Heat sink using graphite and light emitting device
A heat sink can include a fin using graphite, and a base with a high heat dissipation film formed on its surface to be provided with a high heat dissipation performance. The heat sink can include a base made of metal and a fin fixed to the base. The fin can include a graphite sheet. The base has a surface coated with a film having a higher heat dissipation property than that of the metal constituting the base. The film of the base is removed from at least the region where the fin is fixed, so that the fin is fixed to the metal constituting the base.
1. A heat sink comprising:
a base made of metal, the base having a surface coated with a film having a higher heat dissipation property than that of the metal constituting the base;
a fin fixed to the base, the fin including a graphite sheet; and
a structure configured to conduct heat of the base to the fin, the structure being provided in a region where the fin is fixed to the surface of the base, wherein
the structure configured to conduct heat is configured such that the film has a surface with irregularities and a filling layer is disposed on the surface of the film at the region where the fin is fixed, so that the irregularities of the film is filled with the filling layer, and
the filling layer is constituted by a material having a higher heat conductivity than air.
2. The heat sink according to claim 1 , wherein
the fin further includes a metal thin plate layered on the graphite sheet.
3. The heat sink according to claim 2 , wherein
the fin has a structure in which the graphite sheet is interposed between two of the metal thin plates.
4. The heat sink according to claim 2 , wherein
the fin is fixed to the base on a side of the metal thin plate.
5. The heat sink according to claim 1 , wherein
the fin has a bellows structure provided with mount-folded sections and valley-folded sections alternately arranged, and
the fin is fixed to the regions of the base at the valley-folded sections.
6. The heat sink according to claim 5 , wherein
at least any group of the mount-folded sections and the valley-folded sections is folded by a folded angle greater than 90 degrees.
7. The heat sink according to claim 5 , wherein
at least any group of the mount-folded sections and the valley-folded sections is constituted by a curved surface.
8. A light emitting device comprising:
an optical semiconductor element; and
a heat sink configured to dissipate heat generated by the optical semiconductor element, wherein
the heat sink includes:
a base made of metal, the base having a surface coated with a film having a higher heat dissipation property than that of the metal constituting the base;
a fin fixed to the base, the fin including a graphite sheet; and
a structure configured to conduct heat of the base to the fin, the structure being provided in a region where the fin is fixed to the surface of the base, wherein
the structure configured to conduct heat is configured such that the film has a surface with irregularities and a filling layer is disposed on the surface of the film at the region where the fin is fixed, so that the irregularities of the film is filled with the filling layer, and
the filling layer is constituted by a material having a higher heat conductivity than air.
9. The heat sink according to claim 1 , wherein the film is an anodized film.
10. The light emitting device according to claim 8 , wherein the film is an anodized film.
11. A heat sink comprising:
a base made of metal, the base having a surface coated with a film having a higher heat dissipation property than that of the metal constituting the base;
a fin fixed to the base, the fin including a graphite sheet and a metal thin plate layered on the graphite sheet; and
a structure configured to conduct heat of the base to the fin, the structure being provided in a region where the fin is fixed to the surface of the base, wherein
the structure configured to conduct heat is configured such that the film of the base is removed from at least the region where the fin is fixed, so that the fin is fixed to the metal constituting the base.
12. The heat sink according to claim 11 , wherein
the metal constituting the base is one selected from the group consisting of aluminum, copper, an alloy thereof, and an alloy of magnesium,
the metal thin plate of the fin is bonded to an exposed surface of the metal constituting the base at the region where the fin is fixed, and
the base and the fin at regions other than the region where the fin is fixed are provided with the film that is an anodized film having fine irregularities.
13. A light emitting device comprising:
an optical semiconductor element; and
a heat sink configured to dissipate heat generated by the optical semiconductor element, wherein
the heat sink includes:
a base made of metal, the base having a surface coated with a film having a higher heat dissipation property than that of the metal constituting the base;
a fin fixed to the base, the fin including a graphite sheet and a metal thin plate layered on the graphite sheet; and
a structure configured to conduct heat of the base to the fin, the structure being provided in a region where the fin is fixed to the surface of the base, wherein
the structure configured to conduct heat is configured such that the film of the base is removed from at least the region where the fin is fixed, so that the fin is fixed to the metal constituting the base,
the metal constituting the base is one selected from the group consisting of aluminum, copper, an alloy thereof, and an alloy of magnesium,
the metal thin plate of the fin is bonded to an exposed surface of the metal constituting the base at the region where the fin is fixed, and
the base and the fin at regions other than the region where the fin is fixed are provided with the film that is an anodized film having fine irregularities.