the plurality of terminals that are connected to the temperature measuring device input electrode or the temperature measuring device output electrode are also electrically connected to the cover member via a penetration part defined by the case, and
the case is constructed of ceramic or polymer.
7. A method of fabricating a piezoelectric device package, comprising:
mounting a piezoelectric device in a case including a plurality of terminals disposed on a lower external surface thereof;
coupling a cover member to an upper portion of the case; and
coupling a temperature measuring device having a thin film form to the lower external surface of the case, wherein
the plurality of terminals include a temperature measuring device input terminal, a temperature measuring device output terminal, a piezoelectric device input terminal, and a piezoelectric device output terminal, each disposed in corners of the lower external surface of the case,
the temperature measuring device includes first piezoelectric device connecting electrodes connected to the piezoelectric device input terminal, and the piezoelectric device output terminal,
the temperature measuring device includes a temperature measuring device input electrode and a temperature measuring device output electrode connected to the temperature measuring device input terminal and the temperature measuring device output terminal, respectively, and
the first piezoelectric device connecting electrodes, the temperature measuring device input electrode, and the temperature measuring device output electrode are disposed in corners of the temperature measuring device.