Ball grid array rework
Embodiments relate to a method and apparatus for rework of a BGA package. Memory shape material is placed adjacent to a plurality of solder joints of the package. Stimulation is applied to the material, with the stimulation causing the material to change from a non-stimulated shape to a stimulated shape. This stimulation causes an expansion of the material. As the material expands, it exerts a tensile force on the BGA package and an adjacently positioned carrier, causing a separation of the two components, while mitigating collateral heat of adjacently positioned components.
1. A method comprising:
placing a material between a ball grid array (BGA) package and a printed circuit board;
stimulating the material, the stimulation expanding the material and increasing separation between the BGA package and the printed circuit board; and
the expansion separating one or more solder joints between the BGA and the printed circuit board.
2. The method of claim 1 , wherein the stimulation is by a thermal stimulus.
3. The method of claim 1 , wherein the material is placed interstitially with respect to the one or more solder joints between the BGA package and the printed circuit board.
4. The method of claim 3 , further comprising delivering heat to the solder joints concurrent with stimulation of the material.
5. The method of claim 3 , further comprising the expansion elongating the solder joints.
6. The method of claim 1 , wherein the material is placed around a perimeter of the one or more solder joints between the BGA package and the printed circuit board.
7. The method of claim 6 , further comprising delivering heat to the one or more solder joints concurrent with stimulation of the material.
8. The method of claim 6 , further comprising the expansion elongating the one or more solder joints.
9. The method of claim 1 , wherein the material is selected from the group consisting of: a memory shape alloy and a high z-axis coefficient of thermal expansion material.