IP Library Granted Patent US 9,962,297
Granted Patent B2
US 9,962,297 · App. 14/301,426 · Granted May 8, 2018

Bonding apparatus and method

Inventors: Joseph Allen Eckstein (Sunman, IN); Hailing Bao (Blue Ash, OH); Robert Charles Dreisig (West Chester, OH); Howard Jay Kalnitz (Cincinnati, OH); Uwe Schneider (Cincinnati, OH)
Assignee: The Procter & Gamble Company
A61F13/15585A61F13/15577A61F13/15699A61F13/15707A61F13/15731A61F13/49011A61F13/51478B29C65/02B29C65/56B29C65/8223B29C66/1122B29C66/21B29C66/22B29C66/342B29C66/346B29C66/43B29C66/81429B29C66/83411B29C66/83415B29C66/83511A61F2013/15991B29C65/18B29C66/232B29C66/71B29C66/729B29C66/72343B29C66/81423B29C66/81433B29C66/929B29L2031/4878B31F2201/0733B31F2201/0738Y10T428/24521
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Quick Facts
Patent No.
US 9,962,297
App. No.
14/301,426
Granted
May 8, 2018
Kind
B2
Abstract

The present disclosure relates to methods and apparatuses for mechanically bonding substrates together. The apparatuses may include a pattern roll including a pattern element protruding radially outward. The pattern element includes a pattern surface and includes one or more channels adjacent the pattern surface. The pattern roll may be positioned adjacent an anvil roll to define a nip between the pattern surface and the anvil roll, wherein the pattern roll is biased toward the anvil roll to define a nip pressure between pattern surface and the anvil roll. As substrates advance between the pattern roll and anvil roll, the substrates are compressed between the anvil roll and the pattern surface to form a discrete bond region between the first and second substrates. As such, during the bonding process, some yielded substrate material flows from under the pattern surface and into the channel to form a channel grommet region.

Claims (9)

1. A method of bonding substrates, the method comprising the steps of:

rotating an anvil roll;

rotating a pattern roll adjacent the anvil roll, the pattern roll including a base circumferential surface and a pattern element, wherein the pattern element includes a pattern surface, and wherein the pattern element protrudes outward from the base circumferential surface to define a distance, Hp, between the pattern surface and the base circumferential surface, and wherein the pattern element is bounded by a perimeter, a channel in the pattern element, the channel having a first end portion and a second end portion, the first end portion located on the perimeter; and

advancing a first substrate and a second substrate in a machine direction between the pattern roll and the anvil roll; and

forming a discrete bond region between the first and second substrates by compressing the first substrate and the second substrate between the anvil roll and the pattern surface such that material of the first and second substrates is yielded, and wherein some yielded material between the pattern surface and the anvil roll is fused together and wherein some yielded material flows out from between the pattern surface and the anvil roll to the channel.

2. The method of claim 1 , wherein the channel divides the pattern surface to define a first pattern surface separated from a second pattern surface.

3. The method of claim 2 , wherein some yielded material flows out from between the first pattern surface and the second pattern surface and the anvil to the channel.

4. The method of claim 3 , wherein some yielded material flows out from between the first pattern surface and the anvil to outside the perimeter.

5. The method of claim 1 , further comprising the step of biasing the pattern roll toward the anvil roll to define a nip pressure from about 40,000 PSI to about 60,000 PSI between the pattern surface and the anvil roll.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 17, 2014
From: ECKSTEIN, JOSEPH ALLEN; BAO, HAILING; DREISIG, ROBERT CHARLES; KALNITZ, HOWARD JAY; SCHNEIDER, UWE
To: THE PROCTER & GAMBLE COMPANY
Reel/Frame 033117/0388 →
Continuity (2)
Provisional Application 61836690 · Jun 19, 2013
Related Publication 20140377506A1 · Dec 25, 2014