IP Library Granted Patent US 7,434,464
Granted Patent B2
US 7,434,464 · App. 11/529,983 · Granted Oct 14, 2008

Methods and apparatus for a MEMS gyro sensor

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Quick Facts
Patent No.
US 7,434,464
App. No.
11/529,983
Granted
Oct 14, 2008
Kind
B2
Abstract

A gyro sensor configured to sense an angular rate about a rotational axis includes a drive mass configured to undergo oscillatory linear motion within a plane, and a sense mass configured to undergo an oscillatory motion out of the plane as a function of the angular rate. A link spring component connects the sense mass to the drive mass such that the sense mass is substantially decoupled from the drive mass with respect to the oscillatory linear motion of the drive mass, but is coupled to the drive mass with respect to the oscillatory motion out of the plane of the sense mass.

Claims (31)

1. A gyro sensor configured to sense an angular rate about a rotational axis, the gyro sensor comprising:

a drive mass configured to undergo oscillatory linear motion within a plane;

a sense mass configured to undergo an oscillatory motion out of the plane as a function of the angular rate; and

a link spring component connecting the sense mass to the drive mass such that the sense mass is substantially decoupled from the drive mass with respect to the oscillatory linear motion of the drive mass, but is substantially coupled to the drive mass with respect to the oscillatory motion out of the plane of the sense mass.

2. The gyro sensor of claim 1 , wherein the rotational axis is designated as an x-axis, and the drive mass undergoes the oscillatory linear motion substantially parallel to a y-axis perpendicular to the x-axis.

3. The gyro sensor of claim 2 , wherein the oscillatory motion out of the plane occurs along a z-axis orthogonal to the x-axis and the y-axis.

4. The gyro sensor of claim 1 , further including a coupling structure connected to The drive mass via a drive spring.

5. The gyro sensor of claim 4 , wherein the drive spring is configured such that the drive mass exhibits substantially a single oscillation frequency.

6. The gyro sensor of claim 1 , further including a drive electrode structure configured to produce, in response to an electrical signal, the oscillatory linear motion of the drive mass within the plane.

7. The gyro sensor of claim 1 , further including a sense electrode structure configured to sense the oscillatory motion out of the plane of the sense mass.

8. The gyro sensor of claim 7 , wherein the sense electrode structure includes a plurality of interdigitated capacitive pick-ups.

9. The gyro sensor of claim 8 , wherein the interdigitated capacitive pick-ups include a first set elongated pick-ups having a first thickness, and a second set of elongated pick-ups having a second thickness, wherein the first thickness and the second thickness are not equal.

10. A method for sensing an angular rate about a rotational axis, the method comprising:

providing a drive mass coupled to a sense mass via a link spring component such that the sense mass is substantially decoupled from the drive mass with respect to an oscillatory linear motion of the drive mass within a plane, but is substantially coupled to the drive mass with respect to an oscillatory motion out of the plane;

actuating the drive mass such that it undergoes the oscillatory linear motion within the plane;

sensing the oscillatory motion out of the plane of the sense mass;

determining the angular rate about the rotational axis based on the sensed oscillatory motion out of the plane of the sense mass.

11. The method of claim 1 , wherein the rotational axis is designated as an x-axis, and the drive mass undergoes the oscillatory linear motion substantially parallel to a y-axis perpendicular to the x-axis.

12. The method of claim 11 , wherein the oscillatory motion out of the plane occurs along a z-axis orthogonal to the x-axis and the y-axis.

13. The method of claim 10 , further including actuating the drive mass via a drive electrode structure configured to produce, in response to an electrical signal, the oscillatory linear motion.

14. The method of claim 10 , further including sensing the oscillatory motion out of the plane of the sense mass via a sense electrode structure.

15. The method of claim 14 , wherein the oscillatory motion out of the plane is sensed using interdigitated capacitive pick-ups that include a first set elongated pick-ups having a first thickness, and a second set of elongated pick-ups having a second thickness, where the first thickness and the second thickness are not equal.

16. A micro-electro-mechanical system (MEMS) gyro sensor configured to sense an angular rate about a rotational axis, the gyro sensor comprising:

a substantially planar drive mass configured to undergo oscillatory linear motion within a plane;

a substantially planar sense mass configured to undergo an oscillatory motion out of the plane as a function of the angular rate;

a coupling structure substantially joining the drive mass, wherein the coupling structure is connected to the planar drive mass via a coupling spring structure; and

a link spring component connecting the planar sense mass to the planar drive mass such that the planar sense mass is substantially decoupled from the planar drive mass with respect to the planar oscillatory linear motion of the planar drive mass, but is substantially coupled to the planar drive mass with respect to the oscillatory motion out of the plane of the planar sense mass.

17. The MEMS gyro sensor of claim 16 , further including a sense electrode structure configured to sense the oscillatory motion out of the plane of the planar sense mass, wherein the sense electrode structure includes a plurality of interdigitated capacitive pickups.

18. The MEMS gyro sensor of claim 17 , wherein the interdigitated capacitive pick-ups include a first set elongated pick-ups having a first thickness, and a second set of elongated pick-ups having a second thickness, wherein the first thickness is not equal to the second thickness.

19. The MEMS gyro sensor of claim 16 , wherein the sense mass includes a first pair of MEMS structures exhibiting reflectional symmetrically with respect to the rotational axis, and the drive mass includes a second pair of MEMS structure exhibiting reflectional symmetrically with respect to the rotational axis.

20. The MEMS gyro sensor of claim 16 , wherein the link spring component comprises a generally “u”-shaped MEMS connector having a major axis substantially perpendicular to the oscillatory motion of the drive mass.

Assignments (20)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 4, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: NORTH STAR INNOVATIONS INC.
Reel/Frame 037694/0264 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037518/0292 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037486/0517 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037354/0225 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037354/0807 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037356/0143 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037356/0553 →
SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031591/0266 →
SECURITY AGREEMENT Recorded Jun 18, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 030633/0424 →
SECURITY AGREEMENT Recorded May 13, 2010
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 024397/0001 →
SECURITY AGREEMENT Recorded Mar 12, 2009
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A.
Reel/Frame 022380/0409 →
SECURITY AGREEMENT Recorded Feb 2, 2007
From: FREESCALE SEMICONDUCTOR, INC.; FREESCALE ACQUISITION CORPORATION; FREESCALE ACQUISITION HOLDINGS CORP.; FREESCALE HOLDINGS (BERMUDA) III, LTD.
To: CITIBANK, N.A. AS COLLATERAL AGENT
Reel/Frame 018855/0129 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 29, 2006
From: LI, GARY G.
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 018368/0572 →