Next high frequency improvement by using frequency dependent effective capacitance
View Patent ↗A connector is provided for simultaneously improving both the NEXT high frequency performance when low crosstalk plugs are used and the NEXT low frequency performance when high crosstalk plugs are used. The connector includes a first compensation structure provided on an inner metalized layer of the PCB at a first stage area of the PCB, and a second compensation structure, provided at a second stage area of the PCB, for increasing compensation capacitance with increasing frequency.
1. A printed circuit board (PCB) for an electrical connector, comprising:
a first compensation structure coupled to a first of a plurality of conductive paths within the connector; and
a second compensation structure coupled to the first of a plurality of conductive paths within the connector, the second compensation structure having increased capacitance with increasing frequency.
2. The PCB of claim 1 , wherein the second compensation structure includes at least one series inductor-capacitor combination, the series inductor-capacitor combination including an inductor and at least one capacitor in series with the inductor.
3. The PCB of claim 2 , wherein the inductor comprises at least one self-inductive segment in a conductive path of the electrical connector.
4. The PCB of claim 3 , wherein the inductor is a spiral inductor.
5. The PCB of claim 3 , wherein the at least one capacitor includes:
a first interdigital capacitor in series with the inductor and disposed on a first metalized layer of the PCB; and
a second interdigital capacitor in series with the inductor and disposed on a second metalized layer of the PCB.
6. The PCB of claim 2 , wherein the first compensation structure includes at least one interdigital capacitor or at least one parallel plate capacitor.
7. The PCB of claim 2 , wherein the at least one capacitor of the series inductor-capacitor combination is at least one elongated interdigital.
8. The PCB of claim 7 , wherein the first compensation structure includes at least one interdigital capacitor or at least one parallel plate capacitor.
9. The PCB of claim 7 , wherein the at least one elongated interdigital capacitor is a folded elongated interdigital capacitor.
10. The PCB of claim 9 , wherein the first compensation structure includes at least one interdigital capacitor or at least one parallel plate capacitor.
11. The structure of claim 2 , wherein the at least one capacitor in series with the inductor in the second compensation structure is at least one parallel plate capacitor.
12. The PCB of claim 1 , wherein the second compensation structure includes at least one elongated interdigital capacitor.
13. The PCB of claim 12 , wherein the first compensation structure includes at least one interdigital capacitor or at least one parallel plate capacitor.
14. The PCB of claim 12 , wherein the second compensation structure includes the at least one elongated interdigital capacitor that is a folded elongated interdigital capacitor.
15. The PCB of claim 14 , wherein the first compensation structure includes at least one interdigital capacitor or at least one parallel plate capacitor.
16. The PCB of claim 1 , wherein the second compensation structure includes at least one open-circuited transmission line.
17. The PCB of claim 16 , wherein the first compensation structure includes at least one interdigital capacitor or at least one parallel plate capacitor.
18. A connector for reducing crosstalk, comprising:
a printed circuit board (PCB) including a plurality of substrates and a plurality of metalized layers between the substrates;
a first compensation structure provided on at least one metalized layer of the PCB at a first stage area of the PCB;
a second compensation structure, provided at a second stage area of the PCB, for increasing a compensation capacitance with increasing frequency; and
at least one conductive contact provided above the PCB.
19. The connector of claim 18 , wherein the second compensation structure includes at least one series inductor-capacitor combination, the series inductor-capacitor combination including an inductor and at least one capacitor in series with the inductor.
20. The connector of claim 19 , wherein the inductor is provided on or above or below an outer metalized layer of the PCB, or within the interior of the PCB.
21. The connector of claim 20 , wherein the inductor is a spiral inductor.
22. The connector of claim 20 , wherein the at least one capacitor includes:
a first interdigital capacitor in series with the inductor and disposed on a first metalized layer of the PCB; and
a second interdigital capacitor in series with the inductor and disposed on a second metalized layer of the PCB.
23. The connector of claim 19 , wherein the first compensation structure includes at least one interdigital capacitor or at least one parallel plate capacitor.
24. The connector of claim 19 , wherein the at least one capacitor of the series inductor-capacitor combination is at least one elongated interdigital capacitor on at least one metalized layer of the PCB.
25. The connector of claim 24 , wherein the first compensation structure includes at least one interdigital capacitor or at least one parallel plate capacitor.
26. The connector of claim 24 , wherein the at least one elongated interdigital capacitor is a folded elongated interdigital capacitor.
27. The connector of claim 26 , wherein the first compensation structure includes at least one interdigital capacitor or at least one parallel plate capacitor.
28. The connector of claim 19 , wherein the at least one capacitor in series with the inductor in the second compensation structure is at least one parallel plate capacitor.
29. The connector of claim 18 , wherein the second compensation structure includes at least one elongated interdigital capacitor on at least one metalized layer of the PCB.
30. The connector of claim 29 , wherein the first compensation structure includes at least one interdigital capacitor or at least one parallel plate capacitor.
31. The connector of claim 29 , wherein the at least one elongated interdigital capacitor is a folded elongated interdigital capacitor.
