IP Library Granted Patent US 7,580,020
Granted Patent B2
US 7,580,020 · App. 11/487,339 · Granted Aug 25, 2009

Semiconductor device and liquid crystal panel driver device

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Quick Facts
Patent No.
US 7,580,020
App. No.
11/487,339
Granted
Aug 25, 2009
Kind
B2
Abstract

A semiconductor device carries out a test utilizing contact with a probe needle without being affected by narrowing of the pitch at which output pads are arranged. The device is equipped with test circuits provided between a plurality of output buffers via which signals are output and output pads corresponding thereto. The test circuit includes output switches caused to sequentially make connections by a controller in test and interpad switches involved in making connections of the output pads with a test pad by the controller in test. In test, probe needles are brought into contact with the test pad. The output pads are not used in test, and can be arranged at a narrowed pitch. Thus, the chip area can be reduced and are therefore so that the pitch for the output pads can be narrowed and the chip area can be decreased.

Claims (12)

1. A semiconductor device in which a plurality of output circuits and output pads corresponding to output terminals of the output circuit are arranged, said semiconductor device comprising:

output switches provided in series between the output terminals of the output circuits and the output pads corresponding thereto;

a test pad used in test;

interpad switches provided between the output pads adjacent to each other and between the test pad and the output pad adjacent to the test pad; and

a controller controlling the output switches and the interpad switches.

2. The semiconductor device according to claim 1 , wherein the output switches and the interpad switches include transfer gates.

3. The semiconductor device according to claim 1 , wherein in test, the controller controls all the interpad switches to ON and sequentially controls the output switches to ON so that output signals of the output circuits can be sequentially output to the test pad.

4. The semiconductor device according to claim 1 , wherein all the output circuits and the output pads corresponding thereto are divided into a plurality of groups, and each of the plurality of groups is provided with a single test pad.

5. The semiconductor device according to claim 4 , wherein the controller simultaneously tests the plurality of groups.

6. The semiconductor device according to claim 1 , wherein the test pad is arranged in line in which the input pads used in test are arranged.

7. The semiconductor device according to claim 6 , wherein the output pads are arranged at a pitch narrower than that at which the input pads used in test and the test pad are arranged.

8. The semiconductor device according to claim 1 , wherein the output circuit is a drive circuit that supplies image voltages to pixels of a liquid crystal panel.

Assignments (10)
MERGER Recorded Nov 14, 2025
From: CYPRESS SEMICONDUCTOR CORPORATION
To: INFINEON TECHNOLOGIES AMERICAS CORP.
Reel/Frame 073571/0456 →
RELEASE OF SECURITY INTEREST Recorded Mar 16, 2022
From: MUFG UNION BANK, N.A.
To: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
Reel/Frame 059410/0438 →
CORRECTIVE ASSIGNMENT TO CORRECT THE 8647899 PREVIOUSLY RECORDED ON REEL 035240 FRAME 0429. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTERST. Recorded Nov 3, 2020
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 058002/0470 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN INTELLECTUAL PROPERTY Recorded Oct 28, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MUFG UNION BANK, N.A.
Reel/Frame 050896/0366 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 1, 2015
From: SPANSION, LLC
To: CYPRESS SEMICONDUCTOR CORPORATION
Reel/Frame 036044/0122 →
SECURITY INTEREST Recorded Mar 21, 2015
From: CYPRESS SEMICONDUCTOR CORPORATION; SPANSION LLC
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 035240/0429 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 11, 2013
From: FUJITSU SEMICONDUCTOR LIMITED
To: SPANSION LLC
Reel/Frame 031205/0461 →
CHANGE OF NAME Recorded Jul 22, 2010
From: FUJITSU MICROELECTRONICS LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 024982/0245 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 11, 2008
From: FUJITSU LIMITED
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 021977/0219 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 19, 2006
From: UDO, SHINYA; KUMAGAI, MASAO; KOKUBUN, MASATOSHI; NISHIZAWA, HIDEKAZU; SHIGIHARA, TAKEO
To: FUJITSU LIMITED
Reel/Frame 018308/0096 →