Adhesive composition
The present invention relates to an adhesive composition comprising a component A and a component B, wherein said component A comprises bisphenol A resin; a hydrophilic solvent, preferably acetone or ethanol or mixtures thereof; and silica gel (SiO 2 ) or alumina (Al 2 O 3 ) and said component B comprises aliphatic or aromatic polyamines, preferably polyamidoamines; polythiol; a combination of primary and tertiary amines, preferably 1-(2-aminoethyl)piperazine and ethylenediamine; optionally a hydrophilic solvent and optionally silica (SiO 2 ) or alumina (Al 2 O 3 ) gel. Said composition has the advantage that it cures, in addition to under dry conditions, in the presence of water or humidity in a time of 30 minutes as much and is flexible. The present invention also relates to a process for obtaining said adhesive composition. The present invention also relates to the use of the adhesive composition of the present invention for the bonding of any type of material, both in a medium with the presence of water and without it, and of materials where a flexible behavior is necessary.
1. Adhesive composition consisting essentially of a component A and a component B,
and, optionally, one or more additional components either in component A or in component B selected from the group consisting of: at least one ultraviolet light stabilizer, metal powder, at least one antioxidant, at least one antifungal agent, at least one water-miscible organic solvent, at least one viscosity-regulator agent and at least one thixotropic agent or mixtures thereof;
wherein
said component A consists essentially of:
bisphenol A epoxy resin;
a hydrophilic solvent;
silica (SiO 2 ) or alumina (Al 2 O 3 ) gel; and
optionally the one or more additional components;
and said component B consists essentially of:
aliphatic or aromatic polyamines;
polythiol;
a combination of primary and tertiary amines;
optionally a hydrophilic solvent, and
optionally silica (SiO 2 ) or alumina (Al 2 O 3 ) gel; and
optionally the one or more additional components;
wherein the hydrophilic solvent is acetone, ethanol or a mixture thereof;
wherein in component A: the bisphenol A epoxy resin is in a concentration between 35 and 45% by weight, the hydrophilic solvent is in a concentration between 10 and 15% by weight and the SiO 2 or Al 2 O 3 are in a concentration between 10 and 15% by weight, of the total composition;
wherein the combination of primary and tertiary amines is 1-(2-aminoethyl)piperazine and ethylenediamine;
wherein the aliphatic or aromatic polyamines are polyamidoamines; and,
wherein in component B: the aliphatic or aromatic polyamines are in a concentration between 30 and 40% by weight, the polythiol is in a concentration between 3 and 4.5% by weight, and the combination of primary and tertiary amines is in a concentration between 0.5 and 2.5% by weight, over the total composition.
2. Process for obtaining the composition according to claim 1 , comprising
initially mixing the components of B, also optionally with the components of A with the exception of the bisphenol A epoxy resin, and
subsequently mixing of the bisphenol A epoxy resin with the initial mixture if it already contains the remaining components of A or with the initial mixture and the remaining components of A if the initial mixture of the components of B was not mixed with the components of A.
3. A method of use of the composition according to claim 1 , comprising
bonding at least two materials with the composition of claim 1 ;
wherein the materials to be bonded are wood, metals, ceramics, polymerics or materials composed with mixtures of said materials.
4. A method of use of the composition according to claim 3 , wherein these materials have water in any of their physical states on their surface.
5. A method of use of the composition according to claim 3 , wherein the bonding zone between the composition and the surface of the material requires a flexible behaviour or with mobility.