Semiconductor device adapted to remove noise from a signal
View Patent ↗What is invented is a semiconductor device ( 10 ) comprising a pellet ( 12 ) having a ground electrode ( 18 ), an outside signal terminal ( 15 ) connected to the pellet ( 12 ), so as to receive signal which is likely to include noise. Therein, said outside signal terminal ( 15 ) is surrounded with a ground terminal ( 17 ) connected to said ground electrode ( 18 ) in at least a half periphery.
1. A semiconductor device, comprising:
a pellet having a ground electrode; and
an outside signal terminal connected to the pellet, so as to receive a signal which is likely to include noise; wherein
at least a half of a periphery of said outside signal terminal is surrounded with a ground terminal that is connected to said ground electrode.
2. A semiconductor device according to claim 1 , wherein said outside signal terminal receives the signal by an antenna mounted on the apparatus where the semiconductor device is installed.
3. A semiconductor device according to claim 1 , wherein said outside signal terminal receives an operating clock from the apparatus where the semiconductor device is installed.
4. A semiconductor device according to claim 1 , wherein said outside signal terminal receives an electricity source from the apparatus where the semiconductor device is installed.
5. A semiconductor device according to claim 1 , wherein said ground terminal surrounds only half of the periphery of said outside signal terminal.
6. A semiconductor device according to claim 1 , wherein said semiconductor device is provided with a fixing reinforcement terminal to reinforce the fixing of the semiconductor device to the apparatus installing it.
7. A semiconductor device according to claim 1 , wherein said semiconductor device is provided with plural terminals for electrical connection, each terminal projecting at a base of the semiconductor device to connect with a socket.
8. A semiconductor device according to claim 1 , wherein said semiconductor device is provided with a pair of semiconductor pellets; wherein at the base of one of the semiconductor pellets, the other semiconductor pellet is located; and wherein electrodes of the other semiconductor pellet are connected with the plural terminals electrically.
9. A semiconductor device according to claim 8 , wherein the pair of semiconductor pellets are fixed with each other at confronting faces with conductive paste that is electrically connected with said ground terminal.