Via providing multiple electrically conductive paths
View Patent ↗A via provides a plurality of electrical connections between conductors on different layers of a circuit board. The via includes an opening through the circuit board formed by a plurality of substantially partially overlapping bores. An electrically conductive plating is formed on an inner surface of the opening. The plating forms a plurality of distinct electrically conductive paths.
1. A via in a circuit board formed by a process comprising:
forming a plurality of substantially partially overlapping bores through the circuit board;
plating an inner surface of the substantially partially overlapping bores with an electrically conductive material; and
forming at least one additional bore through the circuit board to remove a portion of the electrically conductive material from the inner surface of each of the substantially partially overlapping bores to provide an opening having a plurality of electrically isolated electrically conductive paths.
2. The via of claim 1 , wherein at least two of the substantially partially overlapping bores partially overlap.
3. The via of claim 1 , wherein at least two of the substantially partially overlapping bores are closely adjacent.
4. The via of claim 1 , wherein the substantially partially overlapping bores include:
a first bore; and
a second bore that partially overlaps with the first bore;
wherein the at least one additional bore is a third bore that forms two electrically isolated electrically conductive paths.
5. The via of claim 1 , wherein the substantially partially overlapping bores include:
a first bore; and
a second bore that partially overlaps with the first bore;
wherein the at least one additional bore includes third and fourth bores that form two electrically isolated electrically conductive paths.
6. The via of claim 1 , wherein the substantially partially overlapping bores include:
a first bore; and
a second bore that is closely adjacent with the first bore;
wherein the at least one additional bore is a third bore that forms two electrically isolated electrically conductive paths.
7. The via of claim 1 , wherein the substantially partially overlapping bores include:
a first bore;
a second bore that partially overlaps with the first bore; and
a third bore that partially overlaps with the first bore and the second bore;
wherein the at least one additional bore includes a fourth bore that forms three electrically isolated electrically conductive paths.
8. The via of claim 1 , wherein the substantially partially overlapping bores include:
a first bore;
a second bore that partially overlaps with the first bore; and
a third bore that partially overlaps with the first bore and the second bore;
wherein the at least one additional bore includes a plurality of bores.
9. The via of claim 8 , wherein the plurality of bores includes a fourth bore, a fifth bore, and a sixth bore.
10. The via of claim 1 , wherein the substantially partially overlapping bores include:
a first bore;
a second bore that is closely adjacent to the first bore; and
a third bore that is closely adjacent to the first bore and the second bore;
wherein the at least one additional bore includes a plurality of bores.
11. The via of claim 1 , wherein the substantially partially overlapping bores include:
a first bore;
a second bore that partially overlaps with the first bore; and
a third bore that partially overlaps with the second bore; and
a fourth bore that partially overlaps with the third bore and the first bore;
wherein the at least one additional bore is a fifth bore that forms four electrically isolated electrically conductive paths.
12. The via of claim 1 , wherein the substantially partially overlapping bores include:
a first bore;
a second bore that partially overlaps with the first bore;
a third bore that partially overlaps with the second bore; and
a fourth bore that partially overlaps with the third bore and the first bore;
wherein the at least one additional bore includes a plurality of bores.
13. The via of claim 12 , wherein the plurality of bores includes four bores.
14. The via of claim 1 , wherein the opening is filled.
15. The via of claim 14 , wherein the opening is filled with an electrically non-conductive material.
16. The via of claim 1 , wherein the electrically conductive paths include a metal.
17. The via of claim 16 , wherein the metal includes at least one metal selected from the group consisting of copper, aluminum, tin, nickel, gold, silver, and solder.
18. The via of claim 1 , wherein a first path of the electrically conductive paths couples conductors of different conductive layers of the circuit board that are separated by at least one other conductive layer of the circuit board.
19. The via of claim 1 , wherein a first path of the electrically conductive paths couples conductors of different conductive layers of the circuit board that are adjacent conductive layers of the circuit board.
20. The via of claim 1 , wherein the electrically conductive paths electrically connect different layers of the circuit board, and wherein the circuit board is a printed circuit board (PCB) or an integrated circuit (IC) package substrate.
21. The via of claim 1 , wherein the electrically conductive paths electrically connect different layers of the circuit board that includes at least one dielectric layer, and wherein the at least one dielectric layer includes at least one material selected from the group consisting of an organic material, a polyimide, and a ceramic material.
22. The via of claim 1 , wherein a first area on a first surface of the circuit board adjacent to the substantially partially overlapping bores and a second area on a second surface of the circuit board adjacent to the substantially partially overlapping bores are plated with a metal.
23. The via of claim 1 , wherein each path of the electrically conductive paths corresponds to a respective bore of the substantially partially overlapping bores.