Capacitor and fabrication method thereof
A method for fabricating capacitor is disclosed. The method includes the steps of: providing a material layer; forming a first conductive layer, a first dielectric layer, and a second conductive layer on the material layer; patterning the first dielectric layer and the second conductive layer to form a patterned first dielectric layer and a middle electrode; forming a second dielectric layer on the first conductive layer and the middle electrode; removing part of the second dielectric layer to form a patterned second dielectric layer; forming a third conductive layer on the first conductive layer and the patterned second dielectric layer, wherein the third conductive layer contacts the first conductive layer directly; and removing part of the third conductive layer to expose part of the patterned second dielectric layer.
1. A capacitor, comprising:
a bottom electrode having a continuous planar top surface;
a first dielectric layer directly on the continuous planar top surface of the bottom electrode;
a middle electrode layer directly on the first dielectric layer, wherein the middle electrode layer and the first dielectric layer are simultaneously patterned into a first stack laterally adjacent to a second stack, directly on the continuous planar top surface of the bottom electrode, each of the first stack and the second stack having vertical sidewalls,
wherein the simultaneously patterning yields identical patterns for the first dielectric layer and the middle electrode layer from an overhead view, such that each of the vertical sidewalls of the first stack is planar and each of the sidewalls of the second stack is planar;
a second dielectric layer directly on and conformally covering each of the first stack, the second stack, and the continuous planar top surface of the bottom electrode, wherein the second dielectric layer is patterned to expose a peripheral portion of the continuous planar top surface of the bottom electrode;
a top electrode directly on and conformally covering a first portion of each of the first stack, the second stack, the second dielectric layer and the exposed peripheral portion of the continuous planar top surface of the bottom electrode, and
wherein the top electrode is patterned to expose a second portion of each of the first stack, the second stack, the second dielectric layer and the exposed peripheral portion of the continuous planar top surface of the bottom electrode.
2. The capacitor of claim 1 , wherein an edge of the top electrode is aligned with an edge of the bottom electrode.
3. The capacitor of claim 1 , wherein three edges of the top electrode are aligned with three edges of the bottom electrode.
4. The capacitor of claim 1 , further comprising a first contact plug contacting the first stack and the second stack.
5. The capacitor of claim 1 , further comprising a second contact plug contacting the top electrode.
6. The capacitor of claim 1 , further comprising a second contact plug contacting the bottom electrode.
7. The capacitor of claim 1 , wherein the first dielectric layer is selected from the group consisting of oxide-nitride-oxide (ONO), silicon nitride, silicon oxide, and silicon oxynitride.
8. The capacitor of claim 1 , wherein the first dielectric layer comprises a high-k dielectric layer.
9. The capacitor of claim 1 , wherein the second dielectric layer is selected from the group consisting of oxide-nitride-oxide (ONO), silicon nitride, silicon oxide, and silicon oxynitride.
10. The capacitor of claim 1 , wherein the second dielectric layer comprises a high-k dielectric layer.