Rapid pulse annealing of CdZnTe detectors for reducing electronic noise
A combination of doping, rapid pulsed optical and/or thermal annealing, and unique detector structure reduces or eliminates sources of electronic noise in a CdZnTe (CZT) detector. According to several embodiments, methods of forming a detector exhibiting minimal electronic noise include: pulse-annealing at least one surface of a detector comprising CZT for one or more pulses, each pulse having a duration of ˜0.1 seconds or less. The at least one surface may optionally be ion-implanted. In another embodiment, a CZT detector includes a detector surface with two or more electrodes operating at different electric potentials and coupled to the detector surface; and one or more ion-implanted CZT surfaces on or in the detector surface, each of the one or more ion-implanted CZT surfaces being independently connected to one of the two or more electrodes and the surface of the detector. At least two of the ion-implanted surfaces are in electrical contact.
1. A method of forming a detector exhibiting minimal electronic noise, the method comprising:
pulse-annealing at least one surface of a detector comprising CdZnTe (CZT) for one or more pulses, each pulse being characterized by a duration of approximately 0.1 seconds or less.
2. The method as recited in claim 1 , further comprising chemically oxidating some or all portions of the at least one surface of the detector.
3. The method as recited in claim 1 , wherein the pulse-annealing comprises optical annealing; and
wherein the optical annealing is performed using at least one optical source selected from: a flash lamp, and a light emitting diode.
4. The method as recited in claim 1 , further comprising plasma etching some or all portions of the at least one surface of the detector.
5. The method as recited in claim 1 , wherein the pulse-annealing comprises thermal annealing using a chemical energy source.
6. The method as recited in claim 5 , wherein the thermal annealing comprises initiating a thermitic reaction on the at least one surface of the detector.
7. The method as recited in claim 5 , wherein the thermal annealing comprises: an exothermic intermetallic reaction.
8. The method as recited in claim 5 , wherein pulse-annealing the detector reduces dark current generated by the detector by a factor of at least 2 relative to a dark current generated by the detector prior to the pulse-annealing.
9. A method of forming a detector exhibiting minimal electronic noise, the method comprising:
pulse-annealing at least one surface of a detector comprising ion-implanted CdZnTe (CZT) for one or more pulses, each pulse being characterized by a duration of approximately 0.1 seconds or less.
10. The method as recited in claim 9 , further comprising chemically oxidating some or all portions of the at least one surface of the detector.
11. The method as recited in claim 9 , wherein the pulse-annealing comprises optical annealing; and
wherein the optical annealing is performed using at least one optical source selected from: a flash lamp, and a light emitting diode.
12. The method as recited in claim 9 , further comprising plasma etching some or all portions of the at least one surface of the detector.
13. The method as recited in claim 9 , wherein the pulse-annealing comprises thermal annealing using a chemical energy source.
14. The method as recited in claim 13 , wherein the thermal annealing comprises initiating a thermitic reaction on the at least one surface of the detector.
15. The method as recited in claim 13 , wherein the thermal annealing comprises: an exothermic intermetallic reaction initiated in a film in close proximity to the CZT.
16. The method as recited in claim 13 , wherein pulse-annealing the detector reduces dark current generated by the detector by a factor of at least 2 relative to a dark current generated by the detector prior to the pulse-annealing.
17. A CdZnTe (CZT) detector comprising:
a detector surface with two or more electrodes operating at different electric potentials and coupled to the detector surface; and
one or more ion-implanted CZT surfaces on or in the detector surface, each of the one or more ion-implanted CZT surfaces being independently connected to one of the two or more electrodes and the surface of the detector, wherein at least two of the ion-implanted surfaces are in electrical contact.
18. The detector of claim 17 , wherein the two or more electrodes are arranged in a coplanar grid.
19. The detector as recited in claim 17 , wherein the ion-implanted CZT surfaces comprise one or more ionic species of one or more materials selected from: Group III, Group V, and Group VII.
20. The detector as recited in claim 17 , comprising a passivating layer formed on the surface of the detector in a region between the electrodes.
21. The detector as recited in claim 17 , comprising one or more additional ion: implanted CZT surfaces on or in the detector surface, each of the one or more additional ion-implanted CZT surfaces being located in a region of the detector surface that is not connected to any of the two or more electrodes.
22. The detector as recited in claim 21 , wherein the one or more ion-implanted CZT surfaces comprise one or more ionic species of one or more materials selected from Group VII.