Image sensor having improved dicing properties, manufacturing apparatus, and manufacturing method of the same
The present technology relates to techniques of preventing intrusion of moisture into a chip. Various illustrative embodiments include image sensors that include: a substrate; a plurality of layers stacked on the substrate; the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer; the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and a transparent resin layer formed above the photodiode layer and formed in the groove. The present technology can be applied to, for example, an image sensor.
1. An image sensor, comprising:
a substrate;
a plurality of layers stacked on the substrate;
the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer;
the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and
a transparent resin layer formed above the photodiode layer and formed in the groove, wherein the groove includes a portion of the substrate such that the portion of the substrate is excavated.
2. The image sensor according to claim 1 , further comprising a first and a second through electrode, wherein the first and the second through electrode each have a sidewall protecting portion, and wherein the groove includes at least a portion of the sidewall protecting portions.
3. The image sensor according to claim 1 , further comprising a passivation film formed in the groove.
4. The image sensor according to claim 3 , further comprising a microlens layer formed above the photodiode layer, wherein the passivation film is formed on the microlens layer.
5. The image sensor according to claim 1 , further comprising a rib formed in the transparent resin layer.
6. The image sensor according to claim 5 , further comprising a passivation film formed in the groove and the rib.
7. An image sensor, comprising:
a substrate;
a plurality of layers stacked on the substrate;
the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer;
the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and
a transparent resin layer formed above the photodiode layer and formed in the groove, wherein the groove includes a portion of the photodiode layer such that the portion of the photodiode layer is excavated.
8. The image sensor according to claim 7 , further comprising a first and a second through electrode, wherein the first and the second through electrode each have a sidewall protecting portion, and wherein the groove includes at least a portion of the sidewall protecting portions.
9. The image sensor according to claim 7 , further comprising a passivation film formed in the groove.
10. The image sensor according to claim 9 , further comprising a microlens layer formed above the photodiode layer, wherein the passivation film is formed on the microlens layer.
11. The image sensor according to claim 7 , further comprising a rib formed in the transparent resin layer.
12. The image sensor according to claim 11 , further comprising a passivation film formed in the groove and the rib.
13. An image sensor, comprising:
a substrate;
a plurality of layers stacked on the substrate;
the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer;
the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated;
a transparent resin layer formed above the photodiode layer and formed in the groove;
a first and a second through electrode, wherein the first and the second through electrode each have a sidewall protecting portion, wherein the groove includes at least a portion of the sidewall protecting portions; and
a material of the second through electrode that fills the groove.
14. The image sensor according to claim 13 , further comprising a rib formed in the transparent resin layer.
15. The image sensor according to claim 13 , further comprising a passivation film formed in the groove.
16. The image sensor according to claim 15 , further comprising a microlens layer formed above the photodiode layer, wherein the passivation film is formed on the microlens layer.
17. An image sensor, comprising:
a substrate;
a plurality of layers stacked on the substrate;
the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer;
the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and
a transparent resin layer formed above the photodiode layer and formed in the groove;
a transparent resin layer formed above the photodiode layer;
a transparent member formed on the transparent resin layer; and
a moisture resistant film formed in the groove,
wherein the groove includes an excavated portion of the transparent member layer.
18. An image sensor, comprising:
a substrate;
a plurality of layers stacked on the substrate;
the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer;
the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and
a transparent resin layer formed above the photodiode layer and formed in the groove;
a transparent resin layer formed above the photodiode layer; and
a transparent member formed on the transparent resin layer,
wherein the groove extends to a bottom surface of the substrate, the transparent member covers a side surface of the groove, and the transparent resin layer is formed between the transparent member and a side surface of the substrate.
19. An image sensor, comprising:
a substrate;
a plurality of layers stacked on the substrate;
the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer;
the plurality of layers including at least one layer having a groove formed such that a portion of the at least one layer is excavated; and
a transparent resin layer formed above the photodiode layer and formed in the groove; and
a hydrophobic film formed in the groove.
20. A method, comprising:
forming a plurality of layers stacked on a substrate, the plurality of layers including a photodiode layer having a plurality of photodiodes formed on a surface of the photodiode layer;
forming a groove in at least one layer in the plurality of layers, the groove being formed such that the at least one layer is excavated; and
a transparent resin layer formed above the photodiode layer and formed in the groove, wherein the groove includes a portion of the substrate such that the portion of the substrate is excavated.