Temperature control system, semiconductor manufacturing device, and temperature control method

1. A temperature control system for controlling a temperature of a member used in a semiconductor manufacturing device, the temperature control system comprising:

a first temperature adjustment unit that includes a first heat exchange unit that is configured to adjust fluid to a first temperature and a first tank that is configured to store the fluid that is adjusted to the first temperature by the first heat exchange unit;

a second temperature adjustment unit that includes a second heat exchange unit that is configured to adjust fluid to a second temperature, which is higher than the first temperature, and a second tank that is configured to store the fluid that is adjusted to the second temperature by the second heat exchange unit;

a low-temperature flow path for passing fluid supplied from the first temperature adjustment unit;

a high-temperature flow path for passing fluid supplied from the second temperature adjustment unit;

a bypass flow path for circulating fluid;

a combination flow path for passing fluid from the low-temperature flow path, the high-temperature flow path, and the bypass flow path merged at a merging part;

a temperature adjustment part that is arranged at or near the member and is configured to pass fluid from the combination flow path and cool or heat the member;

variable valves attached to the low-temperature flow path, the high-temperature flow path, and the bypass flow path at an upstream side of the merging part;

a control device that controls valve positions of the variable valves and adjusts a flow rate distribution ratio for the low-temperature flow path, the high-temperature flow path, and the bypass flow path, and

a fluid level adjustment tank that is directly and independently connected to the first tank via a first pipe and also directly and independently connected to the second tank via a second pipe, and that is configured to cancel a level gap between the first tank and the second tank when controlling the temperature of the fluid by the first and second temperature adjustment units, thereby maintaining a fluid level balance between the first tank and the second tank,

wherein the fluid level adjustment tank is configured to keep a height of each of the fluid level adjustment tank, the first tank and the second tank the same as each other.

2. The temperature control system as claimed in claim 1 , wherein the control device adjusts the valve positions of the variable valves attached to the low-temperature flow path, the high-temperature flow path, and the bypass flow path, and controls a merging flow rate of fluid flowing in the combination flow path to be uniform.

3. The temperature control system as claimed in claim 1 , further comprising:

a first temperature sensor that detects the temperature of the member; and

a second temperature sensor that detects a temperature of the combination flow path at a downstream side of the merging part;

wherein the control device feedback-controls the valve positions of the variable valves based on the temperatures detected by the first temperature sensor and the second temperature sensor.

4. The temperature control system as claimed in claim 1 , wherein

the combination flow path forms a circulation path for circulating fluid by passing the fluid through the temperature adjustment part and prompting the fluid to branch out to the low-temperature flow path, the high-temperature flow path, and the bypass flow path at a branching part; and

the control device controls a flow rate of the fluid circulating in the temperature adjustment part to be constant.

5. The temperature control system as claimed in claim 1 , wherein the merging part includes a temporary tank for mixing the fluids flowing in the low-temperature flow path, the high-temperature flow path, and the bypass flow path.

6. The temperature control system as claimed in claim 1 , wherein

while raising the temperature, the control device controls the valve positions of the variable valves such that an amount of fluid flowing into the combination flow path from the high-temperature flow path is greater than an amount of fluid flowing into the combination flow path from the low-temperature flow path and an amount of fluid flowing into the combination flow path from the bypass flow path; and

while lowering the temperature, the control device controls the valve positions of the variable valves such that the amount of fluid flowing into the combination flow path from the low-temperature flow path is greater than the amount of fluid flowing into the combination flow path from the high-temperature flow path and the amount of fluid flowing into the combination flow path from the bypass flow path.

7. The temperature control system as claimed in claim 1 , wherein

the member is an electrostatic chuck on which a workpiece is placed;

the temperature adjustment part is divided into a first flow path arranged at a center portion of the electrostatic chuck and a second flow path arranged at an edge portion of the electrostatic chuck; and

the temperature control system includes a first temperature control system that is configured to control a temperature of the center portion of the electrostatic chuck by passing fluid through the first flow path, and a second temperature control system that is configured to control a temperature of the edge portion of the electrostatic chuck by passing fluid through the second flow path.

