Printed circuit board and optical module comprising solder resist having no contact with an electro-conductive contact sheet group on a same substrate
The application provides a printed circuit board and an optical module so as to alleviate poor contact between the electro-conductive contact sheet group and the clamping piece due to the solder resist. The printed circuit board includes a substrate, and electro-conductive wirings and electro-conductive contact sheet group both laid on the surface of the substrate, where the substrate is overlaid with solder resist, and the solder resist has no contact with the electro-conductive contact sheet group.
1. A printed circuit board, comprising:
a substrate,
electro-conductive wirings, and
an electro-conductive contact sheet group;
both the electro-conductive wirings and the electro-conductive contact sheet group are laid on the surface of the substrate, the substrate is overlaid with solder resist, and the solder resist has no contact with the electro-conductive contact sheet group.
2. The printed circuit board according to claim 1 , a thickness of the solder resist is more than a thickness of the electro-conductive contact sheet group.
3. The printed circuit board according to claim 1 , the electro-conductive wirings laid on the surface of the substrate are overlaid with the solder resist, a thickness of the electro-conductive wirings is almost equal to a thickness of the electro-conductive contact sheet group.
4. The printed circuit board according to claim 1 , the electro-conductive wirings laid on the surface of the substrate are not overlaid with the solder resist.
5. The printed circuit board according to claim 1 , a distance between the solder resist and the electro-conductive contact sheet group ranges from 0.6 mm to 1 mm.
6. The printed circuit board according to claim 5 , the distance between the solder resist and the electro-conductive contact sheet group is almost 0.8 mm.
7. The printed circuit board according to claim 5 , the electro-conductive contact sheet group comprises a number of electro-conductive contact sheets with a same length, and the distance between the solder resist and the electro-conductive contact sheet group refers to a distance between the solder resist and any one of the electro-conductive contact sheets.
8. The printed circuit board according to claim 5 , the electro-conductive contact sheet group comprises a number of electro-conductive contact sheets with different lengths, and the distance between the solder resist and the electro-conductive contact sheet group refers to a largest one of distances between the solder resist and the electro-conductive contact sheets.
9. The printed circuit board according to claim 1 , the solder resist is liquid photoinduced solder resist.
10. The printed circuit board according to claim 9 , the liquid photoinduced solder resist is green liquid photoinduced solder resist.
11. An optical module, comprising:
an optical transmitter,
an optical receiver, and
a printed circuit board;
the printed circuit board comprises:
a substrate,
electro-conductive wirings, and
an electro-conductive contact sheet group;
both the electro-conductive wirings and the electro-conductive contact sheet group are laid on the surface of the substrate, the substrate is overlaid with solder resist, and the solder resist has no contact with the electro-conductive contact sheet group.
12. The optical module according to claim 11 , a thickness of the solder resist is more than a thickness of the electro-conductive contact sheet group.
13. The optical module according to claim 11 , the electro-conductive wirings are overlaid with the solder resist, a thickness of the electro-conductive wirings is almost equal to a thickness of the electro-conductive contact sheet group.
14. The optical module according to claim 11 , the electro-conductive wirings are not overlaid with the solder resist.
15. The optical module according to claim 11 , a distance between the solder resist and the electro-conductive contact sheet group ranges from 0.6 mm to 1 mm.
16. The optical module according to claim 15 , the distance between the solder resist and the electro-conductive contact sheet group is 0.8 mm.
17. The optical module according to claim 15 , the electro-conductive contact sheet group comprise a number of electro-conductive contact sheets with a same length, and the distance between the solder resist and the electro-conductive contact sheet group refers to a distance between the solder resist and any one of the electro-conductive contact sheets.
18. The optical module according to claim 15 , the electro-conductive contact sheet group comprise a number of electro-conductive contact sheets with different lengths, and the distance between the solder resist and the electro-conductive contact sheet group refers to a largest one of distances between the solder resist and the electro-conductive contact sheets.
19. The optical module according to claim 11 , the solder resist is liquid photoinduced solder resist.
20. The optical module according to claim 19 , the liquid photoinduced solder resist is green liquid photoinduced solder resist.