IP Library Granted Patent US 7,124,956
Granted Patent B2
US 7,124,956 · App. 10/477,912 · Granted Oct 24, 2006

Product comprising product sub-parts connected to each other by a crimp connection

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Quick Facts
Patent No.
US 7,124,956
App. No.
10/477,912
Granted
Oct 24, 2006
Kind
B2
Abstract

In the case of a product ( 1 ) having a first product sub-part ( 4 ) and a second product sub-part ( 3 ), the two product sub-parts ( 3, 4 ) each comprise two connection zones ( 8, 9, 10, 11 ) consisting of metal and of suitably thin construction for a crimping process and the connection zones ( 8, 9, 10, 11 ) are connected together in pairs by means in each case of a crimp connection, in which the connection zones ( 10, 11 ) of at least one product sub-part ( 3 ) exhibit the remnants ( 16 ), remaining after performance of the crimping process, of elevations ( 17 ) present prior to performance of the crimping process.

Claims (22)

1. An inlet for use in a transponder for contactless communication, comprising:

a first product sub-part and a second product sub-part,

in which the first product sub-part comprises a connection zone consisting of metal and of suitably thin construction for a crimping process and

in which the second product sub-part comprises a counter-connection zone consisting of metal and of suitably thin construction for a crimping process, wherein one of the first product sub-part and the second product sub-part includes elevations to be pressed against the other of the first product sub-part and the second product sub-part, and

in which the connection zone and the counter-connection zone are connected together by means of a crimp connection formed by the performance of a crimping process that alters the elevations to obtain remnants, and

in which, of the connection zone and the counter-connection zone, at least one of these two connections zones comprises the remnants, remaining after the performance of the crimping process, of the elevations present prior to the performance of the crimping process, which remnants lie between the two connection zones.

2. An inlet as claimed in claim 1 , in which a connection means suited to assisting the mechanical connection between the two connection zones is additionally provided between the connection zone and the counter-connection zone.

3. An inlet as claimed in claim 2 , in which the connection means comprises a film consisting of plastics and softenable at least once by heating and in which the remnants are pressed through the film.

4. An inlet as claimed in claim 1 , in which the inlet is integrated into a transponder for contactless communication with a communications station.

5. A transponder for contactless communication with a communications station, comprising:

a transponder body;

an inlet embedded in a transponder body including a film and a bridge;

a transmission coil supported by the film and including a plurality of windings, the transmission coil having a connection zone;

the bridge has a counter-connection zone; and

the counter-connection zone consists of metal having elevations crimped against the connection zone and remnants, the remnants establish a mechanical and electrical connection between the connection zone and the counter-connection zone.

6. A starting product as claimed in claim 5 , in which the elevations are formed by an embossing process.

7. A transponder for contactless communication with a communications station, comprising:

transponder body;

an inlet embedded in a transponder body including a film and a bridge;

a transmission coil supported by the film and including a plurality of windings, the transmission coil having a connection zone;

the bridge has a counter-connection zone; and

the counter-connection zone has metal elevations crimped against the connection zone to electrically and mechanically connect the transmission coil and the bridge.

Assignments (4)
CHANGE OF NAME Recorded Sep 22, 2017
From: PHILIPS SEMICONDUCTORS INTERNATIONAL B.V.
To: NXP B.V.
Reel/Frame 043951/0436 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 22, 2017
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: PHILIPS SEMICONDUCTORS INTERNATIONAL B.V.
Reel/Frame 043955/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 15, 2006
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: NXP B.V.
Reel/Frame 018635/0787 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 17, 2003
From: MOLL, RAINER; SCHOBER, JOACHIM HEINZ
To: KONINKLIJKE PHILIPS ELECTRONICS, N.V.
Reel/Frame 015275/0622 →