IP Library Granted Patent US 6,975,007
Granted Patent B2
US 6,975,007 · App. 10/456,529 · Granted Dec 13, 2005

Semiconductor device including a polysilicon, barrier structure, and tungsten layer electrode

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Quick Facts
Patent No.
US 6,975,007
App. No.
10/456,529
Granted
Dec 13, 2005
Kind
B2
Abstract

An electrode on a semiconductor substrate includes a polysilicon layer, a silicon-implanted layer on the polysilicon layer, a tungsten nitride layer on the silicon-implanted layer, a tungsten nitride layer on the silicon-implanted layer, and a tungsten layer on the tungsten nitride layer. The layer between the polysilicon layer and the tungsten nitride layer may be either a tungsten silicon nitride layer or a silicon-germanium layer.

Claims (5)

1. A semiconductor device comprising an electrode on a semiconductor substrate, wherein said electrode includes:

a polysilicon layer;

a silicon-germanium layer as an intermediate layer on said polysilicon layer;

a tungsten nitride layer on said intermediate layer; and

a tungsten layer on said tungsten nitride layer.

Assignments (4)
CHANGE OF ADDRESS Recorded Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
CHANGE OF NAME Recorded Sep 8, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024953/0224 →
RE-RECORD TO CORRECT THE RECEIVING PARTY'S NAME AND ADDRESS, PREVIOUSLY RECORDED AT REEL 014161, FRAME 0274. Recorded Dec 11, 2003
From: MAEKAWA, KAZUYOSHI
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 014789/0318 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 9, 2003
From: MAEKAWA, KAZUYOSHI
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014161/0274 →