IP Library Granted Patent US 9,933,644
Granted Patent B2
US 9,933,644 · App. 14/547,693 · Granted Apr 3, 2018

Display module and multi-display device having the same

Inventors: Jong Seong Kim (Seoul, KR); Sang II Kim (Yongin-si, KR); Tae Hwan Kim (Seongnam-si, KR)
Assignee: Samsung Display Co., Ltd.
G02F1/13336H05K1/189H05K2201/10128
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Quick Facts
Patent No.
US 9,933,644
App. No.
14/547,693
Granted
Apr 3, 2018
Kind
B2
Abstract

A display module for a multi-display device includes an array substrate, connectors disposed on the array substrate and configured to transmit signals for driving the array substrate, a printed circuit board (PCB) electrically connected to the connectors and configured to transmit signals to the connectors, and connecting members that extend through the array substrate and configured to electrically connect the connectors and the PCB.

Claims (15)

1. A multi-display device, comprising:

a first array substrate;

a second array substrate disposed adjacent to the first array substrate;

first connectors disposed on the first array substrate and configured to transmit signals for driving the first array substrate;

second connectors disposed on the second array substrate and configured to transmit signals for driving the second array substrate;

a printed circuit board (PCB) configured to electrically connect and transmit signals to the first connectors and the second connectors;

first connecting members penetrating through the first array substrate and configured to electrically connect the first connectors and the PCB; and

second connecting members penetrating through the second array substrate and configured to electrically connect the second connectors and the PCB,

wherein:

the first and second array substrates each comprises a display region and a non-display region surrounding the display region; and

the first and second connectors are disposed only in the non-display region of the first and second array substrates, respectively.

2. The multi-display device of claim 1 , further comprising:

a driver IC chip disposed on the PCB.

3. The multi-display device of claim 1 , wherein the first connectors and the second connectors are disposed on opposite sides, respectively, of the first array substrate and the second array substrate.

4. The multi-display device of claim 1 , wherein the PCB is disposed along a boundary between the first array substrate and the second array substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 19, 2014
From: KIM, JONG SEONG; KIM, SANG IL; KIM, TAE HWAN
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 034211/0422 →
Priority Claims (1)
KR 10-2014-0075041 · Jun 19, 2014 · national
Continuity (1)
Related Publication 20150370113A1 · Dec 24, 2015