IP Library Granted Patent US 7,025,514
Granted Patent B2
US 7,025,514 · App. 10/676,073 · Granted Apr 11, 2006

Development apparatus for manufacturing semiconductor device

Assignee: Oki Electric Industry Co., Ltd.
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Quick Facts
Patent No.
US 7,025,514
App. No.
10/676,073
Granted
Apr 11, 2006
Kind
B2
Abstract

A development apparatus for discharging a developer onto a surface of a semiconductor substrate ( 15 ) comprises a nozzle pipe ( 13 ) for supplying the developer, and a nozzle ( 14 ) having a shape of a spoon with a taper and discharging the developer supplied by the nozzle pipe onto the surface of the substrate. The nozzle sprays the developer onto the surface of the substrate at any spray angle under a low and constant pressure.

Claims (10)

1. A development apparatus for manufacturing a semiconductor device, said development apparatus discharging a developer onto a surface of a semiconductor substrate and comprising:

a nozzle pipe for supplying said developer; and

a nozzle having a shape of a spoon with a taper and discharging said developer supplied by said nozzle pipe onto said surface of said substrate, wherein said nozzle sprays said developer onto said surface of said substrate at any spray angle under a low and constant pressure.

2. A development apparatus for manufacturing a semiconductor device, said development apparatus discharging a developer onto a surface of a semiconductor substrate and comprising:

a nozzle pipe for supplying said developer;

a nozzle having a shape of a spoon with a taper and discharging said developer supplied by said nozzle pipe onto said surface of said substrate; and

a scanning device for simultaneously scanning said nozzle pipe and said nozzle above said substrate in a stationary state, wherein said nozzle sprays said developer onto said surface of said substrate at any spray angle under a low and constant pressure.

3. The development apparatus according to claim 2 , which further comprises an adjusting device for adjusting a position of said nozzle with respect to a position of said nozzle pipe.

4. The development apparatus according to claim 3 , wherein said adjusting device moves said nozzle with respect to said nozzle pipe.

5. The development apparatus according to claim 3 , wherein said adjusting device moves said nozzle pipe with respect to said nozzle.

Assignments (2)
CHANGE OF NAME Recorded Dec 18, 2008
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 022038/0711 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 20, 2004
From: SHIMADA, KEIZO; OHTA, YASUHARU
To: OKI ELECTRIC INDUSTRY CO., LTD.
Reel/Frame 014909/0381 →
Priority Claims (1)
JP 2002-294886 · Oct 8, 2002 · national
Continuity (1)
Related Publication 20040106298A1 · Jun 3, 2004