Semiconductor device and method for manufacturing the same

1 . A semiconductor device comprising:

a first transistor including a first gate electrode composed of a first material having a first work function, and a first gate insulating film; and

a second transistor including a second gate electrode composed of a second material having a second work function, and a second gate insulating film, wherein

said first gate insulating film includes:

a high-dielectric-constant film, and

a first insulating film on said high-dielectric-constant film; and

said second gate insulating film includes at least said high-dielectric-constant film.

2 . The semiconductor device according to claim 1 , wherein

said second gate insulating film includes a second insulating film on said high-dielectric-constant film, and

said second insulating film is thinner than said first insulating film.

3 . The semiconductor device according to claim 1 , wherein

said first material includes polycrystalline silicon; and

said second material has a work function at least 0.55 eV larger than the electron affinity of silicon.

4 . The semiconductor device according to claim 1 , wherein said high-dielectric-constant film includes at least hafnium and oxygen.

5 . A method of manufacturing a semiconductor device comprising:

forming a high-dielectric-constant film on each of a first active region and a second active region of a substrate;

forming a first insulating film on said high-dielectric-constant film in each of said first and second active regions;

forming a first gate electrodes composed of a first material having a first work function, on said first insulating film on each of said first and second active regions;

removing said first gate electrode from said second active region;

removing said first insulating film from said second active region by etching, using said first gate electrode as a mask; and

forming a second gate electrodes composed of a second material having a second work function, on said second active region.

6 . The methods of manufacturing a semiconductor device according to claim 5 , including removing said first insulating film removing under conditions removing only a part of said first insulating film.

7 . The method of manufacturing a semiconductor device according to claim 5 , wherein

said first material is polycrystalline silicon; and

said second material has a work function at least 0.55 eV larger than the electron affinity of silicon.

8 . The method of manufacturing a semiconductor device according to claim 5 , wherein said high-dielectric-constant film contains at least hafnium and oxygen.

9 . A method of manufacturing a semiconductor device comprising:

forming a dummy gate insulating film and a dummy gate electrode on each of a first active region and a second active regions of a substrate;

forming an impurity diffusion region in each of a first active region and a second active region, using each of said dummy gate electrodes as a mask;

forming an interlayer insulating film embedding said dummy gate insulating films and said dummy gate electrodes;

forming openings in said interlayer insulating film in each of said first active region and said second active region, by removing said dummy gate insulating films and said dummy gate electrodes from said interlayer insulating film;

forming a high-dielectric-constant film at least in the openings in each of said first active region and said second active region;

forming a first insulating film on said high-dielectric-constant film in each of said first active region and said second active region;

embedding a first material having a first work function in the openings in each of said first active region and said second active region;

removing said first material embedded in said opening in said second active region;

removing said first insulating film other than in the opening of said first active region; and

embedding a second material having a second work function in the opening of said second active region.

10 . The method of manufacturing a semiconductor device according to claim 9 , including removing said first insulating film under conditions removing only a part of said first insulating film in said second active region.

11 . The method of manufacturing a semiconductor device according to claim 9 , wherein

said first material is polycrystalline silicon; and

said second material has a work function at least 0.55 eV larger than the electron affinity of silicon.

12 . The method of manufacturing a semiconductor device according to claim 9 , wherein said high-dielectric-constant film contains at least hafnium and oxygen.

13 . A method of manufacturing a semiconductor device comprising:

forming a gate insulating film including at least a high-dielectric-constant film, and a first insulating film on said high-dielectric-constant film on each of a first active region and a second active region of a substrate;

forming a first gate electrodes composed of a material having a first work function, on said gate insulating film in each of said first active region and said second active region;

forming an impurity diffusion region in each of said first active region and said second active region, using each of said first gate electrodes as a mask;

forming silicide layers on said impurity diffusion region;

forming an interlayer insulating film, embedding said first gate insulating films and said first gate electrodes;

forming an opening in said interlayer insulating film in said second active region by removing said first gate electrode of said second active region from said interlayer insulating film;

removing said first insulating film at least where exposed on the bottom of said opening; and

embedding a second gate electrodes composed of a material having a second work function, in said opening.

14 . The method of manufacturing a semiconductor device according to claim 13 , including removing said first insulating film under conditions removing only a part of said first insulating film.

15 . The method of manufacturing a semiconductor device according to claim 13 , wherein

said first material is polycrystalline silicon; and

said second material has a work function at least 0.55 eV larger than the electron affinity of silicon.

16 . The method of manufacturing a semiconductor device according to claim 13 , wherein said high-dielectric-constant film contains at least hafnium and oxygen.