Compact LED with a self-formed encapsulating dome
View Patent ↗A light source including a die, substrate, and droplet of encapsulating material is disclosed. The die includes a semiconductor light-emitting device that is connected to first and second conducting traces on a first surface of the substrate. The droplet of encapsulate material overlies the die and is formed from a liquid precursor material that is characterized by a surface tension. The droplet has a periphery in contact with the first surface, the periphery having a shape determined by a predefined feature on the first surface and the surface tension of the liquid precursor material. The feature can include a recess in the first surface or a ring having an area that is raised above the first surface.
1. A light source comprising:
a die comprising a semiconductor light-emitting device;
a substrate comprising a first surface, said die being connected electrically to first and second conducting traces on said substrate and extending above said surface by a die height;
a droplet of encapsulate material over said die, said droplet being formed from a liquid precursor material that is characterized by a surface tension,
wherein said droplet has a periphery in contact with said first surface, said periphery having a shape determined by a feature on said first surface and said surface tension of said liquid precursor material;
wherein said feature comprises a recess in said first surface, said periphery being defined by an edge of said recess.
2. A light source comprising:
a die comprising a semiconductor light-emitting device;
a substrate comprising a first surface, said die being connected electrically to first and second conducting traces on said substrate and extending above said surface by a die height;
a droplet of encapsulate material over said die, said droplet being formed from a liquid precursor material that is characterized by a surface tension,
wherein said droplet has a periphery in contact with said first surface, said periphery having a shape determined by a feature on said first surface and said surface tension of said liquid precursor material;
wherein said feature comprises a ring surrounding said die, said periphery being defined by an edge of said ring;
wherein said ring comprises an area that is recessed below said first surface.