Wiring body assembly, structure with conductor layer, and touch sensor
A wiring body assembly includes a first wiring body that includes a first resin layer serving as a support layer and a first conductor layer provided on the first resin layer that includes a first terminal, a second wiring body that includes a third terminal, and a connection body that includes a resin material and conductive particle dispersed in the resin material. The connection body is interposed between the first and third terminals such that the first wiring body and the second wiring body are electrically connected. The first terminal includes terminal conductor wires arranged in the shape of a mesh and the connection body is in a gap between the terminal conductor wires.
1. A wiring body assembly comprising:
a first wiring body including a support layer and a conductor layer provided on the support layer and including a first terminal;
a second wiring body including a second terminal; and
a connection body including a resin material and conductive particles dispersed in the resin material and interposed between the first and second terminals such that the first wiring body and the second wiring body are electrically connected, wherein
the first terminal includes conductor wires arranged in the shape of a mesh,
the connection body is in a gap between the conductor wires,
the conductor wires define openings by crossing each other, and
the following Formula (2) is satisfied
D 1 ≤D 2 ×⅔ (2)
in the Formula (2), D 1 denotes a diameter of a circle inscribed in the openings and D 2 denotes the diameter of a conductive particle.
2. The wiring body assembly according to claim 1 , wherein the conductor wire faces the second terminal through the connection body, and includes a substantially flat surface having a linear shape in cross-sectional view.
3. The wiring body assembly according to claim 1 , wherein
the support layer is made of a resin material, and
a storage modulus of the resin material of the support layer at a temperature within a range of 130 to 200° C. is 10 MPa or more.
4. A structure with a conductor layer, the structure comprising:
the wiring body assembly according to claim 1 ; and
a support provided on at least one main surface of the first wiring body.
5. A touch sensor comprising:
the structure according to claim 4 .