Method of forming chalcogenide comprising devices
View Patent ↗A method of forming a non-volatile resistance variable device includes forming a first conductive electrode material on a substrate. A metal doped chalcogenide comprising material is formed over the first conductive electrode material. Such comprises the metal and A x B y , where “B” is selected from S, Se and Te and mixtures thereof, and where “A” comprises at least one element which is selected from Group 13, Group 14, Group 15, or Group 17 of the periodic table. In one aspect, the chalcogenide comprising material is exposed to and HNO 3 solution. In one aspect the outer surface is oxidized effective to form a layer comprising at least one of an oxide of “A” or an oxide of “B”. In one aspect, a passivating material is formed over the metal doped chalcogenide comprising material. A second conductive electrode material is deposited, and a second conductive electrode material of the device is ultimately formed therefrom.
1. A method of forming a chalcogenide comprising device comprising:
forming a first conductive electrode material on a substrate;
forming a metal doped chalcogenide comprising material over the first conductive electrode material, the chalcogenide comprising material comprising the metal and A x B y , where “B” is selected from the group consisting of S, Se and Te and mixtures thereof, and where “A” comprises at least one element which is selected from Group 13, Group 14, Group 15, or Group 17 of the periodic table, the metal doped chalcogenide comprising material having an outer surface, the outer surface having an uneven surface characteristic;
forming a discontinuous layer of passivating material over portions of the outer surface of the metal doped chalcogenide comprising material; and
depositing a second conductive electrode material over the metal doped chalcogenide comprising material and the passivating material, and forming the second conductive electrode material into an electrode of the device
wherein the discontinuous layer of passivating material is sufficient to improve the uneven surface characteristic such that after subsequent deposition of the second conductive electrode material on the outer surface, the chalcogenide comprising material is protected from being etched.
2. The method of claim 1 wherein the forming of the discontinuous layer of passivating material comprises exposing the substrate to a temperature elevated from ambient room temperature prior to depositing the second conductive electrode material.
3. The method of claim 1 wherein the passivating material is formed to a thickness from 1 Angstrom to 100 Angstroms.
4. The method of claim 1 wherein the passivating material is formed to a thickness from 1 Angstrom to 50 Angstroms.
5. The method of claim 1 , wherein the uneven surface characteristic is in the form of nodules.
6. The method of claim 5 , wherein the nodules are semicircular.
7. The method of claim 5 , wherein the nodules are formed of a material selenide.
8. The method of claim 7 , wherein the metal selenide is silver selenide.
9. The method of claim 5 , wherein the nodules are from 50 Angstroms to 20 micrometers across.
10. The method of claim 1 , wherein the uneven surface characteristic is the result of metal doping of a chalcogenide glass.
11. The method of claim 10 , wherein the chalcogenide glass includes selenium and germanium.
12. A method of forming a chalcogenide comprising device, comprising:
forming a first conductive electrode material on a substrate;
forming a metal doped chalcogenide comprising material over the first conductive electrode material, the chalcogenide comprising material comprising the metal and A x B y , where “B” is selected from the group consisting of S, Se and Te and mixtures thereof, and where “A” comprises at least one element which is selected from Group 13, Group 14, Group 15, or Group 17 of the periodic table, the metal doped chalcogenide comprising material having an outer surface with an uneven surface characteristic;
forming a discontinuous layer of passivating material on the outer surface of the metal doped chalcogenide comprising material by exposing the outer surface to an atmosphere having a temperature elevated from ambient room temperature; and
depositing a second conductive electrode material over the metal doped chalcogenide comprising material and the passivating material, and forming the second conductive electrode material into an electrode of the device,
wherein the discontinuous layer of passivating material is sufficient to improve the uneven surface characteristic such that after the subsequent deposition of the second conductive electrode material on the outer surface, the chalcogenide comprising material is protected from being etched.
13. The method of claim 12 wherein the atomosphere comprises oxygen.
14. The method of claim 12 wherein the atmosphere is substantially void of oxygen.
15. The method of claim 12 wherein the passivating material comprises an outer portion of the metal doped chalcogenide comprising material which is at least in part characterized by a higher concentration of “A” than metal doped chalcogenide comprising material immediately inwardly thereadjacent.
