Low-profile power and data contacts
Contact structures that are readily manufactured, where contacts in the contact structures consume a minimal amount of surface area, depth, and volume in an electronic device.
1. An electronic device comprising:
a device enclosure having a plurality of openings;
a plurality of electrical contacts, each located in a corresponding opening in the plurality of openings in the device enclosure;
a plurality of insulators, each forming a ring between a corresponding electrical contact in the plurality of electrical contacts and the device enclosure; and
a flexible circuit board electrically connected to the plurality of electrical contacts.
2. The electronic device of claim 1 wherein each of the plurality of electrical contacts are soldered to the flexible circuit board.
3. The electronic device of claim 2 wherein the insulators are formed of plastic.
4. The electronic device of claim 3 further comprising a bracket behind the plurality of electrical contacts such that the plurality of electrical contacts are between the bracket and the device enclosure.
5. The electronic device of claim 4 wherein the bracket is glued to an inside surface of the device enclosure.
6. An electronic device comprising:
a device enclosure having a plurality of openings;
a plurality of electrical contacts, each located in a corresponding opening in the plurality of openings in the device enclosure;
an insulator, the insulator forming a plurality of rings, each ring between a corresponding electrical contact in the plurality of electrical contacts and the device enclosure; and
a flexible circuit board electrically connected to the plurality of electrical contacts.
7. The electronic device of claim 6 further comprising a bracket behind the plurality of electrical contacts such that the plurality of electrical contacts are between the bracket and the device enclosure.
8. The electronic device of claim 7 further comprising a silicone gasket between the insulator and the device enclosure.
9. The electronic device of claim 8 wherein the insulator is formed of plastic.
10. The electronic device of claim 9 wherein the flexible circuit board is attached to the insulator using a heat-activated film.
11. The electronic device of claim 1 wherein each of the plurality of insulators are attached to the device enclosure and each of the plurality of electrical contacts are attached to a corresponding one of the plurality of insulators using an adhesive.
12. The electronic device of claim 6 the insulator is attached to the device enclosure and each of the plurality of electrical contacts are attached to the insulator using an adhesive.
13. An electronic device comprising:
a device enclosure having a plurality of openings;
a plurality of electrical contacts in an insulating housing, each electrical contact having a contacting surface on a first side and located in a corresponding one of the plurality of openings in the device enclosure and a contacting portion on a second side opposing the first side;
a flexible circuit board attached to contacting portions of each of the plurality of electrical contacts;
a seal between the insulating housing and the device enclosure; and
a bracket to secure the insulating housing to the device enclosure.
14. The electronic device of claim 13 wherein the insulating housing is formed of plastic.
15. The electronic device of claim 13 wherein one of the plurality of openings is circular.
16. The electronic device of claim 15 wherein the seal is a gasket.
17. The electronic device of claim 16 wherein the flexible circuit board is attached to the insulating housing using a heat-activated film.
18. The electronic device of claim 13 wherein the bracket is behind the insulating housing such that the plurality of electrical contacts are between the bracket and the device enclosure.
19. The electronic device of claim 13 further comprising a shim between the insulating housing and the device enclosure.
20. The electronic device of claim 13 wherein the insulating housing is located in a recess in an inside surface of the device enclosure.