IP Library Granted Patent US 7,160,410
Granted Patent B2
US 7,160,410 · App. 11/293,637 · Granted Jan 9, 2007

Method of transferring a substantially disc-shaped workpiece, and device for carrying out this method

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Quick Facts
Patent No.
US 7,160,410
App. No.
11/293,637
Granted
Jan 9, 2007
Kind
B2
Abstract

Consistent with an embodiment of the present invention, there is a device for transferring a substantially disc-shaped workpiece from a workpiece carrier. The workpiece is fastened along a first one of its main surfaces with a double-side adhesive foil onto a carrier foil. The workpiece is fastened onto the carrier foil along a first one of the its main surfaces with a double-sided adhesive foil onto a carrier foil on whose surface the workpiece is to be provided and fastened along the first main surface in an at least substantially planar manner. The first double-sided adhesive foil is adhesively connected by a first adhesive layer provided on its first surface to a first surface of the workpiece carrier and by a second adhesive layer provided on it second surface to the workpiece alone the first main surface thereof.

Claims (15)

1. A method of transferring a substantially disc-shaped workpiece from a workpiece carrier, on which the workpiece is fastened along a first one of its main surfaces by means of a double-sided adhesive foil in an at least substantially planar manner, onto a carrier foil on whose surface the workpiece is to be provided and fastened along said first main surface in an at least substantially planar manner, which first double-sided adhesive foil is adhesively connected by a first adhesive layer provided on its first surface to a first surface of the workpiece carrier and by a second adhesive layer provided on its second surface to the workpiece along the first main surface thereof, comprising the following process steps:

weakening the second adhesive layer by an at least partial decomposition of the adhesive substance forming said second adhesive layer to a reduced adhesive force which is substantially smaller than the adhesive force of the first adhesive layer,

fastening the workpiece carrier to a first retaining device,

fastening the workpiece along its second main surface opposite to the first main surface to a surface of a second retaining device by means of a second double-sided adhesive foil in an at least substantially planar manner, such that the second double-sided adhesive foil is adhesively connected by a third adhesive layer provided on its first surface to the surface of the second retaining device and by a fourth adhesive layer provided on its second surface to the workpiece along the second main surface thereof, and the adhesive forces of the third and the fourth adhesive layer are substantially greater than the adhesive force of the weakened second adhesive layer,

separating the workpiece from the first double-sided adhesive foil along the weakened second adhesive layer through the application of a pulling force between the first and the second retaining device, which force is at least partly perpendicular to the main surfaces of the workpiece,

positioning the workpiece adhesively connected to the second retaining device and the carrier foil with respect to one another such that the first main surface of the workpiece faces the surface of the carrier foil,

weakening the fourth adhesive layer through an at least partial decomposition of the adhesive substance by which it is formed to a reduced adhesive force which is substantially smaller than the adhesive force of the third adhesive layer,

placing the workpiece with its first main surface on the surface of the carrier foil in an at least substantially planar manner, and

separating the workpiece from the second double-sided adhesive foil along the weakened fourth adhesive layer through the application of a force, generated by gas pressure, between the second double-sided adhesive foil adhering to the second retaining device and the workpiece.

2. A method as recited in claim 1 , wherein a movement which is at least partly perpendicular to the main surfaces of the workpiece is carried out between the first retaining device and the workpiece provided on the carrier foil during the process of separating the workpiece from the second double-sided adhesive foil along the weakened fourth adhesive layer at least substantially simultaneously with the application of the force, generated by gas pressure, between the second double-sided adhesive foil adhering to the second retaining device and the workpiece.

3. A method as recited in claim 1 , wherein an at least substantially rigidly constructed workpiece carrier is used as the workpiece carrier.

4. A method as recited in claim 1 , wherein the fastening of the workpiece carrier to the first retaining device is effected by adhesion, such that the adhesive force of the adhesion between the workpiece carrier and the first retaining device is substantially greater than the adhesive force of the weakened second adhesive layer.

5. A method as recited in claim 1 , wherein the workpiece carrier is constructed with a ferromagnetic material, and the fastening of the workpiece carrier to the first retaining device is effected by means of a magnet device, such that the magnetic force obtaining between the workpiece carrier and the first retaining device is substantially greater than the adhesive force of the weakened second adhesive layer.

6. A method as recited in claim 1 , wherein the adhesive layers are prepared with a heat-sensitive adhesive substance, and the weakening of the adhesive layers is achieved through the influence of heat.

7. A method as recited in claim 1 , wherein the adhesive layers are prepared with an adhesive substance which is sensitive to UV radiation, and the weakening of the adhesive layers is achieved through the influence of UV radiation.

Assignments (4)
CHANGE OF NAME Recorded Sep 22, 2017
From: PHILIPS SEMICONDUCTORS INTERNATIONAL B.V.
To: NXP B.V.
Reel/Frame 043951/0436 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 22, 2017
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: PHILIPS SEMICONDUCTORS INTERNATIONAL B.V.
Reel/Frame 043955/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 2, 2011
From: ANKER, JAOCHIM
To: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Reel/Frame 027164/0763 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 13, 2008
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: NXP B.V.
Reel/Frame 021085/0959 →