Non-volatile memory device and method for fabricating the same
A non-volatile memory device may include a first well of a first conductive type formed over a substrate, a second well of a second conductive type formed over the substrate to contact the first well, a trench formed over the substrate on a border formed by the contact of the first well and the second well, and a memory gate having a memory layer formed over a surface of the trench, and a gate electrode formed to fill the trench over the memory layer.
1. A non-volatile memory device comprising:
a first well of a first conductive type formed over a substrate;
a second well of a second conductive type formed over the substrate to contact the first well;
a trench formed over the substrate on a border formed by the contact of the first well and the second well; and
a memory gate having a memory layer formed over a surface of the trench and a gate electrode formed to fill the trench over the memory layer,
wherein the memory gate, the first well and the second well extend longer in a first direction than a second direction which is orthogonal to the first direction.
2. The non-volatile memory device of claim 1 , further comprising:
a first junction region of a first conductive type formed in the first well, and
a second junction region of the first conductive type formed over the second well.
3. The non-volatile memory device of claim 1 , wherein the first well and the second well are disposed so that the border is disposed at a bottom of the trench.
4. The non-volatile memory device of claim 1 , wherein the memory layer includes a liner layer of an isolation structure.
5. The non-volatile memory device of claim 2 , wherein the first conductive type includes a P-type and the second conductive type includes an N-type.
6. A non-volatile memory device, comprising:
a plurality of first wells of a first conductive type formed over a substrate;
a plurality of second wells of a second conductive type formed over the substrate between the first wells to contact the first wells;
a plurality of trenches each formed over the substrate on each of a plurality of borders formed by the contacts of the second wells and the first wells; and
a plurality of memory gates each having a memory layer formed over a surface of each of the trenches and a gate electrode filling each of the trenches over the memory layer,
wherein a pair of the memory gates contacting the second well are provided the same bias during an operation thereby sharing the second well,
wherein each of the memory gates, the first wells and the second wells extend longer in a first direction than a second direction which is orthogonal to the first direction.
7. The non-volatile memory device of claim 6 , further comprising:
a plurality of first junction regions of the first conductive type each formed over each of the first wells; and
a second junction region of the first conductive type formed over the second well.
8. The non-volatile memory device of claim 7 , wherein the first junction regions are provided with the same bias during an operation.
9. The non-volatile memory device of claim 6 , wherein the first well and the second well are disposed so that the border is at a bottom of the trench.
10. The non-volatile memory device of claim 6 , wherein the memory layer includes a liner layer of an isolation structure.
11. The non-volatile memory device of claim 7 , wherein the first conductive type includes a P-type and the second conductive type includes an N-type.
12. A non-volatile memory device, comprising: a plurality of first wells of a first conductive type formed over a substrate, extended in a first direction, and spaced apart from each other in a second direction crossing the first direction; a plurality of second wells of a second conductive type formed over the substrate, extended in the first direction, and spaced apart from each other in the second direction, wherein adjacent first and second wells contact each other; a plurality of trenches each formed over the substrate on each of a plurality of borders formed by the contacts of the adjacent first and second wells; a plurality of memory gates each having a memory layer formed over a surface of each of the trenches and a gate electrode filling each of the trenches over the memory layer; a plurality of first junction regions of the first conductive type each formed over each of the first wells between the memory gates and spaced apart from each other in the first direction; and a plurality of second junction regions of the first conductive type each formed over each of the second wells between the memory gates and spaced apart from each other in the first direction.
13. The non-volatile memory device of claim 12 , further comprising:
a first pick-up region having a first impurity region of the first conductive type formed over one of the first wells; and
a second pick-up region having a second impurity region of the second conductive type formed over one of the second wells.
14. The non-volatile memory device of claim 12 , wherein each pair of the memory gates contacting each of the second wells are provided the same bias during an operation thereby sharing the contacting one of the second wells.
15. The non-volatile memory device of claim 12 , wherein the first wells and the second wells are alternately disposed in a second direction.
16. The non-volatile memory device of claim 12 , wherein the trenches are extended in the first direction and spaced apart in a second direction.
17. The non-volatile memory device of claim 12 , wherein each of the borders is disposed at each bottom of the trenches.
18. The non-volatile memory device of claim 12 , wherein the first junction region and the second junction region are symmetrically disposed about the memory gate in the second direction.
19. The non-volatile memory device of claim 12 , wherein the memory layer includes a liner layer of an isolation structure.
20. The non-volatile memory device of claim 12 , wherein the first conductive type includes a P-type and the second conductive type includes an N-type.