IP Library Granted Patent US 7,707,449
Granted Patent B2
US 7,707,449 · App. 11/394,028 · Granted Apr 27, 2010

Systems and methods for low power multi-rate data paths

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Quick Facts
Patent No.
US 7,707,449
App. No.
11/394,028
Granted
Apr 27, 2010
Kind
B2
Abstract

Various systems and methods for low power multi-rate data paths are disclosed. As one example, a semiconductor device that includes a multi-rate data path is discussed. The multi-rate data path includes at least two register circuits with an output of one of the register circuits electrically coupled to an input of the other register circuit via a combinational logic block. In addition, the semiconductor device includes a control circuit that is operable to modify the rate at which the multi-rate data path operates by selectably bypassing at least one of the register circuits.

Claims (42)

1. A semiconductor device comprising:

a multi-rate data path, wherein the multi-rate data path exhibits at least a first rate of operation and a second rate of operation, wherein the multi-rate data path includes:

a first register circuit;

a second register circuit, wherein an output of the first register circuit is electrically coupled to an input of the second register circuit via a combinational logic block, wherein the second register circuit includes a flip-flop and a multiplexer, and wherein the input to the flip-flop is electrically coupled to a first input of the multiplexer and the output of the flip-flop is electrically coupled to a second input of the multiplexer; and

a control circuit, wherein the control circuit is operable to modify a rate at which the multi-rate data path operates by selecting the first input of the multiplexer during the second rate of operation, and selecting the second input of the multiplexer during the first rate of operation.

2. The semiconductor device of claim 1 , wherein a selector of the multiplexer is electrically coupled to an output of the control circuit.

3. The semiconductor device of claim 1 , wherein the first register circuit includes a register device selected from a group consisting of: a latch and a flip-flop.

4. A method for variable rate data path operation, the method comprising:

providing a data path, wherein the data path exhibits a first rate of operation and a second rate of operation, wherein the first rate of operation is greater than the second rate of operation, and wherein the data path includes:

a first register circuit, wherein an input of the first register circuit is electrically coupled to a first combinational logic block; and

a second register circuit, wherein an output of the first register circuit is electrically coupled to an input of the second register circuit via a second combinational logic block; and

selecting the second rate of operation, wherein the first register circuit is bypassed, and wherein the first register circuit includes a latch with a data input, a clock input and an output; and wherein selecting the second rate of operation includes: maintaining the clock input of the latch of the first register circuit asserted during the second rate of operation, wherein a value presented at the data input is passed directly to the output.

5. A semiconductor device, the semiconductor device comprising:

a data path that exhibits at least a first rate of operation and a second rate of operation, and wherein the data path includes:

a first register circuit, wherein an input of the first register circuit is electrically coupled to a first combinational logic block;

a second register circuit, wherein an output of the first register circuit is electrically coupled to an input of the second register circuit via a second combinational logic block;

a third register circuit, wherein an output of the second register circuit is electrically coupled to an input of the third register circuit via a third combinational logic block;

a fourth register circuit, wherein an output of the third register circuit is electrically coupled to an input of the fourth register circuit via a fourth combinational logic block; and

a control circuit, wherein the control circuit is operable to modify a rate at which the data path operates by selectably bypassing at least two of the first register circuit, the second register circuit, and the third register circuit.

6. The semiconductor device of claim 5 , wherein the first register circuit, the second register circuit and the third register circuit includes a register device selected from a group consisting of: a latch and a multiplexer bypassed flip-flop.

7. The semiconductor device of claim 6 , wherein the multiplexer bypassed flip-flop includes a flip-flop and a multiplexer, wherein the input to the flip-flop is electrically coupled to a first input of the multiplexer and the output of the flip-flop is electrically coupled to a second input of the multiplexer, and wherein a selector of the multiplexer is electrically coupled to the control circuit.

8. The semiconductor device of claim 6 , wherein the latch includes a data input, a clock input and an output; and wherein the clock input is at least in part controlled by the control circuit.

