Three-dimensional semiconductor memory device and method for manufacturing the same

1. A semiconductor memory device comprising:

a structural body including a plurality of electrode layers arranged in a first direction;

a first pillar, a second pillar, a third pillar, and a fourth pillar provided in the structural body, the first to fourth pillars extending along the first direction in the structural body;

a plurality of charge storage films provided between the first pillar and the electrode layers, between the second pillar and the electrode layers, between the third pillar and the electrode layers, and between the fourth pillar and the electrode layers;

a first interconnection extending in a second direction and electrically connected to the first pillar, the second direction crossing the first direction, a length of the first interconnection in the second direction being greater than a length of the first interconnection in the first direction;

a second interconnection extending in the second direction and electrically connected to the second pillar, a length of the second interconnection in the second direction being greater than a length of the second interconnection in the first direction;

a third interconnection extending in the second direction and electrically connected to the third pillar, a length of the third interconnection in the second direction being greater than a length of the third interconnection in the first direction; and

a fourth interconnection extending in the second direction and electrically connected to the fourth pillar, a length of the fourth interconnection in the second direction being greater than a length of the fourth interconnection in the first direction,

a first distance between the first pillar and the first interconnection in the first direction being greater than a second distance between the third pillar and the third interconnection in the first direction, and the first distance being greater than a third distance between the fourth pillar and the fourth interconnection in the first direction, and

a fourth distance between the second pillar and the second interconnection in the first direction being greater than the second distance, the fourth distance being greater than the third distance.

2. The device according to claim 1 , wherein

the second interconnection is disposed between the first interconnection and the fourth interconnection upon viewed from the first direction, and

the third interconnection is disposed between the first interconnection and the second interconnection upon viewed from the first direction.

3. The device according to claim 1 , wherein

at least a portion of the first interconnection overlaps at least a portion of the second interconnection in a third direction, the third direction crossing the first direction and the second direction, and

at least a portion of the third interconnection overlaps with at least a portion of the fourth interconnection in the third direction.

4. The device according to claim 1 , further comprising:

a first conductive member provided between the first pillar and the first interconnection, the first conductive member electrically connecting the first pillar to the first interconnection;

a second conductive member provided between the second pillar and the second interconnection, the second conductive member electrically connecting the second pillar to the second interconnection;

a third conductive member provided between the third pillar and the third interconnection, the third conductive member electrically connecting the third pillar to the third interconnection; and

a fourth conductive member provided between the fourth pillar and the fourth interconnection, the fourth conductive member electrically connecting the fourth pillar to the fourth interconnection;

wherein a length of the first conductive member in the first direction is longer than a length of the third conductive member in the first direction,

the length of the first conductive member is longer than a length of the fourth conductive member in the first direction,

a length of the second conductive member in the first direction is longer than the length of the third conductive member in the first direction, and

the length of the second conductive member is longer than the length of the fourth conductive member in the first direction.

5. The device according to claim 2 , wherein

the second pillar is disposed between the first pillar and the fourth pillar upon being viewed from the first direction, and

the third pillar is disposed between the second pillar and the fourth pillar upon being viewed from the first direction.

6. The device according to claim 2 , wherein

the first pillar is disposed between the third pillar and the fourth pillar upon being viewed from the first direction, and

the second pillar is disposed between the first pillar and the third pillar upon being viewed from the first direction.

7. The device according to claim 2 , wherein

the second pillar is disposed between the first pillar and the fourth pillar upon being viewed from the first direction, and

the third pillar is disposed between the first pillar and the second pillar upon being viewed from the first direction.

8. The device according to claim 4 , wherein the first conductive member includes:

a first portion;

a second portion provided on the first portion; and

a step portion provided between the first portion and the second portion, wherein

a first length of the first portion in the second direction is greater than a second length of the first portion in a third direction crossing the first direction and the second direction,

a third length of the second portion in the second direction is greater than a fourth length of the second portion in the third direction, and

a second length of the first portion in the third direction is greater than the fourth length of the second portion in the third direction.

9. The device according to claim 8 , wherein at least a portion of the second portion overlaps with at least a portion of the third interconnection and at least a portion of the fourth interconnection in the third direction.

10. The device according to claim 8 , wherein the step portion is provided between the third interconnection and the fourth interconnection in the first direction.

11. The device according to claim 8 , wherein the step portion is provided on the third interconnection and on the fourth interconnection.

12. The device according to claim 8 , wherein in the third direction crossing the first direction and the second direction, the second portion does not overlap the third interconnection and the fourth interconnection.

13. A method for manufacturing a semiconductor memory device, the method comprising:

forming a structural body that includes a plurality of first layers disposed in a first direction;

forming a first memory hole, a second memory hole, a third memory hole, and a fourth memory hole in the structural body, the first to fourth memory holes extending along the first direction;

forming a plurality of charge storage films on side walls of the first to fourth memory holes;

forming first to fourth pillars in the first to fourth memory holes respectively;

forming a first insulating film on the structural body;

forming a third conductive member in a region of the first insulating film above the third pillar, and forming a fourth conductive member in a region of the first insulating film above the fourth pillar;

forming a second insulating film on the first insulating film, the third conductive member, and the fourth conductive member;

forming in the second insulating film, a first groove extending in a second direction crossing the first direction, and a second groove extending in the second direction, the first groove including a portion on the third conductive member, the second groove including a portion on the fourth conductive member, a length of the first groove in the second direction being greater than a length of the first groove in the first direction, and a length of the second groove in the second direction being greater than a length of the second groove in the first direction;

forming a third interconnection within the first groove, and forming a fourth interconnection within the second groove;

forming a third insulating film on the second insulating film, the third interconnection, and the fourth interconnection;

forming within the third insulating film, a first conductive member directly above the first pillar, and a second conductive member directly above the second pillar;

forming a fourth insulating film on the third insulating film, the first conductive member, and the second conductive member;

forming a third groove extending in the second direction in a portion that includes a region of the fourth insulating film directly above the first conductive member, and forming a fourth groove extending in the second direction in a portion that includes a region of the fourth insulating film directly above the second conductive member, a length of the third groove in the second direction being greater than a length of the third groove in the first direction, and a length of the fourth groove in the second direction being greater than a length of the fourth groove in the first direction; and

forming a first interconnection within the third groove, and forming a second interconnection within the fourth groove.

14. The method according to claim 13 , further comprising forming a first side wall insulating film on a side wall of the first groove and on a side wall of the second groove, after forming the first groove and the second groove, and before forming the third interconnection and the fourth interconnection.

15. The method according to claim 13 , further comprising forming a second side wall insulating film on a side wall of the third groove and on a side wall of the fourth groove, after forming the third groove and the fourth groove, and before forming the first interconnection and the second interconnection.

16. The method according to claim 13 , wherein forming the first conductive member and the second conductive member includes:

forming holes above the first pillar and on the second pillar;

forming a third side wall insulating film on a side wall of the hole; and

providing conductive material within the holes.

17. The method according to claim 16 , wherein forming the first conductive member and the second conductive member further includes:

etching a portion of the third interconnection and a portion of the fourth interconnection using the holes, after forming the holes, and before forming the third side wall insulating film.