IP Library Granted Patent US 7,412,122
Granted Patent B2
US 7,412,122 · App. 11/376,352 · Granted Aug 12, 2008

Integrated multichannel laser driver and photodetector receiver

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Quick Facts
Patent No.
US 7,412,122
App. No.
11/376,352
Granted
Aug 12, 2008
Kind
B2
Abstract

An integrated circuit cast on a single die having a plurality of receivers in a receiver region, a plurality of transmitters in a transmitter region, and a spatial separation region having a plurality of n-type and p-type subregions disposed on the single die to separate the transmitter region from the receiver region. The pn-junctions between the n-type and p-type subregions are reverse-biased thereby reducing or eliminating coupling of noise and crosstalk between the transmitter and receiver is reduced.

Claims (21)

1. A fiber optic communication system, comprising:

(a) a first module comprising a first transceiver chip cast on a first single die, the first die comprising a first plurality of receivers in a first receiver region, a first plurality of transmitters in a first transmitter region, and a first spatial separation region having a first plurality of n-type and p-type sub-regions operable to electrically isolate the first transmitter region from the first receiver region, the first separation region being disposed between the first transmitter region and the first receiver region, the first plurality of n-type and p-type sub-regions being disposed on the first single die in alternating first horizontal rows;

(b) a second module comprising a second transceiver chip cast on a second single die, the second die comprising a second plurality of receivers in a second receiver region, a second plurality of transmitters in a second transmitter region, and a second spatial separation region having a second plurality of n-type and p-type sub-regions operable to electrically isolate the second transmitter region from the second receiver region, the second separation region being disposed between the second transmitter region and the second receiver region, the second plurality of n-type and p-type sub-regions being disposed on the second single die in alternating second horizontal rows;

(c) a fiber optic communication link operably coupling the first module to the second module; and

(d) a first communication device operably coupled to the first module and a second communication device operably coupled to the second module, the first and second communication devices being operably connected to one another to effect communication therebetween through the first and second modules.

2. The fiber optic communication system of claim 1 , wherein at least one of the first and second pluralities of receivers comprises an amplifier configured to amplify a signal from a photodetector.

3. The fiber optic communication system of claim 2 , wherein the amplifier is operably coupled to a buffer configured to process the amplified signal.

4. The fiber optic communication system of claim 3 , wherein the buffer is operably coupled to a driver configured to drive the processed signal.

5. The fiber optic communication system of claim 1 , wherein at least one of the first and second pluralities of transmitters comprises a driver configured to generate an analog signal for driving a light source.

6. The fiber optic communication system of claim 5 , wherein an input node of the driver is operably connected to a buffer.

7. The fiber optic communication system of claim 5 , wherein the light source comprises one of a laser and light-emitting diode.

8. The fiber optic communication system of claim 1 , further comprising undoped semiconductor regions disposed between n-type and p-type sub-regions of the first spatial separation region or between n-type and p-type sub-regions of the second spatial separation region.

9. The fiber optic communication system of claim 1 , wherein at least one of the first spatial separation region and the second spatial separation region further comprises an undoped center region that is neither a p-type semiconductor region nor an n-type semiconductor region, the undoped center region being disposed equidistant from the transmitter region and receiver region corresponding thereto.

10. The fiber optic communication system of claim 9 , wherein the horizontal row adjacent the undoped center region is a p-type semiconductor region.

11. The fiber optic communication system of claim 1 , wherein at least one of the first plurality of p-type sub-regions and the second plurality of p-type sub-regions is biased to a ground node.

12. The fiber optic communication system of claim 11 , wherein the ground node is coupled only to components in at least one of the first transmitter region and the second transmitter region.

13. The fiber optic communication system of claim 11 , wherein the ground node is coupled only to components in at least one of the first receiver region and the second receiver region.

14. The fiber optic communication system of claim 1 , wherein at least one of the first plurality of n-type sub-regions and the second plurality of n-type sub-regions is biased to a voltage supply node.

15. The fiber optic communication system of claim 14 , wherein the voltage supply node is coupled only to components in at least one of the first transmitter region and the second transmitter region.

16. The fiber optic communication system of claim 14 , wherein the voltage supply Is coupled only to components in at least one of the first receiver region and the second receiver region.

17. The fiber optic communication system of claim 1 , further comprising guard rings surrounding at least one of each transmitter and each receiver.

Assignments (10)
MERGER Recorded Mar 3, 2023
From: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED; BROADCOM INTERNATIONAL PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 062952/0850 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2020
From: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
To: BROADCOM INTERNATIONAL PTE. LTD.
Reel/Frame 053771/0901 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ERROR IN RECORDING THE MERGER PREVIOUSLY RECORDED AT REEL: 047357 FRAME: 0302. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Mar 22, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048674/0834 →
CORRECTIVE ASSIGNMENT TO CORRECT THE EFFECTIVE DATE OF MERGER PREVIOUSLY RECORDED ON REEL 047195 FRAME 0658. ASSIGNOR(S) HEREBY CONFIRMS THE THE EFFECTIVE DATE IS 09/05/2018. Recorded Oct 29, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047357/0302 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047195/0658 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032851-0001) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 037689/0001 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032851/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2006
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD
Reel/Frame 017675/0001 →