Semiconductor device
It is concerned in conventional semiconductor devices that a presence of a heat sink promotes propagating noise through the semiconductor chip. A semiconductor device includes a substrate, interconnects (first interconnects), interconnects (second interconnect), a semiconductor chip and a heat sink (electroconductive member). The interconnect is the interconnect that is electrically coupled to an internal interconnect of the semiconductor chip. On the contrary, the interconnect is the interconnect that is electrically coupled to a back surface (first surface) of the semiconductor chip. The interconnects are electrically insulated from the interconnects in the substrate. The semiconductor chip is provided on the substrate. A predetermined fixed potential is presented at the back surface of such semiconductor chip through the interconnect.
1 . A semiconductor device, comprising:
a substrate;
a semiconductor chip provided on said substrate;
an electroconductive member provided on a first surface of said semiconductor chip, said first surface being a surface that is an opposite side of a surface thereof facing said substrate;
a first interconnect, provided in said substrate and electrically coupled to an internal interconnect of said semiconductor chip; and
a second interconnect, provided in said substrate and electrically coupled to said first surface of said semiconductor chip,
wherein a predetermined fixed potential is applied to said first surface of said semiconductor chip through said second interconnect, and said first interconnect is electrically insulated from said second interconnect in said substrate.
2 . The semiconductor device according to claim 1 , wherein said fixed potential is ground potential.
3 . The semiconductor device according to claim 1 , wherein a thickness of said semiconductor chip is equal to or less than 300 fÊm.
4 . The semiconductor device according to claim 1 , wherein said electroconductive member covers the entire of said first surface of said semiconductor chip.
5 . The semiconductor device according to claim 1 , wherein said electroconductive member is a heat sink.
6 . The semiconductor device according to claim 5 , wherein
said heat sink is fixed to said first surface of said semiconductor chip via an electroconductive adhesive agent.
7 . The semiconductor device according to claim 1 , further comprising an electroconductive support member, said electroconductive support member being provided on said substrate and being capable of supporting said electroconductive member, wherein said fixed potential is applied to said first surface of said semiconductor chip through said second interconnect and said support member.
8 . The semiconductor device according to claim 1 , wherein said semiconductor chip is flip-chip mounted on said substrate.