Patent Assignment
Reel/Frame 024953/0224
CHANGE OF NAME
Recorded: 2010-09-08
Received: 2010-09-08
Pages: 13
Assignor
RENESAS TECHNOLOGY CORP.
Executed: 2010-04-01
Assignee
RENESAS ELECTRONICS CORPORATION
1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, JPX, JAPAN
Covered Applications
(28)
METHOD FOR FORMING PATTERN
App. No. 12/652,760
→
METHOD FOR FORMING PATTERN
App. No. 12/332,395
→
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
App. No. 12/265,763
→
WET ETCHING METHOD USING ULTRAVIOLET-LIGHT AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
App. No. 11/964,794
→
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
App. No. 11/936,145
→
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
App. No. 11/936,138
→
METHOD FOR BURYING RESIST AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
App. No. 11/935,487
→
SEMICONDUCTOR DEVICE INCLUDING FUSE ELEMENTS AND BONDING PAD
App. No. 11/697,760
→
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE INCLUDING BONDING PAD AND FUSE ELEMENTS
App. No. 11/697,765
→
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
App. No. 11/489,471
→
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
App. No. 11/266,213
→
MASS-PRODUCTION TRANSFER SUPPORT SYSTEM AND SEMICONDUCTOR MANUFACTURING SYSTEM
App. No. 11/020,395
→
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
App. No. 10/980,279
→
METHOD FOR FORMING PATTERN
App. No. 10/974,813
→
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
App. No. 10/940,820
→
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
App. No. 10/917,288
→
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
App. No. 10/889,100
→
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
App. No. 10/863,443
→
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
App. No. 10/855,467
→
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE THAT INCLUDES PLASMA TREATING AN INSULATING FILM WITH A MIXTURE OF HELIUM AND ARGON GASES
App. No. 10/855,466
→
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
App. No. 10/796,978
→
FUSE ELEMENTS AND BONDING PAD
App. No. 10/732,375
→
METHOD FOR BURYING RESIST AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
App. No. 10/676,090
→
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE WITH COPPER WIRING TREATED IN A PLASMA DISCHARGE
App. No. 10/464,790
→
SEMICONDUCTOR DEVICE INCLUDING A POLYSILICON, BARRIER STRUCTURE, AND TUNGSTEN LAYER ELECTRODE
App. No. 10/456,529
→
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
App. No. 10/455,371
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METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING TRENCH ELEMENT-ISOLATING STRUCTURE
App. No. 10/438,980
→
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE COMPRISING RAM WITH COMMAND DECODE SYSTEM AND LOGIC CIRCUIT INTEGRATED INTO A SINGLE CHIP AND TESTING METHOD OF THE RAM WITH COMMAND DECODE SYSTEM
App. No. 09/871,978
→