Systems and methods for fabricating single-crystalline diamond membranes
A buffer layer is employed to fabricate diamond membranes and allow reuse of diamond substrates. In this approach, diamond membranes are fabricated on the buffer layer, which in turn is disposed on a diamond substrate that is lattice-matched to the diamond membrane. The weak bonding between the buffer layer and the diamond substrate allows ready release of the fabricated diamond membrane. The released diamond membrane is transferred to another substrate to fabricate diamond devices, while the diamond substrate is reused for another fabrication.
1. A method of fabricating a diamond device, the method comprising:
disposing a buffer layer on a diamond substrate;
forming a diamond membrane comprising single-crystalline diamond on the buffer layer; and
transferring the diamond membrane from the diamond substrate to a host substrate.
2. The method of claim 1 , wherein disposing the buffer layer comprises disposing a graphene layer on the diamond substrate.
3. The method of claim 2 , wherein disposing the graphene layer comprises disposing a single-crystalline graphene layer.
4. The method of claim 2 , wherein disposing the graphene layer comprises:
forming the graphene layer on a copper foil; and
transferring the graphene layer from the copper foil to the diamond substrate.
5. The method of claim 2 , wherein the graphene layer comprises more than one layer of graphene and forming the diamond membrane comprises using the graphene layer as a seed for the diamond membrane.
6. The method of claim 5 , wherein the graphene layer has a thickness greater than 8.5 Å.
7. The method of claim 2 , wherein the graphene layer consists of a single layer of graphene and forming the diamond membrane on the graphene layer comprises using the diamond substrate as a seed for the diamond membrane and using the graphene layer as a release layer.
8. The method of claim 1 , wherein transferring the diamond membrane comprises:
forming a stressor layer on the diamond membrane;
pulling the stressor layer and the diamond membrane off the buffer layer; and
disposing the stressor layer and the diamond membrane on the host substrate.
9. The method of claim 8 , further comprising:
removing the stressor layer via etching.
10. The method of claim 8 , wherein the stressor layer comprises nickel.
11. The method of claim 8 , wherein the stressor layer has a thickness of about 1 μm to about 30 μm.
12. The method of claim 1 , wherein the buffer comprises at least one of silicon or germanium, and transferring the diamond membrane comprises:
etching away the buffer layer to release the diamond membrane; and
disposing the diamond membrane to the host substrate.
13. The method of claim 12 , wherein etching away the buffer layer comprises exposing the buffer layer to an etching solution comprising at least one of KOH or Tetramethylammonium hydroxide (TMAH).
14. A device formed by the method of claim 1 .
15. A method of diamond processing, the method comprising:
forming a graphene layer having a thickness substantially equal to or less than 2 nm on a copper foil;
transferring the graphene layer from the copper foil to a diamond substrate;
forming a first single-crystalline diamond membrane on the graphene layer using the diamond substrate as a seed for the single-crystalline diamond membrane;
removing the first single-crystalline diamond membrane from the graphene layer;
forming a second single-crystalline diamond membrane on the graphene layer using the diamond substrate as a seed for the second single-crystalline diamond membrane; and
removing the second single-crystalline diamond membrane from the graphene layer.
16. The method of claim 15 , wherein removing the first single-crystalline diamond membrane comprises exfoliating the first single-crystalline diamond membrane.
17. A device formed by the method of claim 15 .
18. A method of diamond processing, the method comprising:
forming a graphene layer on a first substrate;
transferring the graphene layer from the first substrate to a diamond substrate;
depositing a diamond layer on the graphene layer;
depositing a stressor layer on the diamond layer, the stressor layer causing propagation of a crack between the diamond layer and the graphene layer; and
disposing a flexible tape on the stressor layer; and
pulling the diamond layer and the stressor layer off the graphene layer with the flexible tape.