Patent Assignment
Reel/Frame 016206/0616
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded: 2005-07-01
Received: 2005-07-01
Pages: 4
Assignor
SEMICONDUCTOR LEADING EDGE TECHNOLOGIES, INC.
Executed: 2005-06-01
Assignee
RENESAS TECHNOLOGY CORP.
2-4-1 MARUNOUCHI, CHIYODA-KU, TOKYO, JPX, 100-6334, JAPAN
Covered Applications
(15)
MASS-PRODUCTION TRANSFER SUPPORT SYSTEM AND SEMICONDUCTOR MANUFACTURING SYSTEM
App. No. 11/020,395
→
Multilayered wiring structure, method of forming buried wiring, semiconductor device, method of manufacturing semiconductor device, semiconductor mounted device, and method of manufacturing semiconductor mounted device
App. No. 11/014,883
→
Semiconductor device
App. No. 11/003,484
→
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
App. No. 10/980,279
→
METHOD FOR FORMING PATTERN
App. No. 10/974,813
→
Exposure method
App. No. 10/973,424
→
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
App. No. 10/940,820
→
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
App. No. 10/917,288
→
Semiconductor device including stacked gate insulating film
App. No. 10/901,997
→
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
App. No. 10/889,100
→
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
App. No. 10/855,467
→
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE THAT INCLUDES PLASMA TREATING AN INSULATING FILM WITH A MIXTURE OF HELIUM AND ARGON GASES
App. No. 10/855,466
→
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
App. No. 10/796,978
→
WET ETCHING APPARATUS
App. No. 10/797,577
→
WET ETCHING APPARATUS
App. No. 10/765,272
→