9. The semiconductor device of claim 5 , wherein the first register circuit and the third register circuit are selectably bypassed during the second rate of operation; and wherein the first rate of operation is greater than the second rate of operation.

10. The semiconductor device of claim 5 , wherein the data path further exhibits at least a third rate of operation; wherein the first register circuit, the second register circuit, and the third register circuit are selectably bypassed during the third rate of operation; and wherein the second rate of operation is greater than the third rate of operation.

11. A design tool, wherein the design tool comprises:

a post-processing engine, wherein the post-processing engine is operable to:

receive an identification of a data path, wherein the data path exhibits at least a first rate of operation and a second rate of operation, and wherein the data path includes at least a first register circuit, a second register circuit and a third register circuit;

receive a command designating the data path to have a first rate of operation and a second rate of operation; and

implement a control circuit, wherein the control circuit is operable to select the first rate of operation by bypassing the first register circuit and the third register circuit, and wherein the first rate of operation uses all of the first register circuit, the second register circuit and the third register circuit.

12. The design tool of claim 11 , wherein the first register circuit, the second register circuit and the third register circuit are selected from a group consisting of: latches and flip-flops.

13. A semiconductor device comprising:

a multi-rate data path, wherein the multi-rate data path exhibits at least a first rate of operation and a second rate of operation, wherein the multi-rate data path includes:

a first register circuit;

a second register circuit, wherein an output of the first register circuit is electrically coupled to an input of the second register circuit via a combinational logic block, wherein the second register circuit includes a latch with a data input, a clock input and an output, and wherein the clock input is at least in part controlled by a control circuit; and

wherein the control circuit is operable to maintain the clock input of the latch of the second register circuit asserted during the second rate of operation, wherein a value presented at the data input is passed directly to the output.

14. The semiconductor device of claim 13 , wherein the control circuit is further operable to toggle the clock input of the latch of the second register circuit during the first rate of operation, wherein a value presented at the data input is clocked to the output.

15. The semiconductor device of claim 13 , wherein the control circuit is further operable to power down at least a portion of the latch of the second register circuit during second rate of operation.

16. The semiconductor device of claim 13 , wherein the first rate of operation is greater than the second rate of operation.

17. The semiconductor device of claim 13 , wherein the first register circuit includes a register device selected from a group consisting of: a latch and a flip-flop.

18. The semiconductor device of claim 1 , wherein the first rate of operation is greater than the second rate of operation.

19. The semiconductor device of claim 1 , wherein the control circuit is operable to power down the flip-flop of the second register circuit during the second rate operation, and to power up the flip-flop of the second register circuit during the first rate of operation.

20. The semiconductor device of claim 5 , wherein the first rate of operation is greater than the second rate of operation.

Assignments (11)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2020
From: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
To: BROADCOM INTERNATIONAL PTE. LTD.
Reel/Frame 053771/0901 →
CORRECTIVE ASSIGNMENT TO CORRECT THE PROPERTY NUMBERS PREVIOUSLY RECORDED AT REEL: 47630 FRAME: 344. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Mar 21, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048883/0267 →
CORRECTIVE ASSIGNMENT TO CORRECT THE EFFECTIVE DATE OF MERGER TO 9/5/2018 PREVIOUSLY RECORDED AT REEL: 047196 FRAME: 0687. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Oct 29, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047630/0344 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047196/0687 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032856-0031) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: LSI CORPORATION; AGERE SYSTEMS LLC
Reel/Frame 037684/0039 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 3, 2015
From: AGERE SYSTEMS LLC
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 035365/0634 →
CERTIFICATE OF CONVERSION Recorded Aug 29, 2014
From: AGERE SYSTEMS INC.
To: AGERE SYSTEMS LLC
Reel/Frame 033663/0948 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: LSI CORPORATION; AGERE SYSTEMS LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032856/0031 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 29, 2006
From: GRAEF, NILS
To: AGERE SYSTEMS INC.
Reel/Frame 017701/0595 →