Method of manufacturing semiconductor device including bonding pad and fuse elements
A method of manufacturing a semiconductor device includes forming a first insulating film supported by a semiconductor substrate, forming an aluminum layer supported by the first insulating film, etching the aluminum layer to form a bonding pad and fuse elements, depositing by plasma chemical vapor deposition a second insulating film covering the bonding pad and the fuse elements, the second insulating film having planar portions between the fuse elements and ridged portions opposite the fuse elements, depositing by plasma chemical vapor deposition a third insulating film covering the second insulating film, etching the third insulating film to form a first hole exposing a first region of the second insulating film, opposite the fuse elements, and a second hole exposing a second region of the second insulating film, opposite at least part of said bonding pad, and etching the second insulating film to form a third hole exposing at least part of the bonding pad.
1. A method of manufacturing a semiconductor device comprising:
forming a first insulating film supported by a semiconductor substrate;
forming an aluminum layer supported by said first insulating film;
etching said aluminum layer to form a bonding pad and a fuse element;
depositing by plasma chemical vapor deposition a second insulating film, covering said bonding pad and said fuse element, said second insulating film having a planar portion, between said fuse element and said bonding pad, and ridged portions, opposite said fuse element;
depositing by plasma chemical vapor deposition a third insulating film covering said second insulating film;
etching said third insulating film to form a first hole exposing a first region of said second insulating film, opposite said fuse element, and a second hole exposing a second region of said second insulating film, opposite at least part of said bonding pad; and
etching said second insulating film to expose at least part of said bonding pad, wherein
said fuse element is electrically opened by irradiation with laser light that melts and thereby cuts said fuse element, and
said fuse element is thinner than total thickness of (i) said third insulating film, at a location between said fuse element and said bonding pad, and (ii) said second insulating film, at a location between said fuse element and said bonding pad.
2. The method of manufacturing a semiconductor device according to claim 1 , including depositing silicon oxide as said second insulating film.
3. The method of manufacturing a semiconductor device according to claim 2 , including depositing silicon nitride as said third insulating film.