8. The temperature control system as claimed in claim 7 , wherein the first temperature adjustment unit including a first circulation pump and the second temperature adjustment unit including a second circulation pump are provided to each of the first temperature control system and the second temperature control system.

9. The temperature control system as claimed in claim 7 , wherein the first temperature adjustment unit including a first circulation pump and the second temperature adjustment unit including a second circulation pump are commonly provided to and shared by the first temperature control system and the second temperature control system.

10. A semiconductor manufacturing device that controls a temperature of an internal member using a temperature control system, the semiconductor manufacturing device comprising:

the temperature control system, which includes

a first temperature adjustment unit that includes a first heat exchange unit that is configured to adjust fluid to a first temperature and a first tank that is configured to store the fluid that is adjusted to the first temperature by the first heat exchange unit;

a second temperature adjustment unit that includes a second heat exchange unit that is configured to adjust fluid to a second temperature, which is higher than the first temperature, and a second tank that is configured to store the fluid that is adjusted to the second temperature by the second heat exchange unit;

a low-temperature flow path for passing fluid supplied from the first temperature adjustment unit;

a high-temperature flow path for passing fluid supplied from the second temperature adjustment unit;

a bypass flow path for circulating fluid;

a combination flow path for passing fluid from the low-temperature flow path, the high-temperature flow path, and the bypass flow path merged at a merging part;

a temperature adjustment part that is arranged at or near the internal member and is configured to pass fluid from the combination flow path and cool or heat the internal member;

variable valves attached to the low-temperature flow path, the high-temperature flow path, and the bypass flow path at an upstream side of the merging part;

a control device that controls valve positions of the variable valves and adjusts a flow rate distribution ratio for the low-temperature flow path, the high-temperature flow path, and the bypass flow path, and

a fluid level adjustment tank that is directly and independently connected to the first tank via a first pipe and also directly and independently connected to the second tank via a second pipe, and that is configured to cancel a level gap between the first tank and the second tank when controlling the temperature of the fluid by the first and second temperature adjustment units, thereby maintaining a fluid level balance between the first tank and the second tank,

wherein the fluid level adjustment tank is configured to keep a height of each of the fluid level adjustment tank, the first tank and the second tank the same as each other.

11. The semiconductor manufacturing device as claimed in claim 10 , wherein the internal member of the semiconductor manufacturing device includes at least one of an electrostatic chuck, an upper electrode, a deposit shield, and a processing chamber.

12. A temperature control method for controlling a temperature of a member used in a semiconductor manufacturing device, the temperature control method comprising the steps of:

adjusting fluid to a first temperature by a first heat exchanger unit of a first temperature adjustment unit;

storing the fluid that is adjusted to the first temperature in a first tank of the first temperature adjustment unit;

adjusting fluid to a second temperature by a second heat exchanger unit of a second temperature adjustment unit;

storing the fluid that is adjusted to the second temperature, which is higher than the first temperature, in a second tank of the second temperature adjustment unit;

passing fluid supplied from the first temperature adjustment unit through a low-temperature flow path;

passing fluid supplied from the second temperature adjustment unit through a high-temperature flow path;

circulating fluid through a bypass flow path;

merging the fluids flowing in the low-temperature flow path, the high-temperature flow path, and the bypass flow path at a merging part and passing the merged fluid through a combination flow path;

passing fluid from the combination flow path through a temperature adjustment part arranged at or near the member and cooling or heating the member;

controlling valve positions of variable valves attached to the low-temperature flow path, the high-temperature flow path, and the bypass flow path at an upstream side of the merging part, and adjusting a flow rate distribution ratio for the low-temperature flow path, the high-temperature flow path, and the bypass flow path,

cancelling a level gap between the first tank and the second tank when controlling the temperature of the fluid by the first and second temperature adjustment units, thereby maintaining a fluid level balance between the first tank and the second tank by a fluid level adjustment tank that is directly and independently connected to the first tank via a first pipe and also directly and independently connected to the second tank via a second pipe, and

keeping a height of each of the fluid level adjustment tank, the first tank and the second tank the same as each other.