Decoupling module for decoupling high-frequency signals from a power supply line
View Patent ↗A decoupling module for decoupling high-frequency signals from A power supply line, the module including a layer ( 30 ) of dielectric material which is arranged between a first and a second metallic layer ( 20, 22 ), where the first metallic layer ( 20 ) is connected as a ground electrode of the decoupling module and the second metallic layer ( 22 ) includes at least two surfaces of different size which are consecutively electrically connected between an input connection point and an output connection point, while two respective consecutive surfaces are connected to each other by only one conducting section.
1. A decoupling module for decoupling high-frequency signals from a power supply line, the module comprising a layer ( 30 ) of dielectric material which is arranged between a first and a second metallic layer ( 20 , 22 ), the first metallic layer ( 20 ) being connected as a ground electrode of the decoupling module, characterized in that the second metallic layer ( 22 ) comprises at least two surfaces ( 220 , 222 ; 320 , 322 ) of different size which are consecutively electrically connected between an input connection point and an output connection point, while two respective consecutive surfaces are connected to each other by only one conducting section ( 224 ; 324 ).
2. A decoupling module as claimed in claim 1 , characterized in that the surfaces are rectangular surfaces.
3. A decoupling module as claimed in claim 1 , characterized in that the dimension of a surface ( 220 ) perpendicular to the direction of propagation of the high-frequency signal is up to twice the dimension of the surface in propagation direction of the high-frequency signal.
4. A decoupling module as claimed in claim 1 , characterized in that the surfaces are quadratic surfaces ( 320 , 322 ) while for each two surfaces the edge length of the first surface is an irrational multiple of the edge length of the second surface.
5. A decoupling module as claimed in claim 1 , characterized in that with a predefined mounting surface of the layer ( 30 ) of dielectric material the arrangement of the surfaces is made so that the size of the second metallic layer ( 22 ) is maximized.
6. A decoupling module as claimed in claim 1 , characterized in that the inductance of the conducting sections ( 224 ; 324 ) connecting the surfaces ( 220 , 222 ; 320 , 322 ) is selected so that their resonant frequency is situated below the carrier frequency of the high-frequency signal.
7. A decoupling module as claimed in claim 1 , characterized in that the dielectric layer ( 30 ) is manufactured in a thick-film process.
8. A decoupling module as claimed in claim 1 , characterized in that the layer ( 30 ) of dielectric material has a thickness from about 5 μm to about 20 μm.
9. A decoupling module as claimed in claim 1 , characterized in that on the second metallic layer ( 22 ) are provided a further dielectric layer ( 32 ) and a third metallic layer ( 24 ) which is connected as a further ground electrode of the decoupling module.
10. A multilayer stack comprising a plurality of ceramic layers ( 14 , 16 , 18 , 30 ), of which at least one layer is a layer ( 30 ) of dielectric material on whose one side a first metallic layer ( 20 ) is applied as ground electrode which fully or partly covers the layer ( 30 ) of dielectric material, characterized in that on the opposite side of the layer ( 30 ) a second metallic layer ( 22 ) of at least two surfaces of different size is provided which are consecutively electrically connected between an input connection point and an output connection point, while two respective consecutive surfaces ( 220 , 222 ; 320 , 322 ) are connected to each other by only one conducting section ( 224 ; 324 ).