IP Library Granted Patent US 7,202,763
Granted Patent B2
US 7,202,763 · App. 10/528,623 · Granted Apr 10, 2007

Micro-electromechanical switching device

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Quick Facts
Patent No.
US 7,202,763
App. No.
10/528,623
Granted
Apr 10, 2007
Kind
B2
Abstract

The invention relates to an electromechanical switching device including at least one pair of inductive elements electrically connected in series, said inductive elements being intended to generate two magnetic fields when current is flowing through said inductive elements, the interaction between these two fields resulting in a displacement of at least one of the inductive elements and a displacement of a mobile contact element linked to said at least one inductive element and intended to switch between two positions, at least one of these positions enabling an electrical connection between at least two conductive elements. The invention uses the mechanical forces exerted on at least one inductive element able to move thanks to two electro-magnetic fields oppositely generated by two inductive elements to activate a switch effect between two positions.

Claims (15)

1. A micro-electromechanical switching device including at least one pair of inductive elements electrically connected in series, said inductive elements being intended to generate two magnetic fields when current is flowing through said inductive elements, the interaction between these two fields resulting in a displacement of at least one of the inductive elements and a displacement of a mobile contact element linked to said at least one inductive element and intended to switch between two positions, at least one of said positions enabling an electrical connection between at least two conductive elements.

2. A micro-electromechanical switching device according to claim 1 , wherein said two magnetic fields are opposite.

3. A micro-electromechanical switching device according to claim 1 , wherein an insulation is provided on conductive elements in order to calibrate values of capacities between said contact element and said conductive elements.

4. A micro-electromechanical switching device according to claim 1 , wherein said inductive elements are in two distinct and parallel planes and superimposed on each other.

5. A micro-electromechanical switching device according to claim 1 , wherein inductive elements are electromagnetic coils coiled in opposite ways.

6. A micro-electromechanical switching device according to claim 1 , wherein a second pair of inductive elements is connected to the first pair by connection of one of the inductive elements of the second pair to the contact element.

7. A micro-electromechanical switching device according to claim 1 , wherein said device is placed in a cavity, said cavity being provided with an electrode intended to enter in contact with said contact element.

8. A circuit including at least one micro-electromechanical switching device as claimed in claim 1 , for causing a commutation to occur between two operating modes of at least a functional part of said circuit.

9. A telecommunication electronic apparatus including at least an antenna, at least an amplifier, processing means to process signals, said processing means comprising at least a circuit as claimed in claim 7 .

10. A method for manufacturing a micro-electromechanical switching device intended to switch between two positions, at least one of said positions enabling an electrical connection between at least two conductive elements, by the steps of:

forming at least one first inductive element on a substrate,

depositing an under-etchable material above said inductive element,

forming at least one second inductive element above said under-etchable material, a conductive link being arranged through this under-etchable material to connect the two inductive elements,

forming a contact element linked to said second inductive element above said under-etchable material,

under-etching the under-etchable material.

Assignments (6)
RELEASE OF SECURITY INTEREST Recorded Sep 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050315/0785 →
CHANGE OF NAME Recorded Sep 22, 2017
From: PHILIPS SEMICONDUCTORS INTERNATIONAL B.V.
To: NXP B.V.
Reel/Frame 043951/0436 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 22, 2017
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: PHILIPS SEMICONDUCTORS INTERNATIONAL B.V.
Reel/Frame 043955/0001 →
SECURITY AGREEMENT Recorded Jun 17, 2009
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 022835/0306 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 17, 2007
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: NXP B.V.
Reel/Frame 019719/0843 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 22, 2005
From: SIX, JEAN-CLAUDE
To: KONINKLIJKE PHILIPS ELECTRONICS, N.V.
Reel/Frame 016901/0231 →