32. The connector of claim 31 , wherein the first compensation structure includes at least one interdigital capacitor or at least one parallel plate capacitor.
33. The connector of claim 18 , wherein the second compensation structure includes at least one open-circuited transmission line on at least one metalized layer of the PCB.
34. The connector of claim 33 , wherein the first compensation structure includes at least one interdigital capacitor or at least one parallel plate capacitor.
35. A structure for reducing crosstalk in a printed circuit board (PCB), the PCB including a plurality of substrates and a plurality of metalized layers between the substrates, the structure comprising:
a compensation part provided on at least one metalized layer of the PCB at a first stage area of the PCB; and
means, provided at a second stage area of the PCB, for increasing a compensation capacitance with increasing frequency.
36. An electrical connector, comprising:
a plurality of input terminals;
a plurality of output terminals;
a plurality of conductive paths connecting respective of the plurality of input terminals with respective of the plurality of output terminals; and
a first stage compensation structure electrically coupled to at least a first of the conductive paths, the first stage compensation structure having a first effective capacitance response as a function of frequency; and
a second stage compensation structure electrically coupled to at least the first of the conductive paths, the second stage compensation structure being time delayed with respect to the first compensation structure, and the second stage compensation structure having a second effective capacitance response as a function of frequency that is different than the first effective capacitive response.
37. The electrical connector of claim 36 , wherein the first compensation structure has a relatively flat effective capacitance response as a function of increasing frequency.
38. The electrical connector of claim 37 , wherein the second stage compensation structures has an increasing effective capacitance response as a function of increasing frequency.
39. The electrical connector of claim 36 , wherein an overall compensation provided to the first of the conductive paths by the first compensation structure and the second compensation structure decreases with increasing frequency.
40. The electrical connector of claim 39 , wherein the second compensation structure comprises a series inductor-capacitor combination.
41. The electrical connector of claim 40 , wherein the inductor is implemented by routing a first portion of the first conductive path adjacent a second portion of the first conductive path.
42. The electrical connector of claim 40 , wherein the inductor comprises a spiral portion in the first conductive path.
43. The electrical connector of claim 39 , wherein the first compensation structure provides a compensation signal having a first polarity and the second compensation structure provides a compensation signal having a polarity generally opposite the first polarity.
44. The electrical connector of claim 39 , wherein the second compensation structure comprises an elongated interdigital capacitor.
45. The electrical connector of claim 39 , wherein the second compensation structure comprises a folded elongated interdigital capacitor.
46. The electrical connector of claim 39 , wherein the second compensation structure comprises an open-circuited transmission line.
47. The electrical connector of claim 36 , wherein at least one of the first effective capacitance response as a function of frequency and/or the second effective capacitance response as a function of frequency is selected to simultaneously improve a net crosstalk compensation provided by the first and second compensation structures at frequencies less than 100 MHz when a high crosstalk plug is used with the electrical connector and the net crosstalk compensation provided by the first and second compensation structures at frequencies greater than 250 MHz when a low crosstalk plug is used with the electrical connector.
48. An electrical connector, comprising:
a plurality of input terminals;
a plurality of output terminals; and
a plurality of conductive paths connecting respective of the plurality of input terminals with respective of the plurality of output terminals,
wherein a first portion of a first conductive path of the plurality of conductive paths includes a self inductance region where a first segment of said portion of said first conductive path inductively couples with a second segment of said first portion of said first conductive path,
wherein a second portion of said first conductive path includes a capacitance region where said first conductive path capacitively couples with a second conductive path of said plurality of conductive paths,
wherein said self inductance region and said capacitance region comprise a series inductor-capacitor combination, and
wherein the inductance of the inductor and the capacitance of the capacitor are selected such that the resonant frequency of the series inductor-capacitor combination is greater than the highest expected operating frequency of the electrical connector.
49. An electrical connector, comprising:
a plurality of input terminals;
a plurality of output terminals; and
a plurality of conductive paths connecting respective of the plurality of input terminals with respective of the plurality of output terminals,
wherein a first portion of a first conductive path of the plurality of conductive paths includes a self inductance region where a first segment of said portion of said first conductive path inductively couples with a second segment of said first portion of said first conductive path,
wherein a second portion of said first conductive path includes a capacitance region where said first conductive path capacitively couples with a second conductive path of said plurality of conductive paths,
wherein said self inductance region and said capacitance region comprise a series inductor-capacitor combination, and
wherein the inductor comprises a spiral portion in the first conductive path.
50. A method of designing an electrical connector, the method comprising:
providing a compensation structure that couples a compensation signal from a first conductive path of the electrical connector to a second conductive path of the electrical connector, wherein the compensation structure provides a capacitance that is intentionally designed to increase with increasing frequency over an operating bandwidth of the electrical connector.
51. The method of claim 50 , wherein the compensation structure includes a series inductor-capacitor combination.
52. The method of claim 51 , wherein the inductor comprises first and second segments of the second conductive path that are in close proximity to each other.