IP Library › Granted Patent US 7,556,916
Granted Patent B2
US 7,556,916 · App. 11/935,487 · Granted Jul 7, 2009

Method for burying resist and method for manufacturing semiconductor device

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Quick Facts
Patent No.
US 7,556,916
App. No.
11/935,487
Granted
Jul 7, 2009
Kind
B2
Abstract

A resist film is applied to an entire surface and subjected to patterning substantially in the same form as an opening to bury the resist film inside the opening. When a positive resist is used, a photomask having a light-shielding portion with an area smaller than the opening is used in patterning. When a negative resist is used, a photomask having a light transmitting portion with an area smaller than the opening is used.

Claims (14)

1. A method for manufacturing a semiconductor device comprising:

forming an interlayer film on a substrate;

forming an opening in said interlayer film;

applying a second film on said interlayer film, including said opening;

applying a positive resist film on said second film; and

patterning said resist film substantially in the same form as said opening by exposing said resist with a photomask having a light-shielding portion substantially in the same form as said opening and developing said resist to remove said resist other than the resist in the opening, thereby burying said resist film in said opening, wherein the light-shielding portion is smaller in area than said opening; and

etching said second film while masking a bottom portion of said opening with said resist film buried in said opening.

2. A method for manufacturing a semiconductor device comprising:

forming an interlayer film on a substrate;

forming an opening in said interlayer film;

applying a second film on said interlayer film, including said opening;

applying a negative resist film on said second film; and

patterning said resist film substantially in the same form as said opening by exposing said resist with a photomask having a light-transmitting portion substantially in the same form as said opening and developing said resist to remove said resist other than the resist in the opening, thereby burying said resist film in said opening, wherein the light-transmitting portion is smaller in area than said opening; and

etching said second film while masking a bottom portion of said opening with said resist film buried in said opening.

Assignments (1)
CHANGE OF NAME Recorded Sep 8, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024953/0224 →