16. The method of claim 12 , wherein the uneven surface characteristic is in the form of semicircular nodules.
17. The method of claim 16 , wherein the nodules are from 50 Angstroms to 20 micrometers across.
18. The method of claim 12 , wherein the uneven surface characteristic results from a metal selenium oxide formed as the result of silver doping of a chalcogenide glass.
19. A method of forming a chalcogenide comprising device comprising:
forming a first conductive electrode material on a substrate;
forming a metal doped chalcogenide comprising material over the first conductive electrode material, the chalcogenide comprising material comprising the metal and A x B y , where “B” is selected from the group consisting of S, Se and Te mixtures thereof, and where “A” comprises at least one element which is selected from Group 13, Group 14, Group 15, or Group 17 of the periodic table, the metal doped chalcogenide comprising material having an outer surface, the outer surface having an uneven surface characteristic;
forming a discontinuous layer of passivating material over portions of the outer surface of the metal doped chalcogenide comprising material; and
depositing a second conductive electrode material over the metal doped chalcogenide comprising material and the passivating material, and forming the second conductive electrode material into an electrode of the device,
wherein the discontinuous layer of passivating material is sufficient to improve the uneven surface characteristic such that after subsequent deposition of a second conductive electrode material on the outer surface, the chalcogenide comprising material is not exposed through the second conductive electrode.
20. A method of forming a chalcogenide comprising device, comprising:
forming a first conductive electrode material on a substrate;
forming a metal doped chalcogenide comprising material over the first conductive electrode material, the chalcogenide comprising material comprising the metal and A x B y , where “B” is selected from the group consisting of S, Se and Te and mixtures thereof, and where “A” comprises at least one element which is selected from Group 13, Group 14, Group 15, or Group 17 of the periodic table, the metal doped chalcogenide comprising material having an outer surface with an uneven surface characteristic;
forming a discontinuous layer of passivating material on the outer surface of the metal doped chalcogenide comprising material; and
depositing a second conductive electrode material over the metal doped chalcogenide comprising material and the passivating material, and forming the second conductive electrode material into an electrode of the device,
wherein the discontinuous layer of passivating material is sufficient to improve the uneven surface characteristic such that after subsequent deposition of the second conductive electrode material on the outer surface, the chalcogenide comprising material is not exposed through the second conductive electrode.
21. A method of forming a chalcogenide comprising device comprising:
forming a first conductive electrode material on a substrate;
forming a metal doped chalcogenide material comprising germanium and selenium over the first conductive electrode material, the metal doped chalcogenide material having an outer surface, the outer surface having an uneven surface characteristic;
forming a discontinuous layer of passivating material over portions of the outer surface of the metal doped chalcogenide material; and
depositing a second conductive electrode material over the metal doped chalcogenide material and the passivating material, and forming the second conductive electrode material into an electrode of the device
wherein the discontinuous layer of passivating material is sufficient to improve the uneven surface characteristic of the outer surface.
22. The method of claim 21 , wherein the uneven surface characteristic is improved such that after subsequent deposition of the second conductive electrode material on the outer surface, the chalcogenide layer is protected from being etched.
23. The method of claim 21 , wherein the uneven surface characteristic is improved such that after subsequent deposition of the second conductive electrode material on the outer surface, the chalcogenide layer is not exposed through the second conductive electrode.
24. A method of forming a chalcogenide comprising device, comprising:
forming a first conductive electrode material on a substrate;
forming a chalcogenide layer comprising a metal doped germanium and selenium chalcogenide over the first conductive electrode material, the chalcogenide layer having an outer surface with an uneven surface characteristic;
forming a discontinuous layer of passivating material on the outer surface of the metal doped chalcogenide layer; and
depositing a second conductive electrode material over the metal doped chalcogenide layer and the passivating material, and forming the second conductive electrode material into an electrode of the device,
wherein the discontinuous layer of passivating material is sufficient to improve the uneven surface characteristic.
25. The method of claim 24 , wherein the uneven surface characteristic is improved such that after subsequent deposition of the second conductive electrode material on the outer surface, the chalcogenide layer is protected from being etched.
26. The method of claim 24 , wherein the uneven surface characteristic is improved such that after subsequent deposition of the second conductive electrode material on the outer surface, the chalcogenide layer is not exposed through the second conductive